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PDF AMIS-42671 Data sheet ( Hoja de datos )
| Número de pieza | AMIS-42671 | |
| Descripción | High-Speed CAN Transceiver | |
| Fabricantes | AMI SEMICONDUCTOR | |
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AMIS-42671 High-Speed CAN Transceiver
For Long Networks
Data Sheet
1.0 General Description
The AMIS-42671 CAN transceiver with autobaud is the interface between a controller area network (CAN) protocol controller and the
physical bus. It may be used in both 12V and 24V systems. The transceiver provides differential transmit capability to the bus and
differential receive capability to the CAN controller. Due to the wide common-mode voltage range of the receiver inputs, the AMIS-
42671 is able to reach outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission
(EME) is achieved by the excellent matching of the output signals.
The AMIS-42671 is primarily intended for industrial network applications where long network lengths are mandatory. Examples are
elevators, in-building networks, process control and trains. To cope with the long bus delay the communication speed needs to be low.
AMIS-42671 allows low transmit data rates down 10 Kbit/s or lower. The autobaud function allows the CAN controller to determine the
incoming baud rate without influencing the CAN communication on the bus.
2.0 Key Features
• Fully compatible with the ISO 11898-2 standard
• Autobaud function
• Wide range of bus communication speed (0 up to 1 Mbit/s)
• Allows low transmit data rate in networks exceeding 1 km
• Ideally suited for 12V and 24V industrial and automotive applications
• Low electromagnetic emission (EME) common-mode choke is no longer required
• Differential receiver with wide common-mode range (+/- 35V) for high EMS
• No disturbance of the bus lines with an un-powered node
• Thermal protection
• Bus pins protected against transients
• Silent mode in which the transmitter is disabled
• Short circuit proof to supply voltage and ground
• Logic level inputs compatible with 3.3V devices
• ESD protection for CAN bus at ± 8 kV
3.0 Technical Characteristics
www.DataSheet4U.com
Table 1: Technical Characteristics
Symbol
VCANH
VCANL
Vi(dif)(bus_dom)
tpd(rec-dom)
tpd(dom-rec)
CM-range
Parameter
DC voltage at pin CANH
DC voltage at pin CANL
Differential bus output voltage in dominant state
Propagation delay TxD to RxD
Propagation delay TxD to RxD
Input common-mode range for comparator
VCM-peak
VCM-step
Common-mode peak
Common-mode step
Conditions
0 < VCC < 5.25V; no time limit
0 < VCC < 5.25V; no time limit
42.5Ω < RLT < 60Ω
See Figure 8
See Figure 8
Guaranteed differential receiver threshold and
leakage current
See Figure 9 and Figure 10 (Notes)
See Figure 9 and Figure 10 (Notes)
Note: The parameters VCM-peak and VCM-step guarantee low electromagnetic emission.
Min.
-45
-45
1.5
70
100
-35
-500
-150
Max.
+45
+45
3
245
245
+35
500
150
Unit
V
V
V
ns
ns
V
mV
mV
4.0 Ordering Information
Ordering Code (Tubes)
0ICAB-001-XTD
Ordering Code (Tape)
0ICAB-001-XTP
Marketing Name
AMIS 42671AGA
Package
SOIC-8 GREEN
Temp. Range
-40°C…125°C
AMI Semiconductor – Oct. 07, Rev. 1.0
www.amis.com Specifications subject to change without notice
1
1 page  
AMIS-42671 High-Speed CAN Transceiver
For Long Networks
Data Sheet
7.3 High Communication Speed Range
The transceiver is primarily intended for industrial applications. It allows very low baud rates needed for long bus length applications.
But also high speed communication is possible up to 1Mbit/s.
7.4 Fail-safe Features
A current-limiting circuit protects the transmitter output stage from damage caused by an accidental short-circuit to either positive or
negative supply voltage, although power dissipation increases during this fault condition.
The pins CANH and CANL are protected from automotive electrical transients (according to “ISO 7637”; see Figure 5). Pin TxD is
pulled high internally should the input become disconnected.
8.0 Electrical Characteristics
8.1 Definitions
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin;
sourcing current means the current is flowing out of the pin.
8.2 Absolute Maximum Ratings
Stresses above those listed in the following table may cause permanent device failure. Exposure to absolute maximum ratings for
extended periods may affect device reliability.
Table 4: Absolute Maximum Ratings
Symbol
Parameter
VCC Supply voltage
VCANH
DC voltage at pin CANH
VCANL
DC voltage at pin CANL
VTxD DC voltage at pin TxD
VRxD
DC voltage at pin RxD
VAUTB
DC voltage at pin AUTB
VREF
DC voltage at pin VREF
Vtran(CANH)
Transient voltage at pin CANH
Vtran(CANL)
Transient voltage at pin CANL
wwwV.eDsdataSheet4U.comElectrostatic discharge voltage at all pins
Latch-up
Tstg
Tamb
Tjunc
Static latch-up at all pins
Storage temperature
Ambient temperature
Maximum junction temperature
Conditions
0 < VCC < 5.25V; no time limit
0 < VCC < 5.25V; no time limit
Note 1
Note 1
Note 2
Note 4
Note 3
Notes:
1.
2.
3.
4.
Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4).
Standardized human body model ESD pulses in accordance to MIL883 method 3015.7.
Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78.
Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.
Min.
-0.3
-45
-45
-0.3
-0.3
-0.3
-0.3
-150
-150
-4
-500
-55
-40
-40
Max.
+7
+45
+45
VCC + 0.3
VCC + 0.3
VCC + 0.3
VCC + 0.3
+150
+150
+4
+500
100
+155
+125
+150
Unit
V
V
V
V
V
V
V
V
V
kV
V
mA
°C
°C
°C
8.3 Thermal Characteristics
Table 5: Thermal Characteristics
Symbol
Rth(vj-a)
Rth(vj-s)
Parameter
Thermal resistance from junction to ambient in SO8 package
Thermal resistance from junction to substrate of bare die
Conditions
In free air
In free air
Value
150
45
Unit
K/W
K/W
AMI Semiconductor – Oct. 07, Rev. 1.0
www.amis.com Specifications subject to change without notice
5
5 Page 
AMIS-42671 High-Speed CAN Transceiver
For Long Networks
10.0 Soldering
Data Sheet
10.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount
ICs, or for printed circuit boards with high population densities. In these situations reflow soldering is often used.
10.2 Re-flow Soldering
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit
board by screen printing, stencilling or pressure-syringe dispensing before package placement.
Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating,
soldering and cooling) vary between 100 and 200 seconds, depending on heating method.
Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept
below 230°C.
10.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed circuit boards with a high
component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used, the following conditions must be observed for optimal results:
• Use a double-wave soldering method, comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the
printed-circuit board.
o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45 degree angle to the transport direction of the printed-
circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
ww1w0.D4aMtaaSnhueaetl4SUo.clodmering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
part of the lead. Contact time must be limited to ten seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds, between 270 and 320°C.
Table 8: Soldering
Package
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC (3) , SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Soldering Method
Wave
Not suitable
Not suitable (2)
Suitable
Not recommended (3)(4)
Not recommended (5)
Reflow (1)
Suitable
Suitable
Suitable
Suitable
Suitable
Notes:
1.
2.
3.
4.
5.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size
of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For
details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heat sink (at bottom version) can not be achieved, and
as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45 degree angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.65mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
AMI Semiconductor – Oct. 07, Rev. 1.0
www.amis.com Specifications subject to change without notice
11
11 Page | ||
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| PDF Descargar | [ Datasheet AMIS-42671.PDF ] | |
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