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PDF AMIS-30622 Data sheet ( Hoja de datos )
| Número de pieza | AMIS-30622 | |
| Descripción | Micro-Stepping Motor Driver | |
| Fabricantes | ON Semiconductor | |
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AMIS-30622
I2C Micro-Stepping Motor
Driver
INTRODUCTION
The AMIS−30622 is a single−chip micro−stepping motor driver
with a position controller and control/diagnostic interface. It is ready
to build intelligent peripheral systems where up to 32 drivers can be
connected to one I2C master. This significantly reduces system
complexity.
The chip receives positioning instructions through the bus and
subsequently drives the stator coils so the two−phase stepper motor
moves to the desired position. The on−chip position controller is
configurable (OTP or RAM) for different motor types, positioning
ranges and parameters for speed, acceleration and deceleration.
Micro−stepping allows silent motor operation and increased
positioning resolution. The advanced motion qualification mode
enables verification of the complete mechanical system in function of
the selected motion parameters. The AMIS−30622 can easily be
connected to an I2C bus where the I2C master can fetch specific status
information like actual position, error flags, etc. from each individual
slave node.
The chip is implemented in I2T100 technology, enabling both high
voltage analog circuitry and digital functionality on the same chip.
http://onsemi.com
SOIC−20
3 or 7 SUFFIX
CASE 751AQ
PRODUCT FEATURES
Motor Driver
• Micro−Stepping Technology
• Peak Current Up to 800 mA
• Fixed Frequency PWM Current−Control
• Automatic Selection of Fast and Slow Decay Mode
• No external Fly−back Diodes Required
• 14 V/24 V Compliant
NQFP−32
8 SUFFIX
CASE 560AA
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Controller with RAM and OTP Memory
• Position Controller
• Configurable Speeds and Acceleration
• Input to Connect Optional Motion Switch
I2C Interface
• Bi−Directional 2−Wire Bus for Inter IC Control
• Field Programmable Node Addresses
• Full Diagnostics and Status Information
Protection
• Overcurrent Protection
• Undervoltage Management
• Open−circuit Detection
• High Temperature Warning and Management
• Low Temperature Flag
EMI Compatibility
• High Voltage Outputs with Slope Control
• This is a Pb−Free Device
© Semiconductor Components Industries, LLC, 2013
July, 2013 − Rev. 5
1
Publication Order Number:
AMIS−30622/D
1 page  
AMIS−30622
PACKAGE THERMAL RESISTANCE
The AMIS−30622 is available in SOIC−20 or optimized
NQFP−32 packages. For cooling optimizations, the NQFP
has an exposed thermal pad which has to be soldered to the
PCB ground plane. The ground plane needs thermal vias to
conduct the head to the bottom layer. Figures 3 and 4 give
examples for good power distribution solutions.
For precise thermal cooling calculations the major
thermal resistances of the devices are given. The thermal
media to which the power of the devices has to be given are:
• Static environmental air (via the case)
• PCB board copper area (via the device pins and
exposed pad)
The thermal resistances are presented in Table 5: DC
Parameters.
The major thermal resistances of the device are the Rth
from the junction to the ambient (Rthja) and the overall Rth
from the junction to the leads (Rthjp).
The NQFP device is designed to provide superior thermal
performance. Using an exposed die pad on the bottom
surface of the package is mainly contributing to this
performance. In order to take full advantage of the exposed
pad, it is most important that the PCB has features to conduct
heat away from the package. A thermal grounded pad with
thermal vias can achieve this.
In the table below, one can find the values for the Rthja and
Rthjp, simulated according to the JESD−51 norm:
Package
SOIC−20
NQFP−32
Rth
Junction−to−Leads and
Exposed Pad − Rthjp
0,95
Rth
Junction−to−Leads
Rthjp
19
The Rthja for 2S2P is simulated conform to JESD−51 as
follows:
• A 4−layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
• Board thickness is 1.46 mm (FR4 PCB material)
• The 2 signal layers: 70 mm thick copper with an area of
5500 mm2 copper and 20% conductivity
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Figure 3. Example of SOIC−20 PCB Ground Plane
Layout (preferred layout at top and bottom)
Rth
Junction−to−Ambient
Rthja (1S0P)
62
60
Rth
Junction−to−Ambient
Rthja (2S2P)
39
30
• The 2 power internal planes: 36 mm thick copper with
an area of 5500 mm2 copper and 90% conductivity
The Rthja for 1S0P is simulated conform to JESD−51 as
follows:
• A 1−layer printed circuit board with only 1 layer
• Board thickness is 1.46 mm (FR4 PCB material)
• The layer has a thickness of 70 mm copper with an area
of 5500 mm2 copper and 20% conductivity
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎNQFÎÎÎÎÎÎÎP−3ÎÎÎÎÎÎÎÏÏÏ2 ÎÎÎÎÎÎÎÏÏÏÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Figure 4. Example of NQFP−32 PCB Ground Plane
Layout (preferred layout at top and bottom)
http://onsemi.com
5
5 Page 
AMIS−30622
POSITIONING PARAMETERS
Stepping Modes
One of four possible stepping modes can be programmed:
• Half−stepping
• 1/4 micro−stepping
• 1/8 micro−stepping
• 1/16 micro−stepping
Maximum Velocity
For each stepping mode, the maximum velocity Vmax can
be programmed to 16 possible values given in the table below.
The accuracy of Vmax is derived from the internal
oscillator. Under special circumstances it is possible to
change the Vmax parameter while a motion is ongoing. All
16 entries for the Vmax parameter are divided into four
groups. When changing Vmax during a motion the
application must take care that the new Vmax parameter
stays within the same group.
Table 7. MAXIMUM VELOCITY SELECTION TABLE
Vmax Index
Vmax
Hex Dec (full step/s) Group
00
99
A
11
136
22
167
33
44
197
213
B
55
228
66
243
77
273
88
303
99
A 10
334
364
C
B 11
395
C 12
456
D 13
546
E 14
729
D
F 15
973
Half−stepping
(half−step/s)
197
273
334
395
425
456
486
546
607
668
729
790
912
1091
1457
1945
Stepping Mode
1/4th
Micro−stepping
(micro−step/s)
1/8th
Micro−stepping
(micro−step/s)
395 790
546 1091
668 1335
790 1579
851 1701
912 1823
973 1945
1091
2182
1213
2426
1335
2670
1457
2914
1579
3159
1823
3647
2182
4364
2914
5829
3891
7782
1/16th
Micro−stepping
(micro−step/s)
1579
2182
2670
3159
3403
3647
3891
4364
4852
5341
5829
6317
7294
8728
11658
15564
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11
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| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet AMIS-30622.PDF ] | |
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