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PDF CM1692 Data sheet ( Hoja de datos )
| Número de pieza | CM1692 | |
| Descripción | L-C LCD and Camera EMI Filter Array | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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CM1692
Praetorian) L-C LCD and
Camera EMI Filter Array
with ESD Protection
Features
• Four, Six and Eight Channels of EMI Filtering with Integrated
ESD Protection
• Pi−Style EMI Filters in a Capacitor−Inductor−Capacitor (C−L−C)
Network
• ±15 kV ESD Protection on Each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
• Greater than 30 dB Attenuation (Typical) at 1 GHz
• 0.50 mm Thick mDFN Package with 0.40 mm Lead Pitch:
♦ 4−channel = 8−lead mDFN
♦ 6−channel = 12−lead mDFN
♦ 8−channel = 16−lead mDFN
• Tiny mDFN Package Size:
♦ 8−lead: 1.70 mm x 1.35 mm
♦ 12−lead: 2.50 mm x 1.35 mm
♦ 16−lead: 3.30 mm x 1.35 mm
• These Devices are Pb−Free and are RoHS Compliant
Applications
• LCD and Camera Data Lines in Mobile Handsets
• Wireless Handsets
• LCD and Camera Modules
http://onsemi.com
UDFN8
DE SUFFIX
CASE 517BC
UDFN12
DE SUFFIX
CASE 517BD
UDFN16
DE SUFFIX
CASE 517BE
ELECTRICAL SCHEMATIC
Filter
+
ESDn*
17 nH
12 pF
12 pF
Filter
+
ESDn*
GND
1 of 4, 6 or 8 EMI/RFI Filter Channels
with Integrated ESD Protection
* See Package/Pinout Diagrams for expanded pin information.
MARKING DIAGRAM
P92 MG
G
1
P926 MG
G
1
P928 MG
G
1
P92
P926
P928
M
G
= CM1692−04DE
= CM1692−06DE
= CM1692−08DE
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
CM1692−04DE
CM1692−06DE
CM1692−08DE
Package
mDFN−8
(Pb−Free)
mDFN−12
(Pb−Free)
mDFN−16
(Pb−Free)
Shipping†
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
April, 2011 − Rev. 4
1
Publication Order Number:
CM1692/D
1 page  
CM1692
PACKAGE DIMENSIONS
UDFN8, 1.7x1.35, 0.4P
CASE 517BC−01
ISSUE O
D
2X
0.10 C
PIN ONE
REFERENCE
2X
ÉÉÉÉ
0.10 C
TOP VIEW
0.05 C
DETAIL B
A
B
E
A
8X 0.05 C
NOTE 4
A1
SIDE VIEW
EXPOSED Cu
MOLD CMPD
ÇÉÇÉA1 A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
(A3)
L1
L
C
SEATING
PLANE
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
L A3 0.13 REF
b 0.15 0.25
D 1.70 BSC
D2 1.10 1.30
E 1.35 BSC
E2 0.30 0.50
e 0.40 BSC
K 0.15 −−−
L 0.20 0.30
L1 −−− 0.05
DETAIL A
8X L
D2
1
E2
8X K
8
e
e/2
8X b
0.10
0.05
CAB
C NOTE 3
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
1.40
8X
0.40
1.55
0.50
8X
0.25
1
0.40 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet CM1692.PDF ] | |
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