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Número de pieza | PMEG10030ELP | |
Descripción | 3A low leakage current Schottky barrier rectifier | |
Fabricantes | NXP Semiconductors | |
Logotipo | ||
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No Preview Available ! PMEG10030ELP
100 V, 3 A low leakage current Schottky barrier rectifier
7 May 2015
Product data sheet
1. General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead
Surface-Mounted Device (SMD) plastic package.
2. Features and benefits
• Extremely low leakage current IR = 110 nA
• Reverse voltage: VR ≤ 100 V
• Average forward current: IF(AV) ≤ 3 A
• High power capability due to clip-bonding technology
• High temperature Tj ≤ 175 °C
• Small and flat lead SMD plastic package
• AEC-Q101 qualified
3. Applications
• Low voltage rectification
• High efficiency DC-to-DC conversion
• Switch mode power supply
• Reverse polarity protection
• Low power consumption applications
4. Quick reference data
Table 1.
Symbol
IF(AV)
VR
VF
Quick reference data
Parameter
average forward
current
reverse voltage
forward voltage
IR reverse current
Conditions
δ = 0.5; f = 20 kHz; Tsp ≤ 160 °C;
square wave
Tj = 25 °C
IF = 3 A; tp ≤ 300 µs; δ ≤ 0.02;
Tj = 25 °C
VR = 100 V; tp ≤ 300 µs; δ ≤ 0.02;
Tj = 25 °C
Min Typ Max Unit
- - 3A
- - 100 V
- 710 770 mV
- 110 450 nA
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1 page NXP Semiconductors
102
Zth(j-a)
(K/W)
10
1
duty cycle = 1
0.75
0.5
0.33 0.25
0.2
0.1
0.05
0.02
0.01
0
PMEG10030ELP
100 V, 3 A low leakage current Schottky barrier rectifier
aaa-016492
10-1
10-3
10-2
10-1
Ceramic PCB, Al2O3, standard footprint
1
10 102 103
tp (s)
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG10030ELP
Product data sheet
All information provided in this document is subject to legal disclaimers.
7 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved
5 / 15
5 Page NXP Semiconductors
PMEG10030ELP
100 V, 3 A low leakage current Schottky barrier rectifier
12. Package outline
2.7
2.3
1
5.0 4.0
4.4 3.6
1.1
0.9
0.6
0.3
Dimensions in mm
Fig. 16. Package outline SOD128
2
1.9
1.6
13. Soldering
6.2
4.4
4.2
3.4 2.5
1.2
(2×)
1.4
(2×)
Fig. 17. Reflow soldering footprint for SOD128
0.22
0.10
07-09-12
1.9 2.1
(2×) (2×)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sod128_fr
PMEG10030ELP
Product data sheet
All information provided in this document is subject to legal disclaimers.
7 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved
11 / 15
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PMEG10030ELP | 3A low leakage current Schottky barrier rectifier | NXP Semiconductors |
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