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PDF SI3480 Data sheet ( Hoja de datos )
| Número de pieza | SI3480 | |
| Descripción | POWER MANAGEMENT CONTROLLER | |
| Fabricantes | Silicon Laboratories | |
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Si3480
Si3480 POWER MANAGEMENT CONTROLLER
Features
Enables use of a smaller power Pin programmable for overall
supply for a 4 or 8 port PoE
power supply capacity, port
system
power level, port priority, and
Self-contained solution operates detection timing
without the need for a host for LED indication of port status and
unmanaged operation
overall power consumption
No software required
20-pin Quad flat package
No data isolation required
(4x4 mm)
Fully compliant with IEEE 802.3
4x4 mm PCB footprint; RoHS
clause 33 for Power over Ethernet
compliant
including the 802.3at amendment Extended operating temperature
for higher power (30 W category 2 range (–40 to +85 °C)
ports)
Description
The Si3480 is a power manager intended for use with the Si3452 Power
over Ethernet (PoE) controller. The Si3480 enables the use of a smaller,
lower cost, and more efficiently-utilized power supply in an unmanaged
PoE Power Sourcing Equipment (PSE) system.
The Si3452 is capable of delivering over 30 W per port, which means that,
in a typical 8-port system, a 240 W power supply would have to be used
to avoid overload. Typically, not all ports are used at full power; so, a
smaller power supply in the range of 30 to 150 W can be used along with
the Si3480 power management controller.
The Si3480 power management controller is pin programmed. The pins
are used to set the power supply capacity, the number of low power
(category 1, 15.4 W), and high power (category 2, 30 W) ports, the port
priority, and the detection timing (Alternative A or Alternative B). The
Si3480 uses the real time overload and current monitoring capability of
the Si3452 to manage power for up to eight ports. Power management is
based on actual consumption rather than mere classification in order to
supply power to the greatest number of ports.
The Si3480 also provides LED drive to indicate port status and drive an
LED bar graph display to indicate the power supply capacity in use. If a
port is denied power due to power supply capacity limitations, the LED
indicators provide a simple and intuitive indication, helping a user
recognize and correct the overload situation by rebalancing loads or
adding mid-span power injectors to ports that would not otherwise be
powered. In case of a port overload, the port is easily re-enabled by
disconnecting the Powered Device (PD) and then reconnecting the PD
after correcting the overload situation.
Ordering Information:
See Ordering Guide on page 9.
Pin Assignments
(Top View)
SDA
GND
VDD
RST
NC
1
2
3
4
5
15 PRIOCFG
14 ALTCFG
13 LED8
12 LED7
11 LED6
Rev. 1.0 7/10
Copyright © 2010 by Silicon Laboratories
Si3480
1 page  
2. Typical Application Schematic
Si3480
Rev. 1.0
5
5 Page 
Si3480
8. Landing Pattern: 20-Pin QFN
Figure 3 illustrates the landing pattern for the Si3480. Table 8 lists the values for the dimensions shown in the
illustration.
Figure 3. QFN-20 Recommended PCB Land Pattern
Table 8. QFN-20 PCB Land Pattern Dimensions
Dimension
Min
Max
Dimension
Min
Max
C1 3.70
C2 3.70
E 0.50
X1 0.20 0.30
X2 2.15 2.25
Y1 0.90 1.00
Y2 2.15 2.25
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
mask and the metal pad is to be 60 m minimum, all the way around the pad.
Stencil Design
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
to assure good solder paste release.
6. The stencil thickness should be 0.125 mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 2x2 array of 0.95mm openings on a 1.1 mm pitch should be used for the center pad to
assure the proper paste volume (71% Paste Coverage).
Card Assembly
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
Body Components.
Rev. 1.0
11
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet SI3480.PDF ] | |
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