Datasheet SL2ICS2001DW Equivalent ( PDF )

N.º	Número de pieza	Descripción	Fabricantes	PDF
1	SL2ICS2001DW	I-CODE SLI Label IC bumped wafer specification on UV-tape SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 150030 Product data sheet addendum PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on FFC with UV-tape of	NXP Semiconductors

SL2ICS200 Datasheet ( Hoja de datos ) - resultados coincidentes

Número de pieza	Descripción	Fabricantes	PDF
SL2ICS2001DW	I-CODE SLI Label IC bumped wafer specification on UV-tape SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 150030 Product data sheet addendum PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on	NXP Semiconductors
SL2ICS2001V1D	I-CODE SLI Label IC bumped wafer specification on UV-tape SL2ICS2001DW/V1D I-CODE SLI Label IC bumped wafer specification on UV-tape Rev. 3.0 — 5 February 2008 150030 Product data sheet addendum PUBLIC 1. General description This specification describes the electrical, physical and dimensional properties of Au-bumped sawn wafers on	NXP Semiconductors

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Número de pieza	Descripción	Fabricantes	PDF
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