PDF Si4010-C2 Data sheet ( Hoja de datos )

Número de pieza	Si4010-C2
Descripción	CRYSTAL-LESS SOC RF TRANSMITTER
Fabricantes	Silicon Laboratories
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Si4010-C2 CRYSTAL-LESS SOC RF TRANSMITTER Features  Crystal-less operation  Single Coin-Cell Battery Operation Optional crystal oscillator input Supply voltage: 1.8 to 3.6 V  High-Speed 8051 µC Core Standby current < 10 nA Pipeline instruction architecture  High-performance RF transmitter 70% of instructions in 1 or 2 clocks Frequency range: 27–960 MHz Up to 24 MIPs with 24 MHz clock +10 dBm output power, 4 kB RAM/8kB NVM adjustable 128 bit EEPROM Automatic antenna tuning 256 byte of internal data RAM Symbol rate up to 100 kbps 12 kB ROM embedded functions FSK/OOK modulation 8 byte low leakage RAM Manchester, NRZ, 4/5 encoder  Extensive Digital Peripherals  Analog Peripherals 128 bit AES accelerator LDO regulator with POR circuit 5/9 GPIO with wakeup functionality Battery voltage monitor LED driver Data serializer High-speed frequency counter On-chip debugging: C2 Unique 4 byte serial number  Temperature range –40 to +85 °C  Automotive quality option,  AEC-Q100 (Pending final qualification testing)  10-pin MSOP/14-pin SOIC Ultra low-power sleep timer Applications  Garage and gate door openers  Remote keyless entry  Home automation and security  Wireless remote controls Description The Si4010 is a fully integrated crystal-less CMOS SoC RF transmitter with an embedded CIP-51 8051 MCU. The device can operate over the –40 to 85 °C temperature range without requiring an external crystal reference source reducing board area and BOM cost. The device includes an 8 kB non volatile memory block for programming the user's application along with a 12 kB ROM of embedded support code for use in the user's application. The Si4010 includes Silicon Laboratories' 2-wire C2 Debug and Programming interface, which allows customers to download their code during the development stage into the on-board RAM for testing and debug prior to programming the NVM. The Si4010 is designed for low power battery applications with standby currents of less than 10 nA to optimize battery life and features automatic wake on button press support to efficiently move from the standby to active mode state with minimal customer code support. Built in AES-128 hardware encryption along with a 128-bit EEPROM can be used to create robust data encryption of the transmitted packets. A unique 4-byte serial number is programmed into each device ensuring non-overlapping device identifiers. The RF transmitter features a high efficiency PA capable of delivering output power up to +10 dBm and includes an automatic antenna tuning algorithm. This algorithm adjusts the antenna tuning at the start of each packet transmission for optimal output power minimizing the impact of antenna impedance changes due to the remote being held in a user hand. The devices supports FSK and OOK modulations and includes automatic output power shaping to reduce spectral spreading and ease regulatory compliance. The output frequency can be adjusted via software over the entire 27 to 960 MHz range. The output data rate is software adjustable up to a maximum rate of 100 kbps. Ordering Information: See page 15. Pin Assignments GPIO0/XTAL 1 10 GPIO1 GND 2 9 GPIO2 TXM 3 Si4010-GT 8 GPIO3 TXP 4 7 GPIO4 VDD 5 6 LED 10-Pin MSOP GPIO9 1 VPP/GPIO0/XTAL 2 GND 3 TXM 4 TXP 5 VDD 6 GPIO7 7 Si4010-GS 14 GPIO8 13 GPIO1 12 GPIO2 11 GPIO3 10 C2DAT/GPIO4 9 C2CLK/LED 8 GPIO6 14-Pin SOIC Patents pending Rev. 1.0 2/11 Copyright © 2011 by Silicon Laboratories Si4010 1 page Si4010-C2 30. Port Input/Output. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .108 30.1. GPIO Pin Special Roles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 30.2. Pullup Roff Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 30.3. Matrix Mode Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112 30.4. Pullup Roff and Matrix Mode Option Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 30.5. Special GPIO Modes Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115 30.6. LED Driver on GPIO[5]. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117 31. Clock Output Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 31.1. Register Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .124 32. Control and System Setting Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .126 33. Real Time Clock Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 33.1. RTC Interrupt Flag Time Uniformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129 33.2. Register Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .129 34. Timers 2 and 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 34.1. Interrupt Flag Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 34.2. 16-bit Timer with Auto Reload (Wide Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 34.3. 16-bit Capture Mode (Wide Mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133 34.4. 8-Bit Timer/Timer Mode (Split Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134 34.5. 8-Bit Capture/Capture Mode (Split Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135 34.6. 8-Bit Timer/Capture Mode (Split Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 35. C2 Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 35.1. C2 Pin Sharing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148 36. IDE Development Environment and Debugging Chain . . . . . . . . . . . . . . . . . . . . . . . . 151 36.1. Functionality Limitations While Using IDE Development Environment . . . . . . . . . 151 36.2. Chip Shutdown Limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 36.3. LED Driver Usage while Using IDE Debugging Chain . . . . . . . . . . . . . . . . . . . . . . 152 37. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 154 Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155 Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 156 Rev. 1.0 5 5 Page Si4010-C2 1. System Overview The Si4010 is a fully integrated crystal-less CMOS SoC RF transmitter with an embedded CIP-51 8051 MCU designed for the sub 1 GHz ISM frequency bands. This chip is optimized for battery powered applica- tions with operating voltages from 1.8 to 3.6 V and ultra-low current consumption with a standby current of less than 10 nA. The high power amplifier can supply up to +10 dBm output power with 19.5 dB of pro- grammable range. Moreover, the SoC transmitter includes a patented antenna tuning circuit that automati- cally fine tunes the resonance frequency and impedance matching between the PA output and the connected antenna for optimum transmit efficiency and low harmonic content. FSK and OOK modulation is supported with symbol rates up to 100 kbps. Like all wireless devices, users are responsible for complying with applicable local regulatory requirements for radio transmissions. The embedded CIP-51 8051 MCU provides the core functionality of the Si4010. User software has com- plete control of all peripherals, and may individually shut down any or all peripherals for power savings. A space of 8 kB of on-chip one-time programmable NVM memory is available to store the user program and can also store unique transmit IDs. In case of power outages due to battery removal, 128 bits of EEPROM is available for counter or other operations providing non-volatile storage capability. A library of useful soft- ware functions such as AES encryption, a patented 32-bit counter providing 1 M cycles of read/write endurance, and many other functions are included in the 12 kB of ROM to reduce user design time and code space. General purpose input/output pins with push button wake-on touch capability, a programma- ble system clock, and ultra low power timers are also available to further reduce current consumption. The Si4010 includes Silicon Laboratories' 2-wire C2 Debug and Programming interface. This debug logic supports memory inspection, viewing and modification of special function registers (SFR), setting break points, single stepping, and run and halt commands. All analog and digital peripherals are fully functional while debugging using C2. The two C2 interface pins can be shared with user functions, allowing in-system debugging without occupying package pins. The device leverages Silicon Labs' patented and proven crystal-less oscillator technology and offers better than ±150 ppm carrier frequency stability over the temperature range of 0 to + 70 °C and ±250 ppm carrier frequency stability over the industrial range of –40 to + 85 °C without the use of an external crystal or fre- quency reference. The internal MCU automatically calibrates the on-chip voltage controlled oscillator (LCOSC) which forms the output carrier frequency for process and temperature variations. An external 1- pin crystal oscillator option is available for applications requiring tighter frequency tolerances. Digital integration reduces the amount of required external components compared to traditional offerings, resulting in a solution that only requires a printed circuit board (PCB) implementation area of approximately 25 by 50 mm (including battery, switches, and 25 mm2 antenna). The high integration of the Si4010 improves the system manufacturing reliability and quality and minimizes costs. This chip offers industry leading RF performance, high integration, flexibility, low BOM, small board area, and ease of design. No production alignment is necessary as all RF functions are integrated into the device. Rev. 1.0 11 11 Page

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