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PDF BYC10DX-600 Data sheet ( Hoja de datos )

Número de pieza BYC10DX-600
Descripción Hyperfast power diode
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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No Preview Available ! BYC10DX-600 Hoja de datos, Descripción, Manual

BYC10DX-600
Hyperfast power diode
Rev. 1 — 30 June 2011
Product data sheet
1. Product profile
1.1 General description
Hyperfast power diode in a SOD113 (2-lead TO-220F) plastic package.
1.2 Features and benefits
Isolated plastic package
Low reverse recovery current
Low thermal resistance
Reduces switching losses in
associated MOSFET
1.3 Applications
Continuous Current Mode (CCM)
Power Factor Correction (PFC)
Half-bridge/full-bridge switched-mode
power supplies
Half-bridge lighting ballasts
1.4 Quick reference data
Table 1.
Symbol
VRRM
IF(AV)
Quick reference data
Parameter
repetitive peak reverse
voltage
average forward current
Static characteristics
VF forward voltage
Dynamic characteristics
trr reverse recovery time
Conditions
square-wave pulse;
δ = 0.5 ; Th = 41 °C;
see Figure 1; see Figure 2
IF = 10 A; Tj = 25 °C;
see Figure 5
IF = 10 A; Tj = 150 °C;
see Figure 5
IF = 10 A; VR = 400 V;
dIF/dt = 500 A/µs;
Tj = 25 °C; see Figure 6
Min Typ Max Unit
- - 600 V
- - 10 A
- 2 2.5 V
- 1.4 1.8 V
- 18 - ns

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BYC10DX-600 pdf
NXP Semiconductors
BYC10DX-600
Hyperfast power diode
5. Thermal characteristics
Table 5.
Symbol
Rth(j-h)
Thermal characteristics
Parameter
thermal resistance from junction to
heatsink
Rth(j-a)
thermal resistance from junction to
ambient free air
Conditions
without heatsink compound
with heatsink compound ;
see Figure 4
Min Typ Max Unit
- - 5.9 K/W
- - 4.8 K/W
- 60 - K/W
10
Zth(j-h)
(K/W)
1
001aaf257
101
P
tp
δ=
T
102
103
106
105 104
103 102
tp
T
101
t
1 10
tp (s)
Fig 4. Transient thermal impedance from junction to heatsink as a function of pulse width
6. Isolation characteristics
Table 6.
Symbol
Visol(RMS)
Cisol
Isolation characteristics
Parameter
RMS isolation voltage
Conditions
50 Hz f 60 Hz; RH 65 %; from all pins to
external heatsink; sinusoidal waveform; clean
and dust free
isolation capacitance f = 1 MHz ; from cathode to external heatsink
Min Typ Max Unit
- - 2500 V
- 10 - pF
BYC10DX-600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 June 2011
© NXP B.V. 2011. All rights reserved.
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BYC10DX-600 arduino
NXP Semiconductors
BYC10DX-600
Hyperfast power diode
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BYC10DX-600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 30 June 2011
© NXP B.V. 2011. All rights reserved.
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