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PDF STTH1002C-Y Data sheet ( Hoja de datos )
| Número de pieza | STTH1002C-Y | |
| Descripción | Automotive high efficiency ultrafast diode | |
| Fabricantes | STMicroelectronics | |
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STTH1002C-Y
Automotive high efficiency ultrafast diode
Features
■ Suited for SMPS
■ Low losses
■ Low forward and reverse recovery times
■ High junction temperature
■ Low leakage current
■ AEC-Q101 qualified
Description
Dual center tap rectifier suited for switch mode
power supplies and high frequency DC to DC
converters.
Packaged in DPAK and D2PAK, this device is
intended for use in low voltage, high frequency
inverters, free wheeling and polarity protection for
automotive applications.
A1
A2
K
K A2
A1
DPAK
STTH1002CBY
K
K
K A2
A1
D2PAK
STTH1002CGY
Table 1. Device summary
Symbol
Value
IF(AV)
VRRM
Tj (max)
VF(typ)
trr (typ)
Up to 2 x 8 A
200 V
175 °C
0.78 V
20 ns
November 2011
Doc ID 17536 Rev 2
1/9
www.st.com
9
1 page  
STTH1002C-Y
Characteristics
Figure 7.
trr(ns)
80
IF=5A
VR=160V
70
60
50
40
30
20
10
0
10
Reverse recovery time versus dIF/dt Figure 8.
(typical values, per diode)
Tj=125°C
Tj=25°C
dIF/dt(A/µs)
100
1000
IRM(A)
13
12
IF=5A
VR=160V
11
10
9
8
7
6
5
4
3
2
1
0
10
Peak reverse recovery current
versus dIF/dt
(typical values, per diode)
Tj=125°C
dIF/dt(A/µs)
100
Tj=25°C
1000
Figure 9. Dynamic parameters versus
junction temperature
Qrr;IRM[Tj]/Qrr;IRM[Tj=125°C]
1.4
IF=5A
VR=160V
1.2
1.0
IRM
0.8
Qrr
0.6
0.4
0.2
Tj(°C)
0.0
25 50 75 100
125
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab for D2PAK
Rth(j-a)(°C/W)
80
Epoxy printed circuit board FR4, copper thickness = 35 µm
70
60
50
40
30
20
10
S(Cu)(cm²)
0
150 0 2 4 6 8 10 12 14 16 18 20
Figure 11.
Thermal resistance junction to ambient versus copper surface under tab (Epoxy
printed circuit board FR4, copper thickness = 35 µm) for DPAK
Rth(j-a)(°C/W)
100
90
80
70
60
50
40
30
20
10 S(Cu)(cm²)
0
0 2 4 6 8 10 12 14 16 18 20
Doc ID 17536 Rev 2
5/9
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet STTH1002C-Y.PDF ] | |
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