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PDF LV5695P Data sheet ( Hoja de datos )
| Número de pieza | LV5695P | |
| Descripción | System Power Supply IC | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de LV5695P (archivo pdf) en la parte inferior de esta página. Total 14 Páginas | ||
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Ordering number : ENA1972B
LV5695P
Bi-CMOS IC
System Power Supply IC
for Automotive Infotainment
Multiple Output Linear
Voltage Regulator
http://onsemi.com
Overview
The LV5695P is a multiple output linear regulator IC, which allows reduction of quiescent current. The LV5695P is
specifically designed to address automotive infotainment systems power supply requirements. The LV5695P integrates
5 linear regulator outputs, 2 high side power switches, over current protection, overvoltage protection and thermal
shutdown circuitry.
Function
• Quiescent current 50μA (Typ. when only VDD is in operation)
• Five channel regulator
For VDD: VOUT is 5.0V/3.3V(Operation always),
IOmax is 300mA
For SWD5V: VOUT is 5.0V, IOmax is 500mA
For CD: VOUT is 8.0V, IOmax is 2000mA
For illumination: VOUT is 8.5V, IOmax is 500mA
For audio systems: VOUT is 8.45V, IOmax is 800mA
• Two high side switch:
AMP: Voltage difference between input and output is 0.5V,
IOmax is 500mA
ANT: Voltage difference between input and output is 0.5V,
IOmax is 350mA
• Over current protector
• Overvoltage protector (Without VDD-OUT) Clamp voltage is 28V (typical)
• Thermal Shut down 175ºC (typical)
• Pch-LDMOS is used for power output block.
HZIP15J
(Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the
conditions out of safety range or ratings. Use of the IC such as use under over current protection range or thermal shutdown state may
degrade the IC’s reliability and eventually damage the IC.
ORDERING INFORMATION
See detailed ordering and shipping information on page 14 of this data sheet.
Semiconductor Components Industries, LLC, 2014
March, 2014
32414NK/O2611SY 20111018-S00003/82411SY 20110718-S00006 No.A1972-1/14
1 page  
LV5695P
• Allowable power dissipation derating curve
Pd max -- Ta
8 Aluminum heat sink mounting conditions
tightening torque : 39N⋅cm, using silicone grease
7
6 Aluminum heat sink (50 × 50 × 1.5mm3) when using
5.6
5
4
3
2 Independent IC
1.5
1
0
0 20 40 60 80 100 120
Ambient temperature, Ta -- °C
140 150 160
• Waveform applied during surge test
50V
90%
10%
16V
5msec
100msec
No.A1972-5/14
5 Page 
Example of applied circuit
LV5695P
2 4 6 8 10 12 14
1 3 5 7 9 11 13 15
C9
+
C10
+
C12 + C11 C16 + C15
C2 + C1
C4 + C3
CTRL1
C6 + C5
CTRL2
C8 + C7
CTRL3
D2
D3
D4 R1 C14 + C13
VDD
D5 D1
ILM
CD
AUDIO
SWD
ANT AMP
VCC
Peripheral parts list
Name of part
Description
Recommended value
Remarks
C2, C4, C6, C8, C12
C1, C3, C5, C7, C11
C14, C16
C13, C15
Output stabilization capacitor
Output stabilization capacitor
Power supply bypass capacitor
Oscillation prevention capacitor
10μF or more*
0.22μF or more*
100μF or more
0.22μF or more
Electrolytic capacitor
Ceramic capacitor
These capacitors must be placed near
the VCC and GND pins.
C9, C10
R1
D1
AMP/ANT output stabilization capacitor
Resistance for protection
Diode for prevention of backflow
2.2μF or more
10 to 100kΩ
D2, D3, D4, D5
Diode for internal element protection
SB1003M3
note)The circuit diagram and the values are only tentative which are subject to change.
* : Make sure that the capacitors of the output pins are 10μF or higher and ESR is 10Ω or lower in total and temperature characteristics and accuracy are taken
into consideration. Also the E-cap should have good high frequency characteristics.
Caution for implementing LV5695P to a system board
The package of LV5695P is HZIP15J which has some metal exposures other than connection pins and heatsink as shown in the
diagram below. The electrical potentials of (2) and (3) are the same as those of pin 15 and pin 1, respectively. (2) (=pin 15) is the VCC
pin and (3) (=pin 1) is the ILM (regulator) output pin. When you implement the IC to the set board, make sure that the bolts and the
heatsink are out of touch from (2) and (3). If the metal exposures touch the bolts which has the same electrical potential with GND,
GND short occurs in ILM output and VCC. The exposures of (1) are connected to heatsink which has the same electrical potential with
substrate of the IC chip (GND). Therefore, (1) and GND electrical potential of the set board can connect each other.
· HZIP15J outline
1
Heat-sink
Same potential
2
15PIN
Same potential
3
1PIN
Same potential
1
Heat-sink
Same potential
Heat-sink side
<Top view of HZIP15J>
:Metal exposure
Heat-sink side
1
Heat-sink
Same potential
:Metal exposure
<Side view of HZIP15J>
No.A1972-11/14
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet LV5695P.PDF ] | |
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