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PDF ESD101-B1-02 Data sheet ( Hoja de datos )
| Número de pieza | ESD101-B1-02 | |
| Descripción | Protection Device (TVS) | |
| Fabricantes | Infineon | |
| Logotipo |  |
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Protection Device
TVS (Transient Voltage Suppressor)
ESD101-B1-02 Series
Bi-directional, 5.5 V, 0.1 pF, 0201, 0402, RoHS and Halogen Free compliant
ESD101-B1-02ELS
ESD101-B1-02EL
Data Sheet
Revision 1.3, 2015-07-13
Final
Power Management & Multimarket
1 page  
ESD101-B1-02 Series
Electrical Characteristics at TA = 25 °C, unless otherwise specified
Table 3 DC Characteristics at TA = 25 °C, unless otherwise specified 1)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Reverse working voltage VRWM
Trigger voltage
Vt1
Holding voltage
Vh
Reverse leakage current IR
1) Device is electrically symmetrical
-5.5
6.1
6.1
–
–
–
7.0
<0.1
5.5
–
7.9
20
V
nA
Note / Test Condition
IT = 10 mA
VR = 5.5 V
Table 4 AC Characteristics at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Min.
Typ.
Max.
Line capacitance
CL –
–
– 0.2
0.1 –
Serie inductance
LS –
–
0.2 –
0.4 –
Unit
pF
nH
Note / Test Condition
VR = 0 V, f = 1 MHz
VR = 0V, f = 1 GHz
ESD101-B1-02ELS
ESD101-B1-02EL
Table 5 ESD and Surge Characteristics at TA = 25 °C, unless otherwise specified 1)
Parameter
Symbol
Values
Unit Note / Test Condition
Min.
Typ.
Max.
Clamping voltage2)
VCL –
18 –
V ITLP = 8 A, tp = 100 ns
– 30 –
ITLP = 16 A, tp = 100 ns
Clamping voltage3)
–9–
IPP = 1 A, tp = 8/20 μs
– 13 –
IPP = 2 A, tp = 8/20 μs
Dynamic resistance2)
RDYN
–
1.5 –
Ω tp = 100 ns
1) Device is electrically symmetrical
2) Please refer to Application Note AN210[1]. TLP parameter: Z0 = 50 Ω , tp = 100ns, tr = 300ps.
3) Non-repetitive current pulse 8/20µs exponential decay waveform according to IEC61000-4-5
Final Data Sheet
5 Revision 1.3, 2015-07-13
5 Page 
5 Package Information
ESD101-B1-02 Series
Package Information
5.1 TSSLP-2-4
Top view
0.31
+0.01
-0.02
Bottom view
0.32 ±0.05
2
Pin 1
marking
0.05 MAX.
1
0.26±0.035 1)
1) Dimension applies to plated terminals
Figure 10 TSSLP-2-4 Package outline (dimension in mm)
TSSLP-2-3, -4-PO V01
0.32
0.27
Figure 11
Copper Solder mask
Stencil apertures
TSSLP-2-3, -4-FP V02
TSSLP-2-4 Footprint (dimension in mm)
4 0.35
marking
Tape type
Ex Ey
Punched Tape 0.43 0.73
Embossed Tape 0.37 0.67
Pin 1
Ex
marking
Figure 12 TSSLP-2-4 Packing (dimension in mm)
Deliveries can be both tape types (no selection possible).
Specification allows identical processing (pick & place) by users.
TSSLP-2-3, -4-TP V03
Type code
Pin 1 marking
Figure 13 TSSLP-2-4 Marking example Table 1 “Part Information” on Page 3
Final Data Sheet
11 Revision 1.3, 2015-07-13
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet ESD101-B1-02.PDF ] | |
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