|
|
PDF AMIS-42673 Data sheet ( Hoja de datos )
| Número de pieza | AMIS-42673 | |
| Descripción | High-Speed CAN Transceiver | |
| Fabricantes | AMI SEMICONDUCTOR | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de AMIS-42673 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
|
No Preview Available !
AMIS-42673 High Speed CAN Transceiver
For Long Networks
Data Sheet
1.0 Introduction
The AMIS-42673 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus. It
may be used in both 12V and 24V systems. The digital interface level is powered from a 3.3V supply providing true I/O voltage levels
for 3.3V CAN controllers.
The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. Due to the
wide common-mode voltage range of the receiver inputs, the AMIS-42673 is able to reach outstanding levels of electromagnetic
susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the output
signals.
The AMIS-42673 is primarily intended for applications where long network lengths are mandatory. Examples are elevators, in-building
networks, process control and trains. To cope with the long bus delay the communication speed needs to be low. AMIS-42673 allows
low transmit data rates down to 10 kbit/s or lower.
2.0 Key Features
• True 3,3V or 5,0V logic level interface
• Fully compatible with the “ISO 11898-2” standard
• Wide range of bus communication speed (0 up to 1Mbit/s)
• Allows low transmit data rate in networks exceeding 1 km
• Ideally suited for 12V and 24V applications
• Low electromagnetic emission (EME). Common-mode-choke is no longer required
• Differential receiver with wide common-mode range (+/- 35V) for high electromagnetic susceptibility (EMS)
• No disturbance of the bus lines with an un-powered node
• Thermal protection
• Bus pins protected against transients
• Short circuit proof to supply voltage and ground
• ESD protection for CAN bus at ± 8 kV
3.0 Technical Characteristics
wwTwab.Dlea1ta:STheecehtn4iUca.cl oCmharacteristics
Symbol
Parameter
VCANH
DC voltage at pin CANH
VCANL
DC voltage at pin CANL
Vi(dif)(bus_dom)
Differential bus output voltage in
dominant state
tpd(rec-dom)
Propagation delay TxD to RxD
tpd(dom-rec)
Propagation delay TxD to RxD
CM-range
Input common-mode range for
comparator
VCM-peak
Common-mode peak
VCM-step
Common-mode step
Note 1: The parameters VCM-peak and VCM-step guarantee low EME.
Conditions
0 < VCC < 5.25V; no time limit
0 < VCC < 5.25V; no time limit
42.5Ω < RLT < 60Ω
Figure 7
Figure 7
Guaranteed differential receiver
threshold and leakage current
Figure 8 and
Figure 9 (Note 1)
Figure 8 and
Figure 9 (Note 1)
4.0 Ordering Information
Min
-45
-45
1.5
100
100
-35
-500
-150
Max
+45
+45
3
230
245
+35
500
150
Unit
V
V
V
ns
ns
V
mV
mV
Ordering Code (Tubes)
0ICAG-001-XTD
Ordering Code (Tape)
0ICAG-001-XTP
Marketing Name
AMIS 42673AGA
Package
SOIC-8 GREEN
Temp. Range
-40°C…125°C
AMI Semiconductor – October 07, Rev. 1.0
www.amis.com
Specifications subject to change without notice
1
1 page  
AMIS-42673 High Speed CAN Transceiver
For Long Networks
8.0 Electrical Characteristics
Data Sheet
8.1 Definitions
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means that the current is flowing into the
pin. Sourcing current means that the current is flowing out of the pin.
8.2 Absolute Maximum Ratings
Stresses above those listed in Table 4 may cause permanent device failure. Exposure to absolute maximum ratings for extended
periods may effect device reliability.
Table 4: Absolute Maximum Ratings
Symbol
Parameter
VCC
V33
VCANH
VCANL
VTxD
VRxD
VREF
Vtran(CANH)
Vtran(CANL)
Vtran(VREF)
Vesd(CANL/CANH)
Vesd
Latch-up
Tstg
Tamb
Tjunc
Supply voltage
I/O interface voltage
DC voltage at pin CANH
DC voltage at pin CANL
DC voltage at pin TxD
DC voltage at pin RxD
DC voltage at pin VREF
Transient voltage at pin CANH
Transient voltage at pin CANL
Transient voltage at pin VREF
Electrostatic discharge voltage at
CANH and CANL pin
Electrostatic discharge voltage at all
other pins
Static latch-up at all pins
Storage temperature
Ambient temperature
Maximum junction temperature
Conditions
0 < VCC < 5.25V; no time limit
0 < VCC < 5.25V; no time limit
Note 1
Note 1
Note 1
Note 2
Note 5
Note 3
Note 5
Note 4
Min.
-0.3
-0.3
-45
-45
-0.3
-0.3
-0.3
-150
-150
-150
-8
-500
-4
-250
-55
-40
-40
Notes:
1) Applied transient waveforms in accordance with “ISO 7637 part 3”, test pulses 1, 2, 3a, and 3b (see Figure 4).
www.Da2t)aSSthaendeat4rdUiz.ecdomhuman body model system ESD pulses in accordance to IEC 1000.4.2.
3) Standardized human body model ESD pulses in accordance to MIL883 method 3015. Supply pin 8 is ±4kV.
4) Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78.
5) Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.
Max.
+7
+7
+45
+45
VCC + 0.3
VCC + 0.3
VCC + 0.3
+150
+150
+150
+8
+500
+4
+250
100
+155
+125
+150
Unit
V
V
V
V
V
V
V
V
V
V
kV
V
kV
V
mA
°C
°C
°C
8.3 Thermal Characteristics
Table 5: Thermal Characteristics
Symbol
Rth(vj-a)
Rth(vj-s)
Parameter
Thermal resistance from junction to ambient in SO8 package
Thermal resistance from junction to substrate of bare die
Conditions
In free air
In free air
Value
145
45
Unit
K/W
K/W
AMI Semiconductor – October 07, Rev. 1.0
www.amis.com
Specifications subject to change without notice
5
5 Page 
AMIS-42673 High Speed CAN Transceiver
For Long Networks
Data Sheet
10.0 Soldering
10.1 Introduction to Soldering Surface Mount Packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for
all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards (PCB) with
high population densities. In these situations re-flow soldering is often used.
10.2 Re-flow Soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by screen
printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical re-
flow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept below 230°C.
10.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as
solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was
specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of
the PCB;
o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The
footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the PCB. The footprint
must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds
at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
wwpWwah.rDteaontfautShshienegleetaa4Udd..ecCodmoicnattaecdt
time
tool,
must be
all other
limited to 10 seconds at up to 300°C.
leads can be soldered in one operation
within
two
to
five
seconds
between
270
and
320°C.
Table 9: Soldering Process
Package
Soldering Method
Wave
Re-flow(1)
BGA, SQFP
Not suitable
Suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
Not suitable (2)
Suitable
PLCC (3), SO, SOJ
Suitable
Suitable
LQFP, QFP, TQFP
Not recommended (3)(4)
Suitable
SSOP, TSSOP, VSO
Not recommended (5)
Suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the
package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to
the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
2. These packages are not suitable for wave soldering as a solder joint between the PCB and heatsink (at bottom version) can not be achieved, and as solder may stick to
the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves
downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch
(e) equal to or smaller than 0.65mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e)
equal to or smaller than 0.5mm.
AMI Semiconductor – October 07, Rev. 1.0
www.amis.com
Specifications subject to change without notice
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet AMIS-42673.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| AMIS-42670 | High-Speed CAN Transceiver |  ON Semiconductor |
| AMIS-42671 | High Speed Autobaud CAN Transceiver | ON Semiconductor |
| AMIS-42671 | High-Speed CAN Transceiver | AMI SEMICONDUCTOR |
| AMIS-42673 | High-Speed CAN Transceiver | AMI SEMICONDUCTOR |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |