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PDF STM32F745IE Data sheet ( Hoja de datos )

Número de pieza STM32F745IE
Descripción 32b MCU+FPU
Fabricantes STMicroelectronics　
Logotipo STMicroelectronics Logotipo



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No Preview Available ! STM32F745IE Hoja de datos, Descripción, Manual

STM32F745xx
STM32F746xx
ARM®-based Cortex®-M7 32b MCU+FPU, 462DMIPS, up to 1MB Flash/320+16+ 4KB
RAM, USB OTG HS/FS, ethernet, 18 TIMs, 3 ADCs, 25 com itf, cam & LCD
Datasheet - production data
Features
• Core: ARM® 32-bit Cortex®-M7 CPU with FPU,
adaptive real-time accelerator (ART
Accelerator™) and L1-cache: 4KB data cache
and 4KB instruction cache, allowing 0-wait
state execution from embedded Flash memory
and external memories, frequency up to
216 MHz, MPU, 462 DMIPS/2.14 DMIPS/MHz
(Dhrystone 2.1), and DSP instructions.
• Memories
– Up to 1MB of Flash memory
– 1024 bytes of OTP memory
– SRAM: 320KB (including 64KB of data
TCM RAM for critical real-time data) +
16KB of instruction TCM RAM (for critical
real-time routines) + 4KB of backup SRAM
(available in the lowest power modes)
– Flexible external memory controller with up
to 32-bit data bus: SRAM, PSRAM,
SDRAM/LPSDR SDRAM, NOR/NAND
memories
• Dual mode Quad-SPI
• LCD parallel interface, 8080/6800 modes
• LCD-TFT controller up to XGA resolution with
dedicated Chrom-ART Accelerator™ for
enhanced graphic content creation (DMA2D)
• Clock, reset and supply management
– 1.7 V to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– Dedicated USB power
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC (1%
accuracy)
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
• Low-power
– Sleep, Stop and Standby modes
–
VreBgAisTtseurspp+ly4KfoBr
RTC, 32×32 bit
backup SRAM
backup
• 3×12-bit, 2.4 MSPS ADC: up to 24 channels
and 7.2 MSPS in triple interleaved mode
• 2×12-bit D/A converters
• Up to 18 timers: up to thirteen 16-bit (1x low-
power 16-bit timer available in Stop mode) and
two 32-bit timers, each with up to 4
IC/OC/PWM or pulse counter and quadrature
(incremental) encoder input. All 15 timers
running up to 216 MHz. 2x watchdogs, SysTick
timer
&"'!
LQFP100 (14x14 mm)
LQFP144 (20x20 mm)
LQFP176 (24x24 mm)
LQFP208 (28x28 mm)
UFBGA176 (10x10 mm)
TFBGA216 (13x13 mm)
TFBGA100 (8x8 mm)
WLCSP143
(4.5x5.8 mm)
• General-purpose DMA: 16-stream DMA
controller with FIFOs and burst support
• Debug mode
– SWD & JTAG interfaces
– Cortex®-M7 Trace Macrocell™
• Up to 168 I/O ports with interrupt capability
– Up to 164 fast I/Os up to 108 MHz
– Up to 166 5 V-tolerant I/Os
• Up to 25 communication interfaces
– Up to 4× I2C interfaces (SMBus/PMBus)
– Up to 4 USARTs/4 UARTs (27 Mbit/s,
ISO7816 interface, LIN, IrDA, modem
control)
–
Umpuxtoed6sSimPpIsle(xupI2tSo
50
for
Mbit/s), 3 with
audio class
accuracy via internal audio PLL or external
clock
– 2 x SAIs (serial audio interface)
– 2 × CANs (2.0B active) and SDMMC
interface
– SPDIFRX interface
– HDMI-CEC
• Advanced connectivity
– USB 2.0 full-speed device/host/OTG
controller with on-chip PHY
– USB 2.0 high-speed/full-speed
device/host/OTG controller with dedicated
DMA, on-chip full-speed PHY and ULPI
– 10/100 Ethernet MAC with dedicated DMA:
supports IEEE 1588v2 hardware, MII/RMII
• 8- to 14-bit parallel camera interface up to
54 Mbyte/s
• True random number generator
• CRC calculation unit
• RTC: subsecond accuracy, hardware calendar
• 96-bit unique ID
Table 1. Device summary
Reference
Part number
STM32F745xx
STM32F746xx
STM32F745IE, STM32F745VE, STM32F745VG,
STM32F745ZE, STM32F745ZG, STM32F745IG
STM32F746BE, STM32F746BG, STM32F746IE,
STM32F746IG, STM32F746NE, STM32F746NG,
STM32F746VE, STM32F746VG, STM32F746ZE,
STM32F746ZG
February 2016
This is information on a product in full production.
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STM32F745IE pdf
STM32F745xx STM32F746xx
Contents
5.3.29
5.3.30
5.3.31
Camera interface (DCMI) timing specifications . . . . . . . . . . . . . . . . . . 191
LCD-TFT controller (LTDC) characteristics . . . . . . . . . . . . . . . . . . . . . 192
SD/SDIO MMC card host interface (SDMMC) characteristics . . . . . . . 194
6 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 196
6.1 LQFP100, 14 x 14 mm low-profile quad flat package information . . . . . 196
6.2 TFBGA100, 8 x 8 x 0.8 mm thin fine-pitch ball grid array
package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
6.3 WLCSP143, 4.539x 5.849 mm, 0.4 mm pitch wafer level chip
scale package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202
6.4 LQFP144, 20 x 20 mm low-profile quad flat package information . . . . . 205
6.5 LQFP176, 24 x 24 mm low-profile quad flat package information . . . . . 208
6.6 LQFP208, 28 x 28 mm low-profile quad flat package information . . . . . 212
6.7 UFBGA 176+25, 10 x 10 x 0.65 mm ultra thin-pitch ball grid
array package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
6.8 TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array
package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
6.9 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
7 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223
Appendix A Recommendations when using internal reset OFF . . . . . . . . . . . 224
A.1 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
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STM32F745IE arduino
STM32F745xx STM32F746xx
List of figures
Figure 87. WLCSP143, 0.4 mm pitch wafer level chip scale package
top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204
Figure 88. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 205
Figure 89. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206
Figure 90. LQFP144, 20 x 20mm, 144-pin low-profile quad flat package
top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
Figure 91. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 208
Figure 92. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
Figure 93. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package
top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
Figure 94. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 212
Figure 95. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 214
Figure 96. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package
top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 215
Figure 97. UFBGA 176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 216
Figure 98. UFBGA176+25, 10 x 10 x 0.65 mm, ultra fine-pitch ball grid array
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 217
Figure 99. UFBGA 176+25, 10 × 10 × 0.6 mm ultra thin fine-pitch ball grid array
package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 218
Figure 100. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 219
Figure 101. TFBGA216, 13 x 13 x 0.8 mm thin fine-pitch ball grid array
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
Figure 102. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array
package top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 221
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