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PDF PMEG2020EPK Data sheet ( Hoja de datos )

Número de pieza PMEG2020EPK
Descripción MEGA Schottky barrier rectifier
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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No Preview Available ! PMEG2020EPK Hoja de datos, Descripción, Manual

PMEG2020EPK
20 V, 2 A low VF MEGA Schottky barrier rectifier
10 February 2014
Product data sheet
1. General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with
an integrated guard ring for stress protection, encapsulated in a leadless ultra small
DFN1608D-2 (SOD1608) Surface-Mounted Device (SMD) plastic package with visible
and solderable side pads.
2. Features and benefits
Average forward current: IF(AV) ≤ 2 A
Reverse voltage: VR ≤ 20 V
Low forward voltage VF ≤ 450 mV
Low reverse current
AEC-Q101 qualified
Solderable side pads
Package height typ. 0.37 mm
Ultra small and leadless SMD plastic package
3. Applications
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
LED backlight for mobile application
Low power consumption applications
Ultra high-speed switching
Reverse polarity protection
4. Quick reference data
Table 1.
Symbol
IF(AV)
Quick reference data
Parameter
average forward
current
VR reverse voltage
VF forward voltage
Conditions
δ < 0.5; f = 20 kHz; Tsp ≤ 130 °C;
square wave
δ < 0.5; f = 20 kHz; Tamb ≤ 65 °C;
square wave
Tj = 25 °C
IF = 2 A; pulsed; tp ≤ 300 µs; δ ≤ 0.02;
Tj = 25 °C
[1]
Min Typ Max Unit
- - 2A
- - 2A
- - 20 V
- 395 450 mV
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PMEG2020EPK pdf
NXP Semiconductors
PMEG2020EPK
20 V, 2 A low VF MEGA Schottky barrier rectifier
103 006aad023
Zth(j-a)
(K/W)
102
duty cycle =
1
0.75
0.5
0.33
0.25
0.2
0.1
0.05
0.02
10
10-3
0
0.01
10-2
FR4 PCB, standard footprint
10-1
1
10 102 103
tp (s)
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
103 006aad024
Zth(j-a)
(K/W)
duty cycle =
102 0.75
1
0.5
0.33
0.25
0.2
0.1
0.05
10
10-3
0
0.02
0.01
10-2
10-1
FR4 PCB, mounting pad for cathode 1 cm2
1
10 102 103
tp (s)
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG2020EPK
Product data sheet
All information provided in this document is subject to legal disclaimers.
10 February 2014
© NXP N.V. 2014. All rights reserved
5 / 15

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PMEG2020EPK arduino
NXP Semiconductors
PMEG2020EPK
20 V, 2 A low VF MEGA Schottky barrier rectifier
12. Package outline
0.85
0.75
1
0.80
0.72
0.40
0.32
Dimensions in mm
2
0.75
0.67
Fig. 17. Package outline DFN1608D-2 (SOD1608)
0.40
0.34
1.65
1.55
0.04
11-11-21
13. Soldering
Footprint information for reflow soldering of DFN1608D-2 package
1.15
1.05
0.95
0.75
0.65
0.55
SOD1608
0.9 0.8 0.7
solder land
1
solder land plus solder paste
0.1
0.2
1.8
1.9
2.0
solder paste deposit
solder resist
Dimensions in mm
Fig. 18. Reflow soldering footprint for DFN1608D-2 (SOD1608)
0.7 0.8 0.9
2
sod1608_fr
PMEG2020EPK
Product data sheet
All information provided in this document is subject to legal disclaimers.
10 February 2014
© NXP N.V. 2014. All rights reserved
11 / 15

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