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PDF LT3014B Data sheet ( Hoja de datos )
| Número de pieza | LT3014B | |
| Descripción | 3V to 80V Low Dropout Micropower Linear Regulator | |
| Fabricantes | Linear Technology | |
| Logotipo |  |
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FEATURES
■ Wide Input Voltage Range: 3V to 80V
■ Low Quiescent Current: 7µA
■ Low Dropout Voltage: 350mV
■ Output Current: 20mA
■ LT3014BHV Survives 100V Transients (2ms)
■ No Protection Diodes Needed
■ Adjustable Output from 1.22V to 60V
■ Stable with 0.47µF Output Capacitor
■ Stable with Aluminum, Tantalum or Ceramic
Capacitors
■ Reverse-Battery Protection
■ No Reverse Current Flow from Output
■ Thermal Limiting
■ Available in 5-Lead ThinSOTTM and
8-Lead DFN Packages
U
APPLICATIO S
■ Low Current High Voltage Regulators
■ Regulator for Battery-Powered Systems
■ Telecom Applications
■ Automotive Applications
TYPICAL APPLICATIO
VIN
5.4V TO
80V
5V Supply
IN OUT
LT3014B
1µF
ADJ
GND
3.92M
VOUT
5V
20mA
0.47µF
1.27M
3014 TA01
LT3014B
20mA, 3V to 80V
Low Dropout Micropower
Linear Regulator
DESCRIPTIO
The LT®3014B is a high voltage, micropower low dropout
linear regulator. The device is capable of supplying 20mA
of output current with a dropout voltage of 350mV. De-
signed for use in battery-powered or high voltage sys-
tems, the low quiescent current (7µA operating) makes
the LT3014B an ideal choice. Quiescent current is also well
controlled in dropout.
Other features of the LT3014B include the ability to oper-
ate with very small output capacitors. The regulators are
stable with only 0.47µF on the output while most older
devices require between 10µF and 100µF for stability.
Small ceramic capacitors can be used without the neces-
sary addition of ESR as is common with other regulators.
Internal protection circuitry includes reverse-battery pro-
tection, current limiting, thermal limiting and reverse
current protection.
The device is available as an adjustable device with a 1.22V
reference voltage. The LT3014B regulator is available in
the 5-lead ThinSOT and 8-lead DFN packages.
, LTC and LT are registered trademarks of Linear Technology Corporation. ThinSOT is
a trademark of Linear Technology Corporation. All other trademarks are the property of
their respective owners. Protected by U.S. Patents including 6118263, 6144250.
Dropout Voltage
400
350
300
250
200
150
100
50
0
0 2 4 6 8 10 12 14 16 18 20
OUTPUT CURRENT (mA)
3014 TA02
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LT3014B
TYPICAL PERFOR A CE CHARACTERISTICS
Reverse Output Current
8
VIN = 0V
7 VOUT = VADJ = 1.22V
6
5
4
3
2
1
0
– 50 – 25
0 25 50 75
TEMPERATURE (°C)
100 125
3014 G16
Minimum Input Voltage
3.5
ILOAD = 20mA
3.0
2.5
2.0
1.5
1.0
0.5
0
–50 –25
0 25 50 75
TEMPERATURE (°C)
100 125
3014 G19
Input Ripple Rejection
72
VIN = 7V + 0.5VP-P
70 RIPPLE AT f = 120Hz
IL = 20mA
68
66
64
62
60
58
56
– 50 – 25
0 25 50 75
TEMPERATURE (°C)
100 125
3014 G17
Load Regulation
0
∆IL = 100µA TO 20mA
–5 VOUT = 1.22V
–10
–15
–20
–25
–30
–35
–40
– 50 – 25
0 25 50 75
TEMPERATURE (°C)
100 125
3014 G20
Input Ripple Rejection
80
VIN = 7V + 50mVRMS RIPPLE
70 IL = 20mA
60
50
40 COUT = 4.7µF
30
20
10 COUT = 0.47µF
0
10 100 1k 10k 100k 1M
FREQUENCY (Hz)
3014 G18
Output Noise Spectral Density
10
COUT = 0.47µF
IL = 20mA
VOUT = 1.22V
1
0.1
0.01
10
100 1k
10k
FREQUENCY (Hz)
100k
3014 G21
10Hz to 100kHz Output Noise
Transient Response
VOUT
200µV/DIV
COUT = 0.47µF
IL = 20mA
VOUT = 1.22V
1ms/DIV
3014 G22
0.04
0.02
0
–0.02
–0.04
6
4
2
0
0
VIN = 7V
VOUT = 5V
CIN = COUT = 0.47µF CERAMIC
∆ILOAD = 1mA TO 5mA
200 400 600 800 1000
TIME (µs)
3014 G23
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PACKAGE DESCRIPTIO
0.62 0.95
MAX REF
S5 Package
5-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1635)
1.22 REF
2.90 BSC
(NOTE 4)
3.85 MAX 2.62 REF
1.4 MIN
2.80 BSC
1.50 – 1.75
(NOTE 4)
LT3014B
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
0.20 BSC
DATUM ‘A’
PIN ONE
0.95 BSC
0.80 – 0.90
1.00 MAX
0.30 – 0.45 TYP
5 PLCS (NOTE 3)
0.01 – 0.10
0.30 – 0.50 REF
0.09 – 0.20
NOTE:
(NOTE 3)
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
0.675 ±0.05
1.90 BSC
S5 TSOT-23 0302
R = 0.115
TYP
5
0.38 ± 0.10
8
3.5 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
PACKAGE
OUTLINE
0.25 ± 0.05
0.50
BSC
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
3.00 ±0.10
(4 SIDES)
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
0.00 – 0.05
4
0.25 ± 0.05
(DD8) DFN 1203
1
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3014bf
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11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LT3014B.PDF ] | |
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