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PDF ESD7451 Data sheet ( Hoja de datos )
| Número de pieza | ESD7451 | |
| Descripción | ESD Protection Diode | |
| Fabricantes | ON Semiconductor | |
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ESD7451, SZESD7451
ESD Protection Diodes
Micro−Packaged Diodes for ESD Protection
The ESD7451 is designed to protect voltage sensitive components
that require ultra−low capacitance from ESD and transient voltage
events. Excellent clamping capability, low capacitance, low leakage,
and fast response time, make these parts ideal for ESD protection on
designs where board space is at a premium. Because of its low
capacitance, the part is well suited for use in high frequency designs
such as USB 2.0 high speed and antenna line applications.
Features
• Ultra−Low Capacitance (0.35 pF Max)
• Low Clamping Voltage
• Stand−off Voltage: 3.3 V
• Low Leakage
• Response Time is < 1 ns
• Low Dynamic Resistance < 1 W
• IEC61000−4−2 Level 4 ESD Protection
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
• RF Signal ESD Protection
• RF Switching, PA, and Antenna ESD Protection
• Near Field Communications
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
±25 kV
±25
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
°PD°
RqJA
TJ, Tstg
TL
250 mW
400 °C/W
−55 to +150 °C
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
http://onsemi.com
1
Cathode
2
Anode
XDFN2
CASE 711AM
MARKING
DIAGRAM
EM
G
E = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
Package
Shipping†
ESD7451N2T5G
XDFN2 8000 / Tape &
(Pb−Free)
Reel
SZESD7451N2T5G XDFN2 8000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2014
June, 2014 − Rev. 2
1
Publication Order Number:
ESD7451/D
1 page  
ESD7451, SZESD7451
PACKAGE DIMENSIONS
XDFN2 1.0x0.6, 0.65P (SOD−882)
CASE 711AM
ISSUE O
0.10 C
D
ÉÉPIN 1
INDICATOR
AB
E
TOP VIEW
0.05 C
0.10 C
NOTE 3 A
0.10 C
A1
SIDE VIEW
C
SEATING
PLANE
e
e/2
b
0.05 M C A B
1
2X L
0.05 M C A B
BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. EXPOSED COPPER ALLOWED AS SHOWN.
MILLIMETERS
DIM MIN MAX
A 0.34 0.44
A1 −−− 0.05
b 0.43 0.53
D 1.00 BSC
E 0.60 BSC
e 0.65 BSC
L 0.20 0.30
RECOMMENDED
SOLDER FOOTPRINT*
2X 0.47
1.20
2X
0.60
PIN 1
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
http://onsemi.com
5
ESD7451/D
5 Page | ||
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| PDF Descargar | [ Datasheet ESD7451.PDF ] | |
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