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PDF CSPESD304 Data sheet ( Hoja de datos )
| Número de pieza | CSPESD304 | |
| Descripción | 4-Channel ESD Array | |
| Fabricantes | ON Semiconductor | |
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CSPESD304
4-Channel ESD Array in CSP
Product Description
The CSPESD304 is a quad ESD transient voltage suppression diode
array. Each diode provides a very high level of protection for sensitive
electronic components that may be subjected to electrostatic discharge
(ESD). These diodes safely dissipate ESD strikes of ±15 kV,
exceeding the maximum requirement of the IEC 61000−4−2
international standard. Using the MIL−STD−883 (Method 3015)
specification for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater than ±30 kV.
The CSPESD304 is particularly well−suited for portable electronics
(e.g., cellular telephones, PDAs, notebook computers) because of its
small package and low weight.
The CSPESD304 is available in a space−saving, low−profile Chip
Scale Package with lead−free finishing.
Features
• Four Channels of ESD Protection
• ±15 kV ESD Protection on each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
• ±30 kV ESD Protection on each Channel (HBM)
• Chip Scale Package Features Extremely Low Lead Inductance for
Optimum ESD Protection
• 5−Bump, 0.960 mm x 1.330 mm Footprint Chip Scale Package
(CSP)
• These Devices are Pb−Free and are RoHS Compliant
Applications
• ESD Protection for Sensitive Electronic Equipment
• I/O Port and Keypad and Button Circuitry Protection for Portable
Devices
• Can be Used for EMI Filtering when Combined with External
Series Resistance
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Camcorders
• Notebooks
• Desktop PCs
http://onsemi.com
WLCSP5
CASE 567AY
ELECTRICAL SCHEMATIC
ESD_1 ESD_2 ESD_3 ESD_4
A1 A3 C1 C3
B2
MARKING DIAGRAM
E
E = CSPESD304
ORDERING INFORMATION
Device
Package
Shipping†
CSPESD304
CSP−5 3500/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 3
1
Publication Order Number:
CSPESD304/D
1 page  
CSPESD304
PACKAGE DIMENSIONS
WLCSP5, 0.96x1.33
CASE 567AY−01
ISSUE O
PIN A1
REFERENCE
D
ÈÈ
2X 0.05 C
AB
E
2X 0.05 C TOP VIEW
ÉÉÉOptiGuard Option
0.05 C
A2
A
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
5X b
0.05 C A B
0.03 C
eD/2
eD
eE
C
B
A
12 3
BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.56 0.72
A1 0.21 0.27
A2 0.40 REF
b 0.29 0.35
D 0.96 BSC
E 1.33 BSC
eD 0.50 BSC
eE 0.435 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
A1 OUTLINE
0.87
0.44
0.25
0.50
5X 0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CSPESD304/D
5 Page | ||
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