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Número de pieza | BYC5X-600P | |
Descripción | Hyperfast power diode | |
Fabricantes | NXP Semiconductors | |
Logotipo | ||
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No Preview Available ! BYC5X-600P
Hyperfast power diode
24 December 2014
Product data sheet
1. General description
Hyperfast power diode in a SOD113A package.
2. Features and benefits
• Low leakage current
• Low reverse recovery current
• Low thermal resistance
• Reduces switching losses in associated MOSFET or IGBT
3. Applications
• Half-bridge/full-bridge switched-mode power supplies
• Continuous Current Mode (CCM) Power Factor Correction (PFC)
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
VRRM
repetitive peak reverse
voltage
IF(AV)
average forward
current
δ = 0.5; Th ≤ 97 °C; square-wave pulse;
Fig. 1; Fig. 2; Fig. 3
Static characteristics
VF
forward voltage
IF = 5 A; Tj = 150 °C; Fig. 6
Dynamic characteristics
trr reverse recovery time IF = 1 A; VR = 30 V; dIF/dt = 200 A/µs;
Tj = 25 °C; Fig. 7
Min Typ Max Unit
- - 600 V
- - 5A
- 1.35 2.1 V
- 11 - ns
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BYC5X-600P
Hyperfast power diode
9. Thermal characteristics
Table 6.
Symbol
Rth(j-h)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
heatsink
thermal resistance
from junction to
ambient
Conditions
with heatsink compound; Fig. 5
in free air
10
Zth(j-h)
(K/W)
1
Min Typ Max Unit
- - 6.5 K/W
- 55 - K/W
aaa-015788
10-1 δ = 0.5
δ = 0.3
δ = 0.1
10-2 δ = 0.05
δ = 0.02
δ = 0.01
10-3 single pulse
P
δ
=
tp
T
10-4
10-6
10-5
10-4
10-3
10-2
10-1
tp
T
1
tp (s)
t
10
Fig. 5. Transient thermal impedance from junction to heatsink as a function of pulse duration
10. Isolation characteristics
Table 7. Isolation characteristics
Symbol
Parameter
Conditions
Visol(RMS)
RMS isolation voltage
50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all
pins to external heatsink; sinusoidal
waveform; clean and dust free
Cisol isolation capacitance f = 1 MHz; from cathode to external
heatsink
Min Typ Max Unit
- - 2500 V
- 10 - pF
BYC5X-600P
Product data sheet
All information provided in this document is subject to legal disclaimers.
24 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved
5 / 11
5 Page NXP Semiconductors
14. Contents
1 General description ............................................... 1
2 Features and benefits ............................................1
3 Applications ........................................................... 1
4 Quick reference data ............................................. 1
5 Pinning information ............................................... 2
6 Ordering information ............................................. 2
7 Marking ................................................................... 2
8 Limiting values .......................................................3
9 Thermal characteristics .........................................5
10 Isolation characteristics ........................................5
11 Characteristics ....................................................... 6
12 Package outline ..................................................... 8
13 Legal information ...................................................9
13.1 Data sheet status ................................................. 9
13.2 Definitions .............................................................9
13.3 Disclaimers ...........................................................9
13.4 Trademarks ........................................................ 10
© NXP Semiconductors N.V. 2014. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 24 December 2014
BYC5X-600P
Hyperfast power diode
BYC5X-600P
Product data sheet
All information provided in this document is subject to legal disclaimers.
24 December 2014
© NXP Semiconductors N.V. 2014. All rights reserved
11 / 11
11 Page |
Páginas | Total 11 Páginas | |
PDF Descargar | [ Datasheet BYC5X-600P.PDF ] |
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