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PDF 5059H Data sheet ( Hoja de datos )
| Número de pieza | 5059H | |
| Descripción | 32kHz output Crystal Oscillator Module ICs | |
| Fabricantes | NPC | |
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5059H series
32kHz output Crystal Oscillator Module ICs
OVERVIEW
The 5059H series are 32.768kHz output and 125°C operation crystal oscillator module ICs with divide-by-512 (or divide-by-1024)
frequency,AT-cut crystal 16.777216MHz (or 33.554432MHz) oscillator circuit built-in.
It is possible to generate a 32.768kHz output crystal oscillator with excellent temperature characteristics by usingAT-cut crystal.
There are 3 pad layout package options available for optimized mounting, making these devices ideal for miniature crystal oscillators.
FEATURES
▪ Wide range of operating supply voltage: 1.6 to 5.5V
▪ Oscillation frequency(fundamental oscillator):16.777216MHz or 33.554432MHz
▪ Output frequency: 32.768kHz (oscillation frequency divided by 512 or 1024)
▪ -40 to +125°C operating temperature range
▪ Regulated voltage drive oscillator circuit for reduced power consumption
and crystal drive current
▪ 3 pad layout options for mounting
5059HAx : for Flip Chip Bonding
5059HBx : for Wire Bonding(Type I)
5059HCx : for Wire Bonding(Type II)
▪ Oscillation capacitors CG,CD built-in
▪ Standby function
High impedance in standby mode, oscillator stops
▪ Power-saving pull-up resistor built-in
▪ ±1mAoutput drive capability (Ta=-40 to +85°C)
±0.8mAoutput drive capability (Ta=-40 to +125°C)
▪ 50±5% output duty (1/2VDD)
▪ Wafer form (WF5059Hxx)
▪ Chip form (CF5059Hxx)
APPLICATIONS
▪ 32.768kHz output crystal oscillator modules
SERIES CONFIGURATION
Version*1
Oscillation frequency[MHz] Oscillation capacitors*2[pF]
（fundamental oscillator）
CG
CD
5059HAA
5059HBA
16.777216
32
5059HCA
5059HAB
5059HBB
33.554432
21
5059HCB
*1. It becomes WF5059Hxx in case of the wafer form and CF5059Hxx in case of the chip form.
*2. The oscillation capacitors do not contain parasitic capacitance.
Output
frequency[kHz]
32.768
(fOSC/512)
32.768
(fOSC/1024)
PAD layout
Flip Chip Bonding
Wire Bonding TypeⅠ
Wire Bonding TypeⅡ
Flip Chip Bonding
Wire Bonding TypeⅠ
Wire Bonding TypeⅡ
ORDERING INFORMATION
Device
Package
WF5059Hxx-4
Wafer form
CF5059Hxx-4
Chip form
FormWF:Wafer form
CF:Chip(Die) form
Version Name
WF5059H□□-4
Oscillation frequency A:16.777216MHz
B:33.554432MHz
PAD layout
A:For Flip Chip Bonding
B:For Wire Bonding(Type I)
C:For Wire Bonding(Type II)
SEIKO NPC CORPORATION - 1
1 page  
AC Characteristics
Parameter
Q pin
Output rise time
Q pin
Output fall time
Q pin
Output duty cycle
Q pin
Output disable delay time
Timing chart
5059H series
Symbol
VDD=1.6 to 5.5V, VSS=0V, Ta=-40 to +125°C unless otherwise noted
Conditions
Rating
MIN TYP MAX
Unit
tr
Measurement circuit 1, CLOUT=15pF,
0.1VDD 0.9VDD
tf
Measurement circuit 1, CLOUT=15pF,
0.9VDD 0.1VDD
50 200
50 200
ns
ns
DUTY
Measurement circuit 1, Ta=25°C,
CLOUT=15pF
45 50 55
%
tOD Measurement circuit 2, Ta=25°C, CLOUT≤15pF
1 s
0.9VD D
Q
0.1VD D
0.9VDD
0.1VD D
Tw
T
tr tf
Figure 1.Output switching waveform
DUTY measurement
voltage 0.5VDD
DUTY = Tw/T×100 (%)
VDD
INHN
VSS
VDD
Q
VSS
VIL
tOD
0.1V
0.1V
fOUT Hi-Z
VIH
0.5VDD
Low
fOUT
When INHN goes HIGH to LOW, the Q output becomes high impedance.
When INHN goes LOW to HIGH, the Q output goes LOW once and then becomes normal output operation after having detected oscillation signals.
Figure 2.Output disable and oscillation start timing chart
SEIKO NPC CORPORATION - 5
5 Page 
5059H series
Please pay your attention to the following points at time of using the products shown in this document.
1. The products shown in this document (hereinafter ”Products”) are designed and manufactured to the generally accepted standards of
reliability as expected for use in general electronic and electrical equipment, such as personal equipment, machine tools and
measurement equipment. The Products are not designed and manufactured to be used in any other special equipment requiring
extremely high level of reliability and safety, such as aerospace equipment, nuclear power control equipment, medical equipment,
transportation equipment, disaster prevention equipment, security equipment. The Products are not designed and manufactured to be
used for the apparatus that exerts harmful influence on the human lives due to the defects, failure or malfunction of the Products.
If you wish to use the Products in that apparatus, please contact our sales section in advance.
In the event that the Products are used in such apparatus without our prior approval, we assume no responsibility whatsoever for any
damages resulting from the use of that apparatus.
2. NPC reserves the right to change the specifications of the Products in order to improve the characteristics or reliability thereof.
3. The information described in this document is presented only as a guide for using the Products. No responsibility is assumed by us for any
infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise
under any patents or other rights of the third parties. Then, we assume no responsibility whatsoever for any damages resulting from that
infringements.
4. The constant of each circuit shown in this document is described as an example, and it is not guaranteed about its value of the mass
production products.
5. In the case of that the Products in this document falls under the foreign exchange and foreign trade control law or other applicable laws and
regulations, approval of the export to be based on those laws and regulations are necessary. Customers are requested appropriately take
steps to obtain required permissions or approvals from appropriate government agencies.
SEIKO NPC CORPORATION
1-9-9, Hatchobori, Chuo-ku,
Tokyo 104-0032, Japan
Telephone: +81-3-5541-6501
Facsimile: +81-3-5541-6510
http://www.npc.co.jp/
Email:[email protected]
ND12033-E-01 2013.02
SEIKO NPC CORPORATION - 11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet 5059H.PDF ] | |
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