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PDF TZA3050 Data sheet ( Hoja de datos )

Número de pieza TZA3050
Descripción 30 Mbits/s up to 1.25 Gbits/s Burst Mode Laser Driver
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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No Preview Available ! TZA3050 Hoja de datos, Descripción, Manual

INTEGRATED CIRCUITS
DATA SHEET
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TZA3050
30 Mbits/s up to 1.25 Gbits/s
burst mode laser driver
Product specification
Supersedes data of 2002 Nov 06
2003 Mar 26

1 page




TZA3050 pdf
Philips Semiconductors
30 Mbits/s up to 1.25 Gbits/s
burst mode laser driver
Product specification
TZA3050
6 PINNING
SYMBOL
GND
VCCA
VCCD
DIN
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TEST
CIN
CINQ
GND
ALRESET
ENABLE
ALOP
ALMON
MAXOP
VTEMP
MAXMON
RREF
PWA
GND
LAQ
LAQ
LA
LA
GND
BIAS
VCCO
MON
BIASIN
BIASOUT
MODIN
CBIAS
i.c.
AVR
PIN
die pad
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
DESCRIPTION
common ground plane for VCCA, VCCD, VCCO, RF and I/O; must be connected to ground
analog supply voltage
digital supply voltage
non-inverted data input (RF input)
inverted data input (RF input)
test pin; must be connected to ground
non-inverted clock input (RF input)
inverted clock input (RF input)
ground
alarm reset input for alarm outputs ALMON and ALOP
enable input for modulation and bias current switch on and off between bursts
alarm output on operating current (open-drain)
alarm output on monitor diode current (open-drain)
threshold level input for alarm on operating current
temperature dependent voltage output
threshold level input for alarm on monitor diode current
reference current input; must be connected to ground with an accurate (1%) 10 kresistor
pulse width adjustment input
ground
inverted laser modulation output (RF output); output for dummy load
inverted laser modulation output (RF output); output for dummy load
non-inverted laser modulation output (RF output); output for laser
non-inverted laser modulation output (RF output); output for laser
ground
current source output for the laser bias current
supply voltage for the output stage and the laser diode
input from the monitor photodiode (RF input)
input for the bias current setting
output of the control block for the bias current
input for the modulation current setting
output of the average loop; must be connected via a 100 nF external capacitor to GND
internally connected
input for the optical average power level setting
2003 Mar 26
5

5 Page





TZA3050 arduino
Philips Semiconductors
30 Mbits/s up to 1.25 Gbits/s
burst mode laser driver
Product specification
TZA3050
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
Alarm reset: pin ALRESET
VIL
LOW-level input voltage
no reset
VIH HIGH-level input voltage reset
Rpd(int)
internal pull-down
resistance
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Alarm operating current: pins MAXOP and ALOP
−−
2.0
10
0.8 V
V
k
Vref(MAXOP)
reference voltage on
pin MAXOP
IMAXOP = 10 to 200 µA
1.15 1.2
1.25 V
NMAXOP
VD(ALOP)L
ratio of Ioper(alarm) and
IMAXOP
Ioper(alarm) = 7.5 to 150 mA
drain voltage at active alarm IALOP = 500 µA
0
775
0.4 V
Alarm monitor current: pins MAXMON and ALMON
Vref(MAXMON) reference voltage on
pin MAXMON
IMAXMON = 10 to 200 µA
1.15 1.2
1.25 V
NMAXMON
VD(ALMON)L
ratio of IMON(alarm) and
IMAXMON
IMON(alarm) = 150 to 3000 µA
drain voltage at active alarm IALMON = 500 µA
0
15
0.4 V
Reference block: pins RREF and VTEMP
VRREF
VVTEMP
reference voltage
temperature dependent
voltage
RRREF = 10 k(1%);
CRREF < 100 pF
Tj = 25 °C; CVTEMP < 2 nF;
note 4
1.15
1.14
1.20
1.20
1.25 V
1.27 V
TCVTEMP
Isource(VTEMP)
temperature coefficient of
VVTEMP
source current of
pin VTEMP
Tj = 25 to + 125 °C; note 4
2.2
mV/K
1 mA
Isink(VTEMP)
sink current of pin VTEMP
1
mA
Notes
1. The total power dissipation Ptot is calculated with VBIAS = VCCO = 3.3 V and IBIAS = 20 mA. In the application VBIAS
will be VCCO minus the laser diode voltage which results in a lower total power dissipation.
2. The specification of the offset voltage is guaranteed by design.
3. The relation between the sink current Io(LA) and the modulation current Imod is: lo(LA) = Imod × 1----0---0-----1+---0--Z--0--L---(--L--A----) where
ZL(LA) is the external load on pin LA. The voltage on pin MODIN programmes the modulation current Imod. This current
is divided between ZL(LA) and the 100 internal resistor connected to pins LA. When the modulation current is
programmed to 100 mA, a typical ZL(LA) of 25 will result in an Io(LA) current of 80 mA, while 20 mA flows via the
internal resistor. This corresponds to a voltage swing of 2 V on the real application load.
4. VVTEMP = 1.31 + TCVTEMP × Tj and Tj = Tamb + Ptot × Rth(j-a).
2003 Mar 26
11

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