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PDF PMEG4010CPAS Data sheet ( Hoja de datos )
| Número de pieza | PMEG4010CPAS | |
| Descripción | 1A low VF dual MEGA Schottky barrier rectifier | |
| Fabricantes | NXP Semiconductors | |
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PMEG4010CPAS
40 V, 1 A low VF dual MEGA Schottky barrier rectifier
20 January 2015
Product data sheet
1. General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier in
common cathode configuration with an integrated guard ring for stress protection,
encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted
Device (SMD) plastic package with visible and solderable side pads.
2. Features and benefits
• Average forward current IF(AV) ≤ 1 A
• Reverse voltage VR ≤ 40 V
• Low forward voltage VF ≤ 500 mV
• Low reverse current
• Reduced Printed-Circuit-Board (PCB) area requirements
• Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity
• Leadless small SMD plastic package with visible and solderable side pads
• Suitable for Automatic Optical Inspection (AOI) of solder joints
• AEC-Q101 qualified
3. Applications
• Low voltage rectification
• High efficiency DC-to-DC conversion
• Switch Mode Power Supply (SMPS)
• Free-wheeling application
• Reverse polarity protection
• Low power consumption application
• Battery chargers for mobile equipment
• LED backlight for mobile application
Table 1. Quick reference data
Symbol
Parameter
Per diode
IF(AV)
average forward
current
VR reverse voltage
Conditions
δ = 0.5; f = 20 kHz; Tamb ≤ 110 °C;
square wave
δ = 0.5; f = 20 kHz; Tsp ≤ 140 °C;
square wave
Tj = 25 °C
Min Typ Max Unit
[1] - - 1 A
- - 1A
- - 40 V
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1 page  
NXP Semiconductors
PMEG4010CPAS
40 V, 1 A low VF dual MEGA Schottky barrier rectifier
103
Zth(j-a)
(K/W)
102
10
duty cycle =
1
0.75
0.5
0.33
0.25 0.2
0.1
0.05
006aac428
0
0.02
0.01
1
10- 3
10- 2
10- 1
FR4 PCB, mounting pad for cathode 1 cm2
1
10 102 103
tp (s)
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
102
Zth(j-a)
(K/W)
duty cycle =
1
0.75
0.5
0.33
0.25 0.2
006aac429
10
0.1 0.05
0.02
0 0.01
1
10- 3
10- 2
10- 1
Ceramic PCB, Al2O3, standard footprint
1
10 102 103
tp (s)
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG4010CPAS
Product data sheet
All information provided in this document is subject to legal disclaimers.
20 January 2015
© NXP Semiconductors N.V. 2015. All rights reserved
5 / 15
5 Page 
NXP Semiconductors
PMEG4010CPAS
40 V, 1 A low VF dual MEGA Schottky barrier rectifier
12. Soldering
Footprint information for reflow soldering of DFN2020D-3 package
2.1
1.7
1.3
0.4 (2x)
0.3 (2x)
0.5 (2x)
SOT1061D
0.25
1.1
0.35 0.3
2.5 2.3
0.25
0.5 (2x) 0.6 (2x) 0.7 (2x)
0.25
1
1.1 1.2
0.3
0.4
0.5
1.5
1.6
1.7
occupied area
solder resist
solder lands
solder paste
Dimensions in mm
Issue date
14-03-05
14-03-12
Fig. 16. Reflow soldering footprint for DFN2020D-3 (SOT1061D)
PMEG4010CPAS
Product data sheet
All information provided in this document is subject to legal disclaimers.
20 January 2015
0.35 0.35 0.35
sot1061d_fr
© NXP Semiconductors N.V. 2015. All rights reserved
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