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PDF SZESD9B5.0ST5G Data sheet ( Hoja de datos )
| Número de pieza | SZESD9B5.0ST5G | |
| Descripción | TVS Diode ( Rectifier ) | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de SZESD9B5.0ST5G (archivo pdf) en la parte inferior de esta página. Total 4 Páginas | ||
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ESD9B, SZESD9B
Transient Voltage
Suppressors
Micro−Packaged Diodes for ESD Protection
The ESD9B Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size, it is suited for use in
cellular phones, MP3 players, digital cameras and many other portable
applications where board space comes at a premium.
Specification Features
• Low Capacitance 15 pF
• Low Clamping Voltage
• Small Body Outline Dimensions: 0.039″ x 0.024″ (1.0mm x 0.60mm)
• Low Body Height: 0.016″ (0.4 mm)
• Stand−off Voltage: 3.3 V, 5 V
• Low Leakage
• Response Time is < 1 ns
• IEC61000−4−2 Level 4 ESD Protection
• AEC−Q101 Qualified and PPAP Capable
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
• This is a Pb−Free Device
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
±18 kV
±18
IEC 61000−4−4 (EFT)
40 A
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
°PD°
RqJA
TJ, Tstg
TL
300 mW
400
−55 to +150
260
°C/W
°C
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
http://onsemi.com
SOD−923
CASE 514AB
MARKING DIAGRAM
XM
X = Specific Device Code
M Date Code
ORDERING INFORMATION
Device
Package
Shipping†
ESD9B3.3ST5G
SOD−923 8000/Tape & Reel
(Pb−Free)
ESD9B5.0ST5G
SOD−923 8000/Tape & Reel
(Pb−Free)
SZESD9B5.0ST5G SOD−923 8000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
December, 2011 − Rev. 2
1
Publication Order Number:
ESD9B/D
Free Datasheet http://www.datasheet4u.com/
1 page | ||
| Páginas | Total 4 Páginas | |
| PDF Descargar | [ Datasheet SZESD9B5.0ST5G.PDF ] | |
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