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PDF AMIS-30663 Data sheet ( Hoja de datos )
| Número de pieza | AMIS-30663 | |
| Descripción | High Speed CAN Transceiver | |
| Fabricantes | AMI SEMICONDUCTOR | |
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AMIS-30663 High Speed CAN Transceiver
Data Sheet
1.0 General Description
The AMIS-30663 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus and may be used in
both 12V and 24V systems. The digital interface level is powered from a 3.3V supply providing true I/O voltage levels for 3.3V CAN controllers.
The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. Due to the wide common-mode
voltage range of the receiver inputs, the AMIS-30663 is able to reach outstanding levels of electromagnetic susceptibility. Similarly, extremely low
electromagnetic emission is achieved by the excellent matching of the output signals.
2.0 Key Features
• Fully compatible with the "ISO 11898-2" standard
• Certified "Authentication on CAN Transceiver Conformance (d1.1)"
• High speed (up to 1Mbit/s)
• Ideally suited for 12V and 24V industrial and automotive applications
• Low electromagnetic mission (EME) common-mode-choke is no longer required
• Differential receiver with wide common-mode range (+/- 35V) for high electro magnetic susceptibility (EMS)
• No disturbance of the bus lines with an un-powered node
• Transmit data (TxD) dominant time-out function
• Thermal protection
• Bus pins protected against transients in an automotive environment
• Short circuit proof to supply voltage and ground
• Logic level inputs compatible with 3.3V devices
• ESD protection level for CAN bus up to ±8kV
3.0 Technical Characteristics
Table 1: Technical Characteristics
Symbol
Parameter
VCANH
DC voltage at pin CANH
VCANL DC voltage at pin CANL
Vi(dwif)(bwus_wdom.D) ataSheet4DUi.fcfeormential bus output voltage in dominant
state
tpd(rec-dom)
Propagation delay TxD to RxD
tpd(dom-rec)
Propagation delay TxD to RxD
CM-range
Input common-mode range for comparator
VCM-peak
Common-mode peak
VCM-step
Common-mode step
Note: The parameters VCM-peak and VCM-step guarantee low EME.
Conditions
0 < VCC < 5.25V; no time limit
0 < VCC < 5.25V; no time limit
42.5W < RLT < 60W
See Figure 7
See Figure 7
Guaranteed differential receiver threshold and leakage current
See Figure 8 and 9 (Note)
See Figure 8 and 9 (Note)
Min.
-45
-45
1.5
100
100
-35
-500
-150
Max.
+45
+45
3
230
245
+35
500
150
Unit
V
V
V
ns
ns
V
mV
mV
4.0 Ordering Information
Marketing Name
AMIS 30663NGA
Package
SOIC-8 GREEN
Temp. Range
-40°C...125°C
AMI Semiconductor - Rev. 1.4, Oct. 04
www.amis.com
1
1 page  
AMIS-30663 High Speed CAN Transceiver
Data Sheet
8.0 Electrical Characteristics
8.1 Definitions
All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means that the current is flowing into the pin. Sourcing
current means that the current is flowing out of the pin.
8.2 Absolute Maximum Ratings
Stresses above those listed in Table 4 may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may effect device
reliability.
Table 4: Absolute Maximum Ratings
Symbol
VCC
V33
VCANH
VCANL
VTxD
VRxD
VREF
Vtran(CANH)
Vtran(CANL)
Vtran(VREF)
V )esd(CANL/CANH
Vesd
Latch-up
Tstg
Tamb
Tjunc
Parameter
Supply voltage
I/O interface voltage
DC voltage at pin CANH
DC voltage at pin CANL
DC voltage at pin TxD
DC voltage at pin RxD
DC voltage at pin VREF
Transient voltage at pin CANH
Transient voltage at pin CANL
Transient voltage at pin VREF
Electrostatic discharge voltage
at CANH and CANL pin
Electrostatic discharge voltage
at all other pins
Static latch-up at all pins
Storage temperature
Ambient temperature
Maximum junction temperature
Conditions
0 < VCC < 5.25V; no time limit
0 < VCC < 5.25V; no time limit
Note 1
Note 1
Note 1
Note 2
Note 5
Note 3
Note 5
Note 4
Notes
1) Applied transient waveforms in accordance with "ISO 7637 part 3", test pulses 1, 2, 3a, and 3b (see Figure 4).
2) Standardized human body model system ESD pulses in accordance to IEC 1000.4.2
3) Standardized human body model ESD pulses in accordance to MIL883 method 3015. Supply pin 8 is ±4kV
4) Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78.
5) Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.
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8.3 Thermal Characteristics
Table 5: Thermal Characteristics
Symbol
Rth(vj-a)
Rth(vj-s)
Parameter
Thermal resistance from junction to ambient in SO8 package
Thermal resistance from junction to substrate of bare die
Min.
-0.3
-0.3
-45
-45
-0.3
-0.3
-0.3
-150
-150
-150
-8
-500
-4
-250
-55
-40
-40
Max.
+7
+7
+45
+45
VCC + 0.3
VCC + 0.3
VCC + 0.3
+150
+150
+150
+8
+500
+4
+250
100
+155
+125
+150
Unit
V
V
V
V
V
V
V
V
V
V
kV
V
kV
V
mA
°C
°C
°C
Conditions
In free air
In free air
Value
145
45
Unit
K/W
K/W
AMI Semiconductor - Rev. 1.4, Oct. 04
www.amis.com
5
5 Page 
AMIS-30663 High Speed CAN Transceiver
Data Sheet
10.0 Soldering
10.1 Introduction to Solering Surface Mount Package
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS "Data Handbook IC26;
Integrated Circuit Packages" (document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-
circuit boards with high population densities. In these situations reflow soldering is often used.
10.2 Reflow Soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen
printing, stencilling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept below 230°C.
10.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as
solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
° Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed circuit board;
° Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printedcircuit board. The footprint must
incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the printed circuit board. The footprint
mwwuwst.DinactoaSrphoereatt4eUs.cooldmer thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer
or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
AMI Semiconductor - Rev. 1.4, Oct. 04
www.amis.com
11
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