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PDF ESD7461 Data sheet ( Hoja de datos )

Número de pieza ESD7461
Descripción Ultra-Low Capacitance ESD Protection
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ESD7461, SZESD7461
Ultra-Low Capacitance ESD
Protection
MicroPackaged Diodes for ESD Protection
The ESD7461 is designed to protect voltage sensitive components
that require ultralow capacitance from ESD and transient voltage
events. It has industry leading capacitance linearity over voltage
making it ideal for RF applications. This capacitance linearity
combined with the extremely small package and low insertion loss
makes this part well suited for use in antenna line applications for
wireless handsets and terminals.
Features
Industry Leading Capacitance Linearity Over Voltage
UltraLow Capacitance: 0.3 pF Typ
Insertion Loss: 0.05 dB at 1 GHz; 0.21 dB at 3 GHz
Low Leakage: < 1 nA
Protection for the following IEC Standards:
IEC6100042 (ESD): Level 4 ±18 kV Contact
IEC6100044 (EFT): 40 A 5/50 ns
IEC6100045 (Lightning): 1 A (8/20 ms)
ISO 10605 (ESD) 330 pF/2 kW ±23 kV Contact
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
RF Signal ESD Protection
RF Switching, PA, and Antenna ESD Protection
Near Field Communications
USB 2.0, USB 3.0
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
IEC 6100042 (ESD) (Note 1)
Total Power Dissipation (Note 2) @ TA = 25°C
Thermal Resistance, JunctiontoAmbient
Junction and Storage Temperature Range
°PD°
RqJA
TJ, Tstg
±18
300
400
55 to
+150
kV
mW
°C/W
°C
Lead Solder Temperature Maximum
(10 Second Duration)
TL 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Nonrepetitive current pulse at TA = 25°C, per IEC6100042 waveform.
2. Mounted with recommended minimum pad size, DC board FR4
http://onsemi.com
XDFN2
CASE 711AM
MARKING
DIAGRAM
XX M
G
XX = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
Package
Shipping
ESD7461N2T5G
XDFN2 8000 / Tape &
(PbFree)
Reel
SZESD7461N2T5G XDFN2 8000 / Tape &
(PbFree)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
August, 2014 Rev. 0
1
Publication Order Number:
ESD7461/D

1 page




ESD7461 pdf
ESD7461, SZESD7461
25 25
20 20
15 15
10 10
5 5
0
0
NOTE:
5 10 15 20 25 30 35 40 45
0
0 5 10 15 20 25 30 35 40 45
VC, VOLTAGE (V)
Figure 7. Positive TLP IV Curve
VC, VOLTAGE (V)
Figure 8. Negative TLP IV Curve
TLP parameter: Z0 = 50 W, tp = 100 ns, tr = 300 ps, averaging window: t1 = 30 ns to t2 = 60 ns. VIEC is the equivalent voltage
stress level calculated at the secondary peak of the IEC 6100042 waveform at t = 30 ns with 2 A/kV. See TLP description
below for more information.
Transmission Line Pulse (TLP) Measurement
Transmission Line Pulse (TLP) provides current versus
voltage (IV) curves in which each data point is obtained
from a 100 ns long rectangular pulse from a charged
transmission line. A simplified schematic of a typical TLP
system is shown in Figure 9. TLP IV curves of ESD
protection devices accurately demonstrate the product’s
ESD capability because the 10s of amps current levels and
under 100 ns time scale match those of an ESD event. This
is illustrated in Figure 10 where an 8 kV IEC 6100042
current waveform is compared with TLP current pulses at
8 A and 16 A. A TLP IV curve shows the voltage at which
the device turns on as well as how well the device clamps
voltage over a range of current levels.
L
50 W Coax
Cable
S Attenuator
÷
50 W Coax
Cable
10 MW
IM VM
VC DUT
Oscilloscope
Figure 9. Simplified Schematic of a Typical TLP
System
Figure 10. Comparison Between 8 kV IEC 6100042 and 8 A and 16 A TLP Waveforms
http://onsemi.com
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