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PDF CX77304-17 Data sheet ( Hoja de datos )
| Número de pieza | CX77304-17 | |
| Descripción | PA Module for Tri-Band EGSM DCS PCS / GPRS | |
| Fabricantes | Skyworks Solutions | |
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DATA SHEET
CX77304-17 PA Module for Tri-band EGSM DCS PCS / GPRS
Applications
• Tri-band cellular handsets
encompassing
- Class 4 EGSM900
- Class 1 DCS1800
- PCS1900, and
- Up to Class 10 GPRS
multi-slot operation
Features
• High efficiency
- EGSM 55%
- DCS 50%
- PCS 45%
• Input/output matching
- 50 Ω internal
• Small outline
- 9.1 mm × 11.6 mm
• Low profile
- 1.5 mm
• Low APC current
- 10 µA typical
• Gold plated, lead-free
contacts
Description
The CX77304-17 Power Amplifier Module (PAM) is designed in a compact form factor for tri-band
cellular handsets comprising EGSM900, DCS1800, and PCS1900 operation. It also supports Class 10
General Packet Radio Service (GPRS) multi-slot operation.
The PAM consists of an EGSM900 PA block, a DCS1800/PCS1900 PA block, impedance-
matching circuitry for 50 Ω input and output, and bias control circuitry. Two separate Heterojunction
Bipolar Transistor (HBT) PA blocks are fabricated on a single Gallium Arsenide (GaAs) die. One PA
block operates in the EGSM900 band and the other PA block supports both the DCS1800 and the
PCS1900 bands. Optimized for lithium ion battery operation, both PA blocks share common power
supply pins to distribute current. A custom CMOS integrated circuit provides the internal interface
circuitry, including a current amplifier that minimizes the required power control current (IAPC) to 10
µA, typical. The GaAs die, the Silicon (Si) die, and passive components are mounted on a multi-layer
laminate substrate. The assembly is encapsulated with plastic overmold.
The RF input and output ports are internally matched to 50 Ω to reduce the number of external
components for a tri-band design. Extremely low leakage current (2 µA, typical) of the dual PA module
maximizes handset standby time. The CX77304-17 also contains band-select switching circuitry to
select EGSM (logic 0) and DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In
the block diagram shown below, the BS pin selects the PA output (DCS/PCS OUT or EGSM OUT) while
the Analog Power Control (APC) controls the level of output power.
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101943B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • July 29, 2004
1
1 page  
PA MODULE FOR TRI-BAND EGSM DCS PCS / GPRS
DATA SHEET • CX77304-17
Parameter
Frequency range
Input power
Analog power control voltage
Power Added Efficiency
Harmonics
Output power
Table 3. CX77304-17 Electrical Specifications (1) (3 of 6)
DCS1800 Mode (f = 1710 to 1785 MHz and PIN = 6 to 11 dBm)
Symbol
Test Condition
Minimum
f — 1710
PIN — 6
VAPC POUT = 29.5 dBm
1.35
VCC = 3.5 V
POUT ≥ 32 dBm
PAE
VAPC ≈ 2.0 V
pulse width 577 µs
duty cycle 1:8
TCASE = +25 °C
45
VCC = 3.5 V
POUT ≥ 32 dBm
VAPC ≈ 2.0 V
PAE_LOW INPUT pulse width 577 µs
duty cycle 1:8
TCASE = +25 °C
PIN = 4 dBm
—
2nd 2f0
3rd to 7th 3f0 to 7f0
BW = 3 MHz
5 dBm ≤ POUT ≤ 32 dBm
0 °C ≤ TCASE ≤ +90 °C
2.9 V ≤ VCC ≤ 4.0 V
—
—
VCC = 3.5 V
POUT VAPC ≈ 2.0 V
TCASE = +25 °C
32.0
POUT_MAX
VCC = 3.5 V
VAPC ≈ 2.0 V
TCASE = +25 °C
PIN = 4 dBm
—
POUT_MAX
VCC = 2.9 V
VAPC ≤ 2.6 V
TCASE = –20 °C to +100 °C
(See Table 2 for multislot)
PIN = 6 dBm
29.5
POUT_MAX
VCC = 4.8 V
VAPC ≤ 2.6 V
TCASE = –20 °C to +100 °C
(See Table 2 for multislot)
PIN = 6 dBm
29.5
Typical
—
—
1.7
50
49
—
—
32.5
32.1
30.5
30.5
Maximum
1785
11
2.1
—
—
–5
–7
—
—
—
—
Units
MHz
dBm
V
%
dBm
dBm
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101943B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • July 29, 2004
5
5 Page 
PA MODULE FOR TRI-BAND EGSM DCS PCS / GPRS
DATA SHEET • CX77304-17
Pin Name
1 GND
2 DCS/PCS_IN
3 GND
4 EGSM_IN
5 GND
6 VCC1
7 GND
8 VCC2
Table 4. CX77304-17 Signal Description
Description
Pin Name
Ground
9 GND
RF input to DCS/PCS PA
10 EGSM_OUT
Ground
11 GND
RF input to EGSM PA
12 DCS/PCS_OUT
Ground
13 GND
Power supply for PA driver stages
14 APC
Ground
15 GND
Power supply for PA output stages
16 BS
Description
Ground
EGSM RF output (DC coupled)
Ground
DCS/PCS RF output (DC coupled)
Ground
Analog Power Control
Ground
Band Select
Figure 5. CX77304-17 Pin Configuration—16-Pin Leadless PAM
(Top View)
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The CX77304-17 is capable of withstanding an MSL 3/240 °C
solder reflow. Care must be taken when attaching this product,
whether it is done manually or in a production solder reflow
environment. If the part is attached in a reflow oven, the
temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 240 °C. If the part is
manually attached, precaution should be taken to insure that the
part is not subjected to temperatures exceeding 240 °C for more
than 10 seconds. For details on both attachment techniques,
precautions, and handling procedures recommended by
Skyworks, please refer to Skyworks Application Note: PCB Design
and SMT Assembly/Rework, Document Number 101752.
Figure 6. Typical Case Markings
Additional information on standard SMT reflow profiles can also
be found in the JEDEC Standard J–STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel, Document Number 101568.
Electrostatic Discharge Sensitivity
The CX77304-17 is a Class I device. Figure 7 lists the
Electrostatic Discharge (ESD) immunity level for each pin of the
CX77304-17 product. The numbers in Figure 7 specify the ESD
threshold level for each pin where the I-V curve between the pin
and ground starts to show degradation. The ESD testing was
performed in compliance with MIL-STD-883E Method 3015.7
using the Human Body Model. If ESD damage threshold
magnitude is found to consistently exceed 2000 volts on a given
pin, this so is indicated. If ESD damage threshold below 2000
volts is measured for either polarity, numbers are indicated that
represent worst case values observed in product characterization.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101943B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • July 29, 2004
11
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet CX77304-17.PDF ] | |
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