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PDF LX3302 Data sheet ( Hoja de datos )
| Número de pieza | LX3302 | |
| Descripción | Inductive Sensor Interface IC | |
| Fabricantes | Microsemi | |
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Preliminary Production Data Sheet
LX3302
Inductive Sensor Interface IC with Embedded MCU
Description
The LX3302 is a highly integrated programmable data
conversion IC designed for interfacing to and managing of
inductive sensors. The device includes an integrated
oscillator circuit for driving the primary coil of an inductive
sensor, along with two independent analog conversion
paths for conditioning, converting, and processing of two
analog signals from the secondary coils of the sensor.
Each path includes an EMI filter, demodulator, anti-alias
filter, programmable amplifier, and a 13-bit sigma-delta
analog-to-digital converter.
Each analog signal path includes digital calibration
capability which allows the complete analog path (including
the external sensors) to be calibrated during the system
manufacturing process. The calibration information is
written to internal EEPROM resulting in improved
production yields, and in-line system upgrades.
The LX3302 integrates a 32-bit RISC processor which
provides programmable digital filtering and signal
processing functions. The MCU resources include 12k
bytes of program memory, 128 bytes of SRAM, and 64
bytes of user programmable EEPROM.
System interfaces include a SENT or PSI5 serial port,
programmable PWM output and a 12-bit digital-to-analog
converter analog buffed output.
The LX3302 is offered in a TSSOP14 package. The device
is specified over a temperature range of -40°C to +150°C
making it suitable for a wide range of commercial,
industrial, medical, and/or automotive sensor applications.
Features
Built-in Oscillator for Driving Primary Coil
Two Independent Analog Channels With
Demodulation
32-Bit RISC MCU with 3k 32-bit Words of
ROM
Two Programmable Gain Amplifiers
Two Anti-alias Filters
Two 13-bit ADCs
Selection of SINC and SINC+FIR Digital
Filters
One 12-bit DAC
One 16-bit PWM
Output Ground Fault Detection and
Protection
Digital Calibration with Non-volatile
Configuration Storage (EEPROM)
Protected Watchdog Timer
Low Temperature Drift
Wide Range Supply Voltage(4.0V to 11.0V)
-40°C to 150°C Operation
Excellent Long Term Stability
SENT Output
Asynchronous PSI5 Output
AEC-Q100 certification
ISO 26262 Compliant
Applications
Automotive Control
ATE Equipment
Industrial Process Control
Smart Energy Saving Control
December 2015 Rev. 0.1
www.microsemi.com
© 2015 Microsemi Corporation- Analog Mixed Signal BU
1
1 page  
Pin Configuration
IO4
GND
IO3
VIN
VDD
IO2
IO1
1
2
3
4
5
6
7
14 NC
13 OSC1
12 OSC2
11 SUB
10 CL2
9 GNDCL
8 CL1
Ordering Information
Ambient
Temperature
-40°C to 150°C
Type
RoHS2 compliant,
Pb-free MSL1, AEC-
Q100 Grade 0
14-Pin TSSOP
Figure 6 · Pinout (Top View)
Matte Tin Lead Finish / MSL 1
YYWWA = Year/ Week/Lot Code
Package
14-TSSOP
Part Number
LX3302QPW
LX3302QPW -TR
Pin Configuration
Packaging Type
Bulk / Tube
Tape and Reel
5
5 Page 
Electrical Characteristics
Parameter
Symbol
Test Condition
Min Typ Max Units
Unless otherwise defined, the following specifications apply over the operating temperature range of -40C ≤ TA ≤ 150°C,
and the following test conditions: VIN = 5V, f=8.2MHz, IDD=1mA, II/O=0mA – Typical values are at 25 °C.
DAC resolution
DACR
12 Bit
DAC Reference Voltage, VIN
DACVREF
VIN/2.75
V
Relative Accuracy
DACRAcc
-0.25
0.25 %
Zero-code Error
DACZCErr
5 mV
Temperature Drift
DACTD
10 ppm/°C
Settling Time
DACST
10 µs
Slew Rate
DACSLRate
0.1 V/µs
IO1, IO2 Analog output
Voltage Gain
G12_VDD
VREF=VDD/2
1 V/V
Voltage Gain
Low Level Output Voltage
High Level Output Voltage
G12_VIN
VOLA
VOHA
VREF=VIN/2
Pull-up load ≥10 kΩ to VIN
Pull-down load ≥10 kΩ to GND, Gain=
VIN/VDD
0
VIN – 0.3
1.5
V/V
0.3 V
VIN V
Output rising slew rate
SRATE_R12A COUT=1nF
0.45 V/µs
Output falling slew rate
SRATE_F12A COUT=1nF
0.45 V/µs
Output short circuit current
ISHORT_12A Short to 0 or short to 5V
10 20 mA
IO1, IO2 Digital output
Low Level Output Voltage
High Level Output Voltage
VOLD
VOHD
Pull-up load ≥10 kΩ to VIN
Pull-down load ≥10 kΩ to GND
97
3 % VIN
% VIN
Propagation Delay Time
PDT_12D
0.4 0.7 µs
Output rising slew rate
SRATE_R12D
COUT=1nF, OD_PWM, Pull Up to
VIN=10kΩ
0.182
V/µs
Output falling slew rate
SRATE_F12D COUT=1nF, OD_PWM
6 V/µs
Output short circuit current
ISHORT_12D Short to 0 or short to 5V
10 20 mA
IO1, IO2 Digital input
High level Input Voltage
VIHD
2.5 V
Low level Input Voltage
Input Impedance
VILD
RIN_12
0.8 V
200 kΩ
Input Capacitance
CIN_12
5 pF
IO3 Analog output
Voltage Gain
Output Load
G_3
RL_3
2.75
0.9 10
V/V
kΩ
Propagation Delay Time
IO3_PDT
50 µs
Buffer input offset
IO3_offset
10 mV
Output short circuit current
SHORT1_3A
Short to GND or short to VIN
12 15 mA
Output short circuit current
SHORT2_3A
Short to14V
45 mA
Output slew rate
SLrate_3A
COUT=100nF
0.1 V/µs
VIN Ratiometric Error
RaErr_3A
Over full VIN voltage range
-0.2 0 0.2 % VIN
Thermal Drift
TD_ 3A
Clamped output(isolated DAC &buffer)
-0.3
0
0.3 % VIN
IO3 Digital output
11
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