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PDF CX77304-16 Data sheet ( Hoja de datos )

Número de pieza CX77304-16
Descripción PA Module for Tri-Band EGSM DCS PCS / GPRS
Fabricantes Skyworks Solutions 
Logotipo Skyworks Solutions Logotipo



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DATA SHEET
CX77304-16 PA Module for Tri-Band EGSM DCS PCS / GPRS
Applications
Tri-band cellular handsets
encompassing
- Class 4 EGSM900
- Class 1 DCS1800
- PCS1900, and
- Up to Class 10 GPRS
multislot operation
Features
High efficiency
- EGSM 55%
- DCS 50%
- PCS 45%
Input/output internally
matched to 50
Small outline
- 9.1 mm × 11.6 mm
Low profile
- 1.5 mm
Low APC current
- 10 µA typical
Gold plated, lead-free
contacts
Description
The CX77304-16 Power Amplifier Module (PAM) is designed in a compact form factor for tri-band
cellular handsets comprising EGSM900, DCS1800, and PCS1900 operation. It also supports Class 10
General Packet Radio Service (GPRS) multislot operation.
The PAM consists of separate Heterojunction Bipolar Transistor (HBT) PA blocks for EGSM900 and
DCS1800/PCS1900 PA bands, interface circuitry, and RF input and output ports internally matched to
50 W to reduce the number of external components. The PA blocks are fabricated on a single Gallium
Arsenide (GaAs) die. Optimized for lithium ion battery operation, both PA blocks share common power
supply pins to distribute current. Extremely low leakage current (2 µA, typical) of the dual PAM
maximizes handset standby time.
The CX77304-16 also contains band-select switching circuitry to select EGSM (logic 0) and DCS/PCS
(logic 1) as determined from the Band Select (BS) signal. In the block diagram shown below, the BS
pin selects the PA output (DCS/PCS OUT or EGSM OUT) while the Analog Power Control (APC) controls
the level of output power.
A custom CMOS integrated circuit provides the internal interface circuitry including a current amplifier
that minimizes the required power control current (IAPC) to 10 µA, typical. The GaAs die, the Silicon
(Si) die, and passive components are mounted on a multi-layer laminate substrate and the assembly
encapsulated with plastic overmold.
Figure 1. Functional Block Diagram
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101944B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • July 28, 2004
1

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CX77304-16 pdf
PA MODULE FOR TRI-BAND EGSM DCS PCS / GPRS
DATA SHEET • CX77304-16
Parameter
Frequency range
Input power
Analog power control voltage
Leakage current
Power Added Efficiency
Harmonics
Output power
Table 3. CX77304-16 Electrical Specifications (1) (3 of 6)
DCS1800 Mode (f = 1710 to 1785 MHz and PIN = 6 to 11 dBm)
Symbol
Test Condition
Minimum
f — 1710
PIN — 6
VAPC POUT = 29.5 dBm
1.35
VCC = 4.5 V
IQ
VAPC = 0.3 V
TCASE = +25 °C
No RF input
VCC = 3.5 V
POUT 32 dBm
PAE
VAPC 2.0 V
pulse width 577 µs
42
duty cycle 1:8
TCASE = +25 °C
PAE_LOW INPUT
VCC = 3.5 V
POUT 32 dBm
VAPC 2.0 V
pulse width 577 µs
duty cycle 1:8
TCASE = +25 °C
PIN = 4 dBm
2nd and 3rd 2f0, 3f0
BW = 3 MHz
5 dBm POUT 32 dBm
VCC= 3.5 V
TCASE = +25 °C
4th to 7th 4f0 to 7f0
BW = 3 MHz
5 dBm POUT 32 dBm
VCC = 3.5 V
POUT VAPC 2.0 V
TCASE = +25 °C
32.0
POUT_MAX LOW INPUT
VCC = 3.5 V
VAPC 2.0 V
TCASE = +25 °C
PIN = 4 dBm
POUT_MAX LOW VOLTAGE
VCC = 2.9 V
VAPC 2.6 V
TCASE = –20 °C to +100 °C
(See Table 2 for multislot)
PIN = 6 dBm
29.5
POUT_MAX HIGH VOLTAGE
VCC = 4.8 V
VAPC 2.6 V
TCASE = –20 °C to +100 °C
(See Table 2 for multislot)
PIN = 6 dBm
29.5
Typical
1.7
45
49
32.5
32.1
30.5
30.5
Maximum
1785
11
2.1
5
0
–7
Units
MHz
dBm
V
µA
%
dBm
dBm
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101944B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • July 28, 2004
5

5 Page





CX77304-16 arduino
PA MODULE FOR TRI-BAND EGSM DCS PCS / GPRS
DATA SHEET • CX77304-16
Pin Name
1 GND
2 DCS/PCS_IN
3 GND
4 EGSM_IN
5 GND
6 VCC1
7 GND
8 VCC2
Table 4. CX77304-16 Signal Description
Description
Pin Name
Ground
9 GND
RF input to DCS/PCS PA
10 EGSM_OUT
Ground
11 GND
RF input to EGSM PA
12 DCS/PCS_OUT
Ground
13 GND
Power supply for PA driver stages
14 APC
Ground
15 GND
Power supply for PA output stages
16 BS
Description
Ground
EGSM RF output (DC coupled)
Ground
DCS/PCS RF output (DC coupled)
Ground
Analog Power Control
Ground
Band Select
Figure 5. CX77304-16 Pin Configuration—16-Pin Leadless PAM
(Top View)
Figure 6. Typical Case Markings
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The CX77304-16 is capable of withstanding an MSL 3/240 °C
solder reflow. Care must be taken when attaching this product,
whether it is done manually or in a production solder reflow
environment. If the part is attached in a reflow oven, the
temperature ramp rate should not exceed 5 °C per second;
maximum temperature should not exceed 240 °C. If the part is
manually attached, precaution should be taken to insure that the
part is not subjected to temperatures exceeding 240 °C for more
than 10 seconds. For details on both attachment techniques,
precautions, and handling procedures recommended by
Skyworks, please refer to Skyworks Application Note: PCB Design
and SMT Assembly/Rework, Document Number 101752.
Additional information on standard SMT reflow profiles can also
be found in the JEDEC Standard J–STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format shown in Figure 7. For packaging details,
refer to Skyworks Application Note: Tape and Reel, Document
Number 101568.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
101944B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • July 28, 2004
11

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