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PDF AMIS-30623 Data sheet ( Hoja de datos )
| Número de pieza | AMIS-30623 | |
| Descripción | Micro-stepping Motor Driver | |
| Fabricantes | ON Semiconductor | |
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AMIS-30623
Micro-stepping Motor Driver
INTRODUCTION
The AMIS−30623 is a single−chip micro−stepping motordriver with
position controller and control/diagnostic interface. It is ready to build
dedicated mechatronics solutions connected remotely with a LIN master.
The chip receives positioning instructions through the bus and
subsequently drives the motor coils to the desired position. The
on−chip position controller is configurable (OTP or RAM) for
different motor types, positioning ranges and parameters for speed,
acceleration and deceleration. The AMIS−30623 acts as a slave on the
LIN bus and the master can fetch specific status information like
actual position, error flags, etc. from each individual slave node.
An integrated sensor−less step−loss detection prevents the
positioner from loosing steps and stops the motor when running into
stall. This enables silent, yet accurate position calibrations during a
referencing run and allows semi−closed loop operation when
approaching the mechanical end−stops.
The chip is implemented in I2T100 technology, enabling both high
voltage analog circuitry and digital functionality on the same chip.
The AMIS−30623 is fully compatible with the automotive voltage
requirements.
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SOIC−20
8 or 9 SUFFIX
CASE 751AQ
PRODUCT FEATURES
Motordriver
• Micro−stepping Technology
• Sensorless Step−loss Detection
• Peak Current up to 800 mA
• Fixed Frequency PWM Current−control
• Automatic Selection of Fast and Slow Decay Mode
• No external Fly−back Diodes Required
• Compliant with 14 V Automotive Systems and
Industrial Systems up to 24 V
• Motion Qualification Mode (Note 1)
Controller with RAM and OTP Memory
• Position Controller
• Configurable Speeds and Acceleration
• Input to Connect Optional Motion Switch
LIN Interface
• Physical Layer Compliant to LIN rev. 2.0. Data−link
Layer Compatible with LIN rev. 1.3 (Note 2)
• Field−programmable Node Addresses
• Dynamically Allocated Identifiers
• Diagnostics and Status Information
Protection
• Overcurrent Protection
• Undervoltage Management
NQFP−32
A or B SUFFIX
CASE 560AA
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
• Open−circuit Detection
• High Temperature Warning and Management
• Low Temperature Flag
• LIN Bus Short−circuit Protection to Supply and Ground
• Lost LIN Safe Operation
Power Saving
• Powerdown Supply Current < 100 mA
• 5 V Regulator with Wake−up On LIN Activity
EMI Compatibility
• LIN Bus Integrated Slope Control
• HV Outputs with Slope Control
Patents
• US 7,271,993
• US 7,288,956
• This is a Pb−Free Device
1. Not applicable for “Product Versions AMIS30623C6238(R)G, AMIS30623C623B(R)G”
2. Minor exceptions to the conformance of the data−link layer to LIN rev. 1.3.
© Semiconductor Components Industries, LLC, 2009
May, 2009 − Rev. 7
1
Publication Order Number:
AMIS−30623/D
1 page  
AMIS−30623
PACKAGE THERMAL RESISTANCE
The AMIS−30623 is available in SOIC−20 and optimized
NQFP−32 packages. For cooling optimizations, the NQFP
has an exposed thermal pad which has to be soldered to the
PCB ground plane. The ground plane needs thermal vias to
conduct the head to the bottom layer. Figures 3 and 4 give
examples for good power distribution solutions.
For precise thermal cooling calculations the major
thermal resistances of the devices are given. The thermal
media to which the power of the devices has to be given are:
• Static environmental air (via the case)
• PCB board copper area (via the device pins and
exposed pad)
The thermal resistances are presented in Table 5: DC
Parameters.
The major thermal resistances of the device are the Rth
from the junction to the ambient (Rthja) and the overall Rth
from the junction to the leads (Rthjp).
The NQFP device is designed to provide superior thermal
performance. Using an exposed die pad on the bottom
surface of the package is mainly contributing to this
performance. In order to take full advantage of the exposed
pad, it is most important that the PCB has features to conduct
heat away from the package. A thermal grounded pad with
thermal vias can achieve this.
In the table below, one can find the values for the Rthja and
Rthjp, simulated according to the JESD−51 norm:
Package
SOIC−20
Rth
Junction−to−Leads and
Exposed Pad − Rthjp
Rth
Junction−to−Leads
Rthjp
19
NQFP−32
0,95
The Rthja for 2S2P is simulated conform to JESD−51 as
follows:
• A 4−layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
• Board thickness is 1.46 mm (FR4 PCB material)
• The 2 signal layers: 70 mm thick copper with an area of
5500 mm2 copper and 20% conductivity
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Figure 3. Example of SOIC−20 PCB Ground Plane
Layout (preferred layout at top and bottom)
Rth
Junction−to−Ambient
Rthja (1S0P)
62
60
Rth
Junction−to−Ambient
Rthja (2S2P)
39
30
• The 2 power internal planes: 36 mm thick copper with
an area of 5500 mm2 copper and 90% conductivity
The Rthja for 1S0P is simulated conform to JESD−51 as
follows:
• A 1−layer printed circuit board with only 1 layer
• Board thickness is 1.46 mm (FR4 PCB material)
• The layer has a thickness of 70 mm copper with an area
of 5500 mm2 copper and 20% conductivity
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎNQFÎÎÎÎÎÎÎP−3ÎÎÎÎÎÎÎÏÏÏ2 ÎÎÎÎÎÎÎÏÏÏÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Figure 4. Example of NQFP−32 PCB Ground Plane
Layout (preferred layout at top and bottom)
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5
5 Page 
AMIS−30623
Minimum Velocity
Once the maximum velocity is chosen, 16 possible values can be programmed for the minimum velocity Vmin. The table
below provides the obtainable values in full−step/s. The accuracy of Vmin is derived from the internal oscillator.
Table 8. OBTAINABLE VALUES IN FULL−STEP/s FOR THE MINIMUM VELOCITY
Vmax (Full−step/s)
Vmin Index Vmax A
Hex Dec Factor 99
B CD
136 167 197 213 228 243 273 303 334 364 395 456 546 729
0 0 1 99 136 167 197 213 228 243 273 303 334 364 395 456 546 729
1 1 1/32 3 4 5 6 6 7 7 8 8 10 10 11 13 15 19
2 2 2/32 6 8 10 11 12 13 14 15 17 19 21 23 27 31 42
3 3 3/32 9 12 15 18 19 21 22 25 27 31 32 36 42 50 65
4 4 4/32 12 16 20 24 26 28 30 32 36 40 44 48 55 65 88
5 5 5/32 15 21 26 31 32 35 37 42 46 51 55 61 71 84 111
6 6 6/32 18 25 31 36 39 42 45 50 55 61 67 72 84 99 134
7 7 7/32 21 30 36 43 46 50 52 59 65 72 78 86 99 118 156
8 8 8/32 24 33 41 49 52 56 60 67 74 82 90 97 113 134 179
9 9 9/32 28 38 47 55 59 64 68 76 84 93 101 111 128 153 202
A 10 10/32 31 42 51 61 66 71 75 84 93 103 113 122 141 168 225
B 11 11/32 34 47 57 68 72 78 83 93 103 114 124 135 156 187 248
C 12 12/32 37 51 62 73 79 85 91 101 113 124 135 147 170 202 271
D 13 13/32 40 55 68 80 86 93 98 111 122 135 147 160 185 221 294
E 14 14/32 43 59 72 86 93 99 106 118 132 145 158 172 198 237 317
F 15 15/32 46 64 78 93 99 107 113 128 141 156 170 185 214 256 340
NOTES: The Vmax factor is an approximation.
In case of motion without acceleration (AccShape = 1) the length of the steps = 1/Vmin. In case of accelerated motion
(AccShape = 0) the length of the first step is shorter than 1/Vmin depending of Vmin, Vmax and Acc.
973
973
27
57
88
118
149
179
210
240
271
301
332
362
393
423
454
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11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet AMIS-30623.PDF ] | |
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