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PDF BTA316B-600BT Data sheet ( Hoja de datos )
| Número de pieza | BTA316B-600BT | |
| Descripción | 3Q Hi-Com Triac | |
| Fabricantes | NXP Semiconductors | |
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BTA316B-600BT
3Q Hi-Com Triac
6 August 2014
Product data sheet
1. General description
Planar passivated high commutation three quadrant triac in a SOT404 (D2PAK) surface
mountable plastic package intended for use in circuits where high static and dynamic dV/
dt and high dI/dt can occur. This "series BT" triac will commutate the full RMS current at
the maximum rated junction temperature (Tj(max) = 150 °C) without the aid of a snubber. It
is used in applications where "high junction operating temperature capability" is required.
2. Features and benefits
• 3Q technology for improved noise immunity
• High commutation capability with maximum false trigger immunity
• High immunity to false turn-on by dV/dt
• High junction operating temperature capability
• High voltage capability
• Less sensitive gate for very high noise immunity
• Planar passivated for voltage ruggedness and reliability
• Surface mountable package
• Triggering in three quadrants only
3. Applications
• Applications subject to high temperature
• Electronic thermostats (heating and cooling)
• High power motor controls e.g. washing machines and vacuum cleaners
• Rectifier-fed DC inductive loads e.g. DC motors and solenoids
4. Quick reference data
Table 1.
Symbol
VDRM
ITSM
Tj
IT(RMS)
Quick reference data
Parameter
Conditions
repetitive peak off-
state voltage
non-repetitive peak on- full sine wave; Tj(init) = 25 °C;
state current
tp = 20 ms; Fig. 4; Fig. 5
junction temperature
RMS on-state current full sine wave; Tmb ≤ 120 °C; Fig. 1;
Fig. 2; Fig. 3
Min Typ Max Unit
- - 600 V
- - 140 A
- - 150 °C
- - 16 A
Scan or click this QR code to view the latest information for this product
1 page  
NXP Semiconductors
BTA316B-600BT
3Q Hi-Com Triac
103
ITSM
(A)
(1)
003aab671
102
IT ITSM
t
tp
Tj(init) = 25 °C max
10
10-5
10-4
10-3
10-2
10-1
tp (s)
tp ≤ 20 ms
(1) dIT/dt limit
Fig. 5. Non-repetitive peak on-state current as a function of pulse duration; maximum values
BTA316B-600BT
Product data sheet
All information provided in this document is subject to legal disclaimers.
6 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
5 / 14
5 Page 
NXP Semiconductors
11. Soldering
1.50
2.25 2.15
8.15 8.35
1.50
4.60
BTA316B-600BT
3Q Hi-Com Triac
10.85
10.60
10.50
7.50
7.40
1.70
8.275
4.85
7.95
0.30
3.00
5.40
8.075
0.20
solder lands
solder resist
occupied area
solder paste
Fig. 13. Reflow soldering footprint for D2PAK (SOT404)
5.08
1.20
1.30
1.55
msd057
BTA316B-600BT
Product data sheet
All information provided in this document is subject to legal disclaimers.
6 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
11 / 14
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