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PDF AMIS-30660 Data sheet ( Hoja de datos )
| Número de pieza | AMIS-30660 | |
| Descripción | High Speed CAN Transceiver | |
| Fabricantes | AMI SEMICONDUCTOR | |
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AMIS-30660 High Speed CAN Transceiver
Data Sheet
1.0 Key Features
• Fully compatible with the “ISO 11898-2” standard
• Certified “Authentication on CAN Transceiver
Conformance (d1.1)”
• High speed (up to 1 Mbaud)
• Ideally suited for 12V and 24V industrial and automotive
applications
• Low Electromagnetic Emission (EME) common-mode-
choke is no longer required
• Differential receiver with wide common-mode range for
high Electro Magnetic Susceptibility (EMS) (+/- 35V)
2.0 General Description
The AMIS-30660 CAN transceiver is the interface between a
Controller Area Network (CAN) protocol controller and the
physical bus and may be used in both 12V and 24V systems.
The transceiver provides differential transmit capability to
the bus and differential receive capability to the CAN
• No disturbance of the bus lines with an unpowered node
• Transmit data (TXD) dominant time-out function
• Thermal protection
• Bus pins protected against transients in an automotive
environment
• Power down mode in which the transmitter is disabled
• Input levels compatible with 3.3V devices
• Short-circuit proof to supply voltage & ground
controller. Due to the wide common mode voltage range of
the receiver inputs, the AMIS-30660 is able to reach
outstanding levels of electromagnetic susceptibility.
Similarly, extremely low electromagnetic emission is
achieved by the excellent matching of the output signals.
3.0 Important Characteristics
Symbol
Parameter
VCANH
DC voltage at pin CANH
VCANL
DC voltage at pin CANL
Vi(dif)(bus_dom) Differential bus output voltage
Tpd(rec-dom) Propagation delay TxD to RxD
& Tpd(dom-rec)
CM-range
Input common-mode range
www.DataSheet4U.comfor comparator
VCM-peak
VCM-step
Common-mode peak
Common-mode step
Conditions
0<VCC<5.25 V; no time limit
0<VCC<5.25 V; no time limit
Dominant 42.5 Ω <RLT<60 Ω
See Fig. 7
Min
-45*
-45*
1.5
70
Guaranteed differential receiver
threshold and leakage current -35
See Fig. 8 & Fig. 9 (Note)
-500
See Fig. 8 & Fig. 9 (Note)
-150
Note : The parameters VCM-peak and VCM-step guarantee low electromagnetic emission.
* -85V min & +60V max also possible, please contact your local sales representative for details.
Max
+45*
+45*
3
245
+35
500
150
Unit
V
V
V
ns
V
mV
mV
4.0 Ordering Information
Part N° AMIS-30660
Package SO-8
Temp. Range -40°C…125°C
AMI Semiconductor
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1 page  
AMIS-30660 High Speed CAN Transceiver
Data Sheet
7.0 Functional Description
The AMIS-30660 is the interface between the CAN protocol
controller and the physical bus. It is intended for use in
automotive and industrial applications requiring baud rates
up to 1 Mbaud. It provides differential transmit capability to
the bus and differential receiver capability to the CAN
protocol controller. It is fully compatible to the “ISO 11898-
2” standard.
A current-limiting circuit protects the transmitter output
stage from damage caused by accidental short-circuit to
either positive or negative supply voltage, although power
dissipation increases during this fault condition.
A thermal protection circuit protects the IC from damage
by switching off the transmitter if the junction temperature
exceeds a value of approximately 160°C. Because the
transmitter dissipates most of the power, the power
dissipation and temperature of the IC is reduced. All other
IC functions continue to operate. The transmitter off-state
resets when pin TXD goes HIGH. The thermal protection
circuit is particularly needed when a bus line short-circuits.
The pins CANH and CANL are protected from automotive
electrical transients (according to “ISO 7637”; see Fig.4).
Control pin S allows two operating modes to be selected:
high-speed mode or silent mode.
The high-speed mode is the normal operating mode and is
selected by connecting pin S to ground. It is the default
mode if pin S is not connected.
In the silent mode, the transmitter is disabled. All other IC
functions continue to operate. The silent mode is selected
by connecting pin S to VCC and can be used to prevent
network communication from being blocked, due to a CAN
controller which is out of control.
A ‘TXD dominant time-out’ timer circuit prevents the bus
lines being driven to a permanent dominant state (blocking
all network communication) if pin TXD is forced
permanently LOW by a hardware and/or software
application failure. The timer is triggered by a negative
edge on pin TXD. If the duration of the LOW-level on pin
TXD exceeds the internal timer value, the transmitter is
disabled, driving the bus into a recessive state. The timer is
reset by a positive edge on pin TXD.
Table 1: Function table of the CAN transceiver; X = don’t care
VCC
4.75 to 5.25V
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4.75 to 5.25V
VCC<PORL
(POR-level;
not powered)
PORL <VCC < 4.75V
TXD
0
X
1 (or floating)
X
>2V
S
0 (or floating)
1
X
CANH
HIGH
0.5VCC
0.5VCC
X 0V < VCANH <VCC
X 0V < VCANH <VCC
CANL
LOW
0.5VCC
0.5VCC
BUS State
Dominant
Recessive
Recessive
RXD
0
1
1
0V <VCANL <VCC
0V <VCANL <VCC
Recessive
Recessive
1
1
AMI Semiconductor
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5 Page 
AMIS-30660 High Speed CAN Transceiver
Data Sheet
Suitability of surface mount IC packages for wave and reflow soldering methods
Package
BGA, SQFP
HLQFP, HSQFP,
HSOP, HTSSOP, SMS
PLCC (3) , SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Soldering Method
Wave
Not suitable
Not suitable (2)
Suitable
Not recommended (3)(4)
Not recommended (5)
Reflow (1)
Suitable
Suitable
Suitable
Suitable
Suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive.
Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the
package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them
(the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a
solder joint between the printed-circuit board and heatsink (at
bottom version) can not be achieved, and as solder may stick
to the heatsink (on top version).
3. If wave soldering is considered, then the package must be
placed at a 45º angle to the solder wave direction. The
package footprint must incorporate solder thieves downstream
and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP
packages with a pitch (e) equal to or larger than 0.8mm; it is
definitely not suitable for packages with a pitch (e) equal to
or smaller than 0.65mm.
5. Wave soldering is only suitable for SSOP and TSSOP
packages with a pitch (e) equal to or larger than 0.65mm; it is
definitely not suitable for packages with a pitch (e) equal to
or smaller than 0.5mm.
Revision Number
Version 1
Revision 1.1
Revision 1.2
Changes on page
1 and 6
8
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© Copyright 2003 AMI Semiconductor – All rights reserved. Information furnished is believed to be accurate and reliable. However, AMI Semiconductor assumes no responsibility for errors or omissions in the information and for the
consequences of use of such information. AMI Semiconductor reserves the right to change the information contained herein at any time without notice.
This information is provided “AS IS” without warranty of any kind, either expressed or implied, including, but not limited to, the implied warranties of merchantability, fitness for a particular purpose, or non-infringement of intellectual
property.
All title and intellectual property rights including, without limitation, copyrights, trademarks, in and to this information and products are owned by AMI Semiconductor, and are protected by applicable laws. No license under any patent
or other intellectual property of AMI Semiconductor is granted, by implication, estoppel or otherwise.
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