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PDF MBRF30150CT Data sheet ( Hoja de datos )
| Número de pieza | MBRF30150CT | |
| Descripción | Schottky Rectifier ( Diode ) | |
| Fabricantes | SANGDEST MICROELECTRONICS | |
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SANGDEST
MICROELECTRONICS
MBRF30150CT
Technical Data
Data Sheet N0854, Rev. -
Green Products
Applications:
MBRF30150CT SCHOTTKY RECTIFIER
• Switching power supply
• Converters
• Free-Wheeling diodes
• Reverse battery protection
Features:
• 150°C TJ operation
• Center tap configuration
• Low forward voltage drop
• High purity, high temperature epoxy encapsulation for
enhanced mechanical strength and moisture resistance
• High frequency operation
• Guard ring for enhanced ruggedness and long term reliability
• This is a Pb − Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request
Mechanical Dimensions: In mm / Inches
OUTLINE DRAWING
OPTION 1
OPTION 2
Dim Min Max Min
Max
A
4.4 4.6 4.30
4.70
b
0.6TYP
0.50
0.75
b1
1.3TYP
1.30
1.40
b2
1.7TYP
1.70
1.80
b3
1.6TYP
1.50
1.75
b4
1.2TYP
1.10
1.35
C
0.60TYP
0.50
0.75
D
14.8 15.1 14.80
15.20
E
10.06 10.26
9.96
10.36
e 2.55TYP
2.54TYP
F
2.9 3.1 2.80
3.20
G
6.5 6.9 6.50
6.90
L
12.7 13.7
13.2
12.8
L1 3.4 3.8 3.60 4.00
L2 2.6 3.0
-
-
Q
2.5 2.9 2.50
2.90
Q1 2.5 2.9
2.70REF
ØR 3.5REF
3.50REF
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 •
• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
1 page  
SANGDEST
MICROELECTRONICS
Technical Data
Data Sheet N0854, Rev. -
MBRF30150CT
Green Products
Electrical Characteristics:
Characteristics
Forward Voltage Drop
(per leg) *
Reverse Current (per leg) *
Junction Capacitance
(per leg)
Typical Series Inductance
(per leg)
Voltage Rate of Change
* Pulse Width < 300µs, Duty Cycle <2%
Symbol
Condition
VF1
VF2
IR1
IR2
CT
LS
dv/dt
@ 15 A, Pulse, TJ = 25 °C
@ 15 A, Pulse, TJ = 125 °C
@VR = rated VR
TJ = 25 °C
@VR = rated VR
TJ = 125 °C
@VR = 5V, TC = 25 °C
fSIG = 1MHz
Measured lead to lead 5 mm from
package body
-
Max.
1.00
0.80
1.0
6.0
400
8.0
10,000
Units
V
V
mA
mA
pF
nH
V/μs
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature
Storage Temperature
Maximum Thermal
Resistance Junction to Case
Maximum Thermal
Resistance, Case to Heat
Sink
Maximum Thermal
Resistance, Case to Heat
Sink
Approximate Weight
Case Style
Symbol
TJ
Tstg
Condition
-
-
RθJC DC operation
RθJA DC operation
RθCS
wt
Mounting surface, smooth and
greased
-
ITO-220AB
Specification
-55 to +150
-55 to +150
2.0
Units
°C
°C
°C/W
60 °C/W
0.50
2
°C/W
g
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 •
• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet MBRF30150CT.PDF ] | |
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