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PDF HBL5006 Data sheet ( Hoja de datos )
| Número de pieza | HBL5006 | |
| Descripción | LED Shunt | |
| Fabricantes | ON Semiconductor | |
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HBL5006 Series
LED Shunt
The HBL5006 Series are electronic shunts which provide a current
bypass in the case of LEDs going into open circuit. LEDs are by nature
quite fragile when subjected to transients and surge conditions. There
are also many cases where high reliability of the LED lighting must be
maintained such as in headlights, lighthouses, bridges, aircraft, runways
and so forth. In these cases the low cost addition of the shunt device will
provide full assurance that an entire string of LEDs will not extinguish
should one LED fail open. The shunt device is also applicable to other
loads where circuit continuity is required. The devices are designed to
be used with LED string currents from 50 to 350 mA.
Features
• Protection for the Following IEC Standards:
IEC 61000−4−2 (Level 4)
ISO 10605
• Low ESD Clamping Voltage
• Automatically Resets Itself if the LED Heals Itself or is Replaced
• ON−State Voltage Typically 1.1 V
• OFF−State Current less than 1.0 mA
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Typical Applications
• LEDs where Preventive Maintenance is Impractical
• LED Headlights in Automobiles
• Automotive LED Applications
• LEDs with High Reliability Requirements
• Crowbar Protection for Open Circuit Conditions
• Overvoltage Protection for Sensitive Circuits
http://onsemi.com
MARKING
DIAGRAMS
SOD−323
CASE 477
1
2
HD
M
SOD−523
CASE 502
12
56
SOD−923
CASE 514AB
1
LD M
2
XX = Specific Device Code
M = Date Code
HBL5006
Control
Circuit
ESD
1
+
HBL5006
−
2
Apply heat sinking to pin 2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 0
1
Publication Order Number:
HBL5006/D
1 page  
HBL5006 Series
DEVICE ORDERING INFORMATION
Device
Marking
Package
Shipping†
HBL5006HT1G
SZHBL5006HT1G*
HD SOD−323
HD (Pb−Free)
3000 / Tape & Reel
HBL5006XV2T1G
SZHBL5006XV2T1G*
56 SOD−523
56 (Pb−Free)
3000 / Tape & Reel
HBL5006P2T5G
SZHBL5006P2T5G*
LD SOD−923
LD (Pb−Free)
8000 / Tape & Reel
†For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP
Capable.
PACKAGE DIMENSIONS
HE
D
b1
2E
C
NOTE 3
L
NOTE 5
A1
SOD−323
CASE 477−02
ISSUE H
A3
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF RADIUS.
MILLIMETERS
DIM MIN NOM MAX
A 0.80 0.90 1.00
A1 0.00 0.05 0.10
A3 0.15 REF
b 0.25 0.32 0.4
C 0.089 0.12 0.177
D 1.60 1.70 1.80
E 1.15 1.25 1.35
L 0.08
HE 2.30 2.50 2.70
INCHES
MIN NOM MAX
0.031 0.035 0.040
0.000 0.002 0.004
0.006 REF
0.010 0.012 0.016
0.003 0.005 0.007
0.062 0.066 0.070
0.045 0.049 0.053
0.003
0.090 0.098 0.105
SOLDERING FOOTPRINT*
0.63
0.025
1.60
0.063
2.85
0.112
0.83
0.033
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet HBL5006.PDF ] | |
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