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PDF ALN0925 Data sheet ( Hoja de datos )

Número de pieza ALN0925
Descripción Low Noise Amplifier
Fabricantes ETC 
Logotipo ETC Logotipo



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U.comFeatures
t4· 37.5 dB Gain at 925 MHz
ee· 19 dBm P1dB
h· 35 dBm Output IP3
S· 1.1 dB Noise Figure
ta· Operating at Single 5 V Supply
www.Da· 80 mA Current Consumption
Description
The plerowTM ALN-series is the compactly designed sur-
face-mount module for the use of the LNA with or without
the following gain blocks in the infrastructure equipment of
the mobile wirelss (CDMA, GSM, PCS, PHS, WCDMA,
DMB, WLAN, WiBro, WiMAX), GPS, satellite communica-
tion terminals and so on. It has an exceptional performance
of low noise figure, high gain, high OIP3, and low bias cur-
rent. The stability factor is always kept less than unity over
the application band in order to confirm its unconditionally
stable implementation to the application system environ-
ment. The surface-mount module package including the
completed matching circuit and other components neces-
PlerowTM ALN0925
Low Noise Amplifier
Specifications
sary just in case allows very simple and convenient imple-
mentation onto the system board in mass production level.
mParameter
Unit
Specification
oFrequency Range
.cGain
Gain Flatness
UNoise Figure
Output IP3
t4S11 / S22
Output P1dB
eSupply Current
eSupply Voltage
Impedance
hMax. RF Input Power
@ CDMA 20FA
SPackage Type & Size
MHz
dB
dB
dB
dBm
dB
dBm
mA
V
dBm
mm
890 ~ 960
37.5
± 0.5
1.1
35
-14 / -14
19
80
5
50
5
SMT, 13Wx13Lx3.8H
1) Measurement conditions are as follows: T = 25°C, VCC = 5 V, Freq. = 925 MHz, 50 ohm system.
ta2) OIP3 is measured with two tones at an output power of 10 dBm / tone separated by 1 MHz.
3) Note: We recommend that the VSWR toward a source and load be less than 1:4 to avoid an unwanted oscillation.
aOutline Drawing
2-stage Single Type
More Information
Website: www.asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
ApLwleNrowww.DASB Inc.
Pin Number
3
8
10
Function
RF In
RF Out
+Vcc
TOP
BOTTOM
SIDE
: Soldering area
:φ0.4 plated thru holes to
ground plane
(Unit: mm)
1/4
SUGGESTED FOOTPRINT
www.asb.co.kr
Others
Ground
U.comNote: 1. The number and size of ground via holes in
t4a circuit board is critical for thermal RF
grounding considerations.
e2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
ebetter RF and thermal performance, as
hshown in the drawing at the left side.
www.DataS August 2005

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