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Datasheet LPS200 Equivalent ( PDF ) |
N.º | Número de pieza | Descripción | Fabricantes | |
4 | LPS200 | HIGH PERFORMANCE LOW NOISE PHEMT HIGH PERFORMANCE LOW NOISE PHEMT • FEATURES ♦ 1.0 dB Noise Figure at 18 GHz ♦ 10 dB Associated Gain at 18 GHz ♦ Low DC Power Consumption
LPS200
GATE BOND PAD (2X) SOURCE BOND PAD (2x)
DRAIN BOND PAD (2X)
DIE SIZE: 12.6X10.2mils (320x260 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS |
Filtronic Compound Semiconductors |
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3 | LPS200 | HIGH PERFORMANCE LOW NOISE PHEMT HIGH PERFORMANCE LOW NOISE PHEMT • FEATURES ♦ 1.0 dB Noise Figure at 18 GHz ♦ 10 dB Associated Gain at 18 GHz ♦ Low DC Power Consumption
LPS200
GATE BOND PAD (2X) SOURCE BOND PAD (2x)
DRAIN BOND PAD (2X)
DIE SIZE: 12.6X10.2mils (320x260 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS |
Filtronic Compound Semiconductors |
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2 | LPS200P70 | PACKAGED LOW NOISE PHEMT PACKAGED LOW NOISE PHEMT • FEATURES ♦ 0.7 dB Noise Figure at 12 GHz ♦ 12 dB Associated Gain at 12 GHz ♦ 0.6 dB Noise Figure at 2 GHz ♦ 14 dB Associated Gain at 2 GHz ♦ Low DC Power Consumption
LPS200P70
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DESCRIPTION AND APPLICATIONS The LPS200P70 is a packaged Aluminum Gallium Arse |
Filtronic Compound Semiconductors |
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1 | LPS200P70 | PACKAGED LOW NOISE PHEMT PACKAGED LOW NOISE PHEMT • FEATURES ♦ 0.7 dB Noise Figure at 12 GHz ♦ 12 dB Associated Gain at 12 GHz ♦ 0.6 dB Noise Figure at 2 GHz ♦ 14 dB Associated Gain at 2 GHz ♦ Low DC Power Consumption
LPS200P70
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DESCRIPTION AND APPLICATIONS The LPS200P70 is a packaged Aluminum Gallium Arse |
Filtronic Compound Semiconductors |
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Número de pieza | Descripción | Fabricantes | |
SPS122 | Modern EU gaming Machines require increased +12V current to accommodate the latest gaming peripherals. DC Converters have been engineered with Sanken’s latest technology to efficiently convert redundant power from our lamp gaming PSU and provide additional +12V capacity at the point of use. |
Sanken |
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