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Número de pieza | CSPESD304 | |
Descripción | 4-Channel ESD Array in CSP | |
Fabricantes | California Micro Devices | |
Logotipo | ||
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4-Channel ESD Array in CSP
Features
• Four channels of ESD protection
• +15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
• +30kV ESD protection on each channel (HBM)
• Chip Scale Package features extremely low
lead inductance for optimum ESD protection
• 5-bump, 0.950mm X 1.410mm footprint
Chip Scale Package (CSP)
• Lead-free version available
Applications
• ESD protection for sensitive electronic equipment
• I/O port and keypad and button circuitry
protection for portable devices
• Can be used for EMI filtering when combined
with external series resistance
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Camcorders
• Notebooks
• Desktop PCs
Product Description
The CSPESD304 is a quad ESD transient voltage
supression diode array. Each diode provides a very
high level of protection for sensitive electronic compo-
nents that may be subjected to electrostatic discharge
(ESD). These diodes are designed and characterized
to safely dissipate ESD strikes of 15kV, exceeding the
maximum requirement of the IEC 61000-4-2 interna-
tional standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than 30kV.
The CSPESD304 is particularly well suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight.
The CSPESD304 is available in a space-saving, low-
profile Chip Scale Package with optional lead-free fin-
ishing.
Electrical Schematic
ESD_1 ESD_2 ESD_3 ESD_4
A1 A3 C1 C3
GND B2
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
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1 page CSPESD304www.DataSheet4U.com
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
200
150
100
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
5
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet CSPESD304.PDF ] |
Número de pieza | Descripción | Fabricantes |
CSPESD301 | 1 / 2 and 3-Channel ESD Arrays in CSP | California Micro Devices |
CSPESD302 | 1 / 2 and 3-Channel ESD Arrays in CSP | California Micro Devices |
CSPESD303 | 1 / 2 and 3-Channel ESD Arrays in CSP | California Micro Devices |
CSPESD304 | 4-Channel ESD Array in CSP | California Micro Devices |
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