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PDF AMIS-42675 Data sheet ( Hoja de datos )
| Número de pieza | AMIS-42675 | |
| Descripción | High-Speed Low Power CAN Transceiver | |
| Fabricantes | AMI SEMICONDUCTOR | |
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AMIS-42675 High-Speed Low Power CAN Transceiver
For Long Networks
Data Sheet
1.0 General Description
The AMIS-42675 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus. It
may be used in both 12V and 24V systems. The transceiver provides differential transmit capability to the bus and differential receive
capability to the CAN controller.
The AMIS-42675 is the low power member of the CAN high-speed transceiver family and offers the following additional features:
• Ideal passive behaviour when supply voltage is removed
• Wake-up over bus
• Extremely low current standby mode
Due to the wide common-mode voltage range of the receiver inputs, the AMIS-42675 is able to reach outstanding levels of electro-
magnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the
output signals.
The AMIS-42675 is the industrial version of the AMIS-42665 and primarily for applications where long network lengths are mandatory.
Examples are elevators, in-building networks, process control and trains. To cope with the long bus delay the communication speed
needs to be low. AMIS-42675 allows low transmit data rates down 10 Kbit/s or lower.
2.0 Key Features
• Compatible with the ISO 11898 standard (ISO 11898-2, ISO 11898-5 and SAE J2284)
• Wide range of bus communication speed (0 up to 1 Mbit/s)
• Ideally suited for 12V and 24V industrial and automotive applications
• Allows low transmit data rate in networks exceeding 1 km
• Extremely low current standby mode with wake-up via the bus
• Low electromagnetic emission (EME): common-mode choke is no longer required
• Differential receiver with wide common-mode range (+/- 35V) for high EMS
• Voltage source via VSPLIT pin for stabilizing the recessive bus level (further EMC improvement)
• No disturbance of the bus lines with an un-powered node
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• Bus pins protected against transients
• Power down mode in which the transmitter is disabled
• Bus and VSPLIT pins short circuit proof to supply voltage and ground
• Logic level inputs compatible with 3.3V devices
• At least 110 nodes can be connected to the same bus
3.0 Ordering Information
Table 1: Ordering Information
Ordering Code (Tubes)
0ICAA-001-XTD
Ordering Code (Tape)
0ICAA-001-XTP
Marketing Name
AMIS 42675AGA
Package
SOIC-8 GREEN
Temp. Range
-40°C…125°C
AMI Semiconductor –October 07, Rev. 1.0
www.amis.com
Specifications subject to change without notice
1
1 page  
AMIS-42675 High-Speed Low Power CAN Transceiver
For Long Networks
8.0 Electrical Characteristics
Data Sheet
8.1 Definitions
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin;
sourcing current means the current is flowing out of the pin.
8.2 Absolute Maximum Ratings
Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for
extended periods may affect device reliability.
Table 5: Absolute Maximum Ratings
Symbol
Parameter
Conditions
VCC Supply voltage
VCANH
DC voltage at pin CANH
0 < VCC < 5.25V; no time limit
VCANL
DC voltage at pin CANL
0 < VCC < 5.25V; no time limit
VSPLIT
DC voltage at pin VSPLIT
0 < VCC < 5.25V; no time limit
VTxD
DC voltage at pin TxD
VRxD
DC voltage at pin RxD
VSTB
DC voltage at pin STB
Vtran(CANH)
Vtran(CANL)
Transient voltage at pin CANH
Transient voltage at pin CANL
Note 1
Note 1
Vtran(VSPLIT)
Transient voltage at pin VSPLIT
Note 1
Vesd(
Electrostatic discharge voltage at all pins
Note 2
Note 4
Latch-up
Static latch-up at all pins
Note 3
Tstg Storage temperature
Tamb
Ambient temperature
Tjunc
Maximum junction temperature
Notes:
1) Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4).
2) Standardized human body model electrostatic discharge (ESD) pulses in accordance to MIL883 method 3015.7.
3) Static latch-up immunity: Static latch-up protection level when tested according to EIA/JESD78.
4) Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.
Min.
-0.3
-50
-50
-50
-0.3
-0.3
-0.3
-300
-300
-300
-5
-750
-55
-40
-40
Max.
+7
+50
+50
+50
VCC + 0.3
VCC + 0.3
VCC + 0.3
+300
+300
+300
+5
+750
120
+150
+125
+170
Unit
V
V
V
V
V
V
V
V
V
V
kV
V
mA
°C
°C
°C
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8.3 Thermal Characteristics
Table 6: Thermal Characteristics
Symbol
Rth(vj-a)
Rth(vj-s)
Parameter
Thermal resistance from junction to ambient in SO8 package
Thermal resistance from junction to substrate of bare die
Conditions
In free air
In free air
Value
145
45
Unit
K/W
K/W
AMI Semiconductor –October 07, Rev. 1.0
www.amis.com
Specifications subject to change without notice
5
5 Page 
AMIS-42675 High-Speed Low Power CAN Transceiver
For Long Networks
10.0 Soldering
Data Sheet
10.1 Introduction to Soldering Surface Mount Packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for
all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards (PCBs) with
high population densities. In these situations re-flow soldering is often used.
10.2 Re-flow Soldering
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by
screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for
example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100
and 200 seconds depending on heating method. Typical re-flow peak temperatures range from 215 to 250°C. The top-surface
temperature of the packages should preferably be kept below 230°C.
10.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as
solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was
specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
• Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of
the PCB;
• Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The
footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the PCB. The footprint
must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds
at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
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Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be
soldered in one operation within two to five seconds between 270 and 320°C.
Table 9: Soldering Method
Package
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC (3) , SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Soldering Method
Wave
Not suitable
Not suitable (2)
Suitable
Not recommended (3)(4)
Not recommended (5)
Re-flow(1)
Suitable
Suitable
Suitable
Suitable
Suitable
Notes:
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the
package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to
the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
2. These packages are not suitable for wave soldering as a solder joint between the PCB and heatsink (at bottom version) can not be achieved, and as solder may stick to
the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves
downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch
(e) equal to or smaller than 0.65mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e)
equal to or smaller than 0.5mm.
AMI Semiconductor –October 07, Rev. 1.0
www.amis.com
Specifications subject to change without notice
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet AMIS-42675.PDF ] | |
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