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PDF AMS302T Data sheet ( Hoja de datos )
| Número de pieza | AMS302T | |
| Descripción | (AMSxxxT) Light Sensor | |
| Fabricantes | Panasonic | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de AMS302T (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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Light Sensor (AMS1, 3, 4)
Cadmium-free sensor
with spectral response
LIGHT SENSOR
Chip type ideal for brightness
adjustment of mobile device displays
• SMD type
L 2.0mm .079inch
W 3.2mm .126inch
H 1.0mm .039inch
14
Amplifier
12 Anode
2 3 34 Cathode
• Through-hole type
www.DataSheet4U.com
5.0 mm dia.
.197 inch dia.
(Surface of resin)
1 Amplifier 2
New
1 Anode
2 Cathode
• Chip type
L 1.25mm .049inch
W 2.00mm .079inch
H 0.55mm .022inch
FEATURES
1. Built-in optical filter for spectral
response similar to that of the human
eye.
1.0
SMD/Through-hole type spectral
0.9 Chip type spectral
0.8 Human spectral
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
300 400 500 600 700 800 900 1000 1100
Wavelength, nm
2. Photocurrent is proportional to
illumination. (linear output)
3. Uses environmentally friendly
silicon chips.
4. Lead-free.
5. Lineup of 3 different shapes
• SMD type for easy automatic mounting
• Lead type same as CdS cell
(photoconductive cell)
• Chip type that achieves miniaturization
TYPICAL APPLICATIONS
SMD and Through-hole types
1. Brightness detection for LCD
backlight control for LCD devices
(LCD TVs, car navigation systems, and
mobile PCs).
2. Brightness detection for circuits in
residential lighting, lighting for
security, and automatic lighting for
bicycle.
3. Household applicances (day/night
energy savings for air conditioners
and electric hot water pots, etc.)
4. Brightness detection for wall clocks
(radio clocks).
Chip type
1. Brightness detection for LCD
backlight control for compact mobile
devices (mobile phones and PDAs).
2. Brightness detection for controlling
the keypad backlight in mobile
phones.
1 Amplifier 2
1 Anode (–)
2 Cathode (+)
RoHS Directive compatibility information
http://www.mew.co.jp/ac/e/environment/
TYPES
Packing quantity: Tape and reel package SMD type:
Inner 3,000 pcs., Outer 3,000 pcs.
Tape and reel package Through-hole type: Inner 2,000 pcs., Outer 2,000 pcs.
Baggage package Through-hole type: Inner 500 pcs., Outer 1,000 pcs.
Tape and reel package Chip type: Inner 3,000 pcs., Outer 3,000 pcs.
Type (shape)
SMD type
Through-hole type
Photo current
260 µA*
Tape and reel package
AMS104Y
AMS302T
Part No.
Baggage package
—
AMS302
New
Chip type
20 µA*
AMS402Y
—
Notes: *Ev = 100 lx (Ev: Brightness, Fluorescent lamp is used as light source)
Tape and reel package is standard packaging style for SMD and chip types. (“Y” and “T” at end of part number indicate packaging type.)
All Rights Reserved © COPYRIGHT Matsushita Electric Works, Ltd.
New
1 page  
SAFETY PRECAUTIONS
Be sure to obey the following in order to
prevent injuries and accidents.
• Do not use the sensors under
conditions that exceed the range of its
specifications. It may cause
overheating, smoke, or fire.
Light Sensor (AMS1, 3, 4)
• Connect terminals correctly by verifying
the pin layout with the specifications
diagram or other instructions.
Erroneous connections may lead to
unexpected operating errors,
overheating, smoke, or fire.
• For an impotant and serious application
in terms of safety, add protection circuit
or any other protection method.
CAUTIONS FOR USE
1. Applying stress that exceeds the
absolute maximum rating
If the voltage or current value for any of
the terminals exceeds the absolute
maximum rating, internal elements will
deteriorate because of the excessive
voltage or current. In extreme cases,
wiring may melt, or silicon P/N junctions
may be destroyed.
Therefore the design should ensure that
www.tDhaetaaSbhseoeltu4tUe.cmoamximum ratings will never
be exceeded, even momentarily.
2. Deterioration and destruction
caused by discharge of static
electricity
This phenomenon is generally called
static electricity destruction. Static
electricity generated by various factors
flows through the terminal and occurs to
destroy internal elements. To prevent
problems from static electricity, the
following precautions and measures
should be taken when using your device.
1) Person handling sensor should wear
anti-static clothing and should be
grounded through protective resistance
of 500 kΩ to 1 MΩ.
2) A conductive metal sheet should be
placed over the work table. Measuring
instruments and jigs should be grounded.
3) When using soldering irons, either use
irons with low leakage current, or ground
the tip of the soldering iron. (Use of low-
voltage soldering irons is also
recommended.)
4) Devices and equipment used in
assembly should also be grounded.
5) When packing printed circuit boards
and equipment, avoid using high-polymer
materials such as foam styrene, plastic,
and other materials which carry an
electrostatic charge.
6) When storing or transporting sensor,
the environment should not be generated
static electricity (for instance, the
humidity should be between 45 and
60%), and sensor should be protected
using conductive packing materials.
3. Just after supplying voltage, please
note that current in the sensor will be
not constant until internal circuit
stability.
4. Storage
The sensors are transparent plastic
packages. They are sensitive to moisture
and come in moisture-proof packages.
Observe the following cautions when
storing.
1) After the moisture-proof package is
unsealed, take the sensors out of storage
as soon as possible (within 1 week
30°C/60% R.H.).
2) If the devices are to be left in storage
for a considerable period after the
moisture-proof package has been
unsealed, it is recommended to keep
them in another moisture-proof bag
containing silica gel (within 3 months at
the most).
3) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
• Temperature: 0 to 30°C 32 to 86°F
• Humidity: Less than 60% R.H.
(Avoid freezing and condensing)
• Atomosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
*When mounting with solder, if thermal
stress is applied to sensors that have
absorbed moisture, the moisture will
vaporize, swelling will occur, and the
inside of the package will become
stressed. This may cause the package
surface to blister or crack. Therefore,
please take caution and observe the
soldering conditions in the following
section.
5. Recommended soldering
conditions
<SMD/Chip type>
1) Recommended condition
(1) IR (Infrared reflow) soldering method
T3
T2
T1
t1 t2
T1 = 150 to 180°C 302 to 356°F
T2 = 230°C 446°F
T3 = 250°C 482°F or less
t1 = 60 to 120 s or less
t2 = 30 s or less
(2) Soldering iron method
Tip temperature: 350 to 400°C 662 to
752°F
Wattage: 30 to 60 W
Soldering time: within 3 s
*We don’t recommend soldering iron
method for chip type.
2) Do not do flow soldering.
<Through-hole type>
1) Recommended condition
(1) Double wave soldering method
T2
T1
t1 t2 t3
T1 = 120°C 248°F
T2 = 260°C 500°F or less
t1 = 120 s or less
t2+t3= 6 s or less
(2) Soldering iron method
Tip temperature: 350 to 400°C 662 to
752°F
Wattage: 30 to 60 W
Soldering time: within 3 s
2) The soldered position on leads should
not be closer than 3mm .118inch to the
molding resin of this sensor.
6. Notes for mounting
1) Temperature rise in the lead portion is
highly dependent on package size.
If multiple different packages are
mounted on the same board, please
check your board beforehand in an actual
product, ensuring that the temperature of
the solder area of the sensor terminals
falls within the temperature conditions of
item 5.
2) If the mounting conditions exceed the
recommended solder conditions in item
5, resin strength will fall and the
mismatching of the heat expansion
coefficient of each constituent material
will increase markedly, possibly causing
cracks in the package, disconnections of
bonding wires, and the like. For this
reason, please inquire with us about
whether this use is possible.
5
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| PDF Descargar | [ Datasheet AMS302T.PDF ] | |
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