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PDF PMEG10020ELR Data sheet ( Hoja de datos )
| Número de pieza | PMEG10020ELR | |
| Descripción | 2A low leakage current Schottky barrier rectifier | |
| Fabricantes | NXP Semiconductors | |
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PMEG10020ELR
100 V, 2 A low leakage current Schottky barrier rectifier
7 May 2015
Product data sheet
1. General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD123W small and flat
lead Surface-Mounted Device (SMD) plastic package.
2. Features and benefits
• Average forward current: IF(AV) ≤ 2 A
• Reverse voltage: VR ≤ 100 V
• Low forward voltage: VF = 770 mV
• High power capability due to clip-bonding technology
• Extremely low leakage current IR = 40 nA
• High temperature Tj ≤ 175 °C
• AEC-Q101 qualified
3. Applications
• Low voltage rectification
• High efficiency DC-to-DC conversion
• Switch mode power supply
• Reverse polarity protection
• Low power consumption applications
4. Quick reference data
Table 1.
Symbol
IF(AV)
VR
VF
Quick reference data
Parameter
average forward
current
reverse voltage
forward voltage
IR reverse current
Conditions
δ = 0.5; f = 20 kHz; Tsp ≤ 160 °C;
square wave
Tj = 25 °C
IF = 2 A; tp ≤ 300 µs; δ ≤ 0.02;
Tj = 25 °C
VR = 100 V; tp ≤ 300 µs; δ ≤ 0.02;
Tj = 25 °C
Min Typ Max Unit
- - 2A
- - 100 V
- 770 830 mV
- 40 150 nA
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1 page  
NXP Semiconductors
102
Zth(j-a)
(K/W)
10
duty cycle =
1 0.75
0.5
0.33
0.25 0.2
0.1
0.05
0.02 0.01
1
0
PMEG10020ELR
100 V, 2 A low leakage current Schottky barrier rectifier
006aab651
10- 1
10- 3
10- 2
10- 1
Ceramic PCB, Al2O3, standard footprint
1
10 102 103
tp (s)
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMEG10020ELR
Product data sheet
All information provided in this document is subject to legal disclaimers.
7 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved
5 / 15
5 Page 
NXP Semiconductors
PMEG10020ELR
100 V, 2 A low leakage current Schottky barrier rectifier
12. Package outline
1.9
1.5
1
3.7 2.8
3.3 2.4
2
1.05
0.75
Dimensions in mm
Fig. 16. Package outline SOD123W
13. Soldering
4.4
2.9
2.8
2.1 1.6
1.1
(2×)
1.2
(2×)
Fig. 17. Reflow soldering footprint for SOD123W
1.1
0.9
0.6
0.3
0.22
0.10
08-11-06
1.1 1.2
(2×) (2×)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sod123w_fr
PMEG10020ELR
Product data sheet
All information provided in this document is subject to legal disclaimers.
7 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved
11 / 15
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| PDF Descargar | [ Datasheet PMEG10020ELR.PDF ] | |
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