Datasheet PM300CSE060 Equivalent ( PDF )

N.º	Número de pieza	Descripción	Fabricantes	PDF
1	PM300CSE060	FLAT-BASE TYPE INSULATED PACKAGE MITSUBISHI MITSUBISHI MODULES> PM300CSE060 PM300CSE060 FLAT-BASE FLAT-BASE TYPE TYPE INSULATED INSULATED PACKAGE PACKAGE PM300CSE060 FEATURE a) Adopting new 4th generation planar IGBT chip, which performance is improved by 1µm fine rule process. For	Mitsubishi Electric Semiconductor

PM300CSE Datasheet ( Hoja de datos ) - resultados coincidentes

Número de pieza	Descripción	Fabricantes	PDF
PM300CSE060	FLAT-BASE TYPE INSULATED PACKAGE MITSUBISHI MITSUBISHI MODULES> PM300CSE060 PM300CSE060 FLAT-BASE FLAT-BASE TYPE TYPE INSULATED INSULATED PACKAGE PACKAGE PM300CSE060 FEATURE a) Adopting new 4th generation planar IGBT chip, which performance is improved by 1µm fi	Mitsubishi Electric Semiconductor

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