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PDF ESD8011 Data sheet ( Hoja de datos )

Número de pieza ESD8011
Descripción ESD Protection Diode
Fabricantes ON Semiconductor 
Logotipo ON Semiconductor Logotipo



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ESD8011
ESD Protection Diodes
Ultra Low Capacitance ESD Protection
Diode for High Speed Data Line
The ESD8011 ESD protection diodes are designed to protect high
speed data lines from ESD. Ultra−low capacitance and low ESD
clamping voltage make this device an ideal solution for protecting
voltage sensitive high speed data lines.
Features
Ultra Low Capacitance (0.10 pF Typ, I/O to GND)
Protection for the Following IEC Standards:
IEC 61000−4−2 (Level 4)
Low ESD Clamping Voltage
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
USB 3.x
MHL 2.0
SATA/SAS
PCI Express
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range TJ −55 to +125 °C
Storage Temperature Range
Tstg − 55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
TL 260 °C
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
ESD
ESD
±20 kV
±20 kV
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
www.onsemi.com
X3DFN2
CASE 152AF
MARKING
DIAGRAM
PIN 1
M
R = Specific Device Code
(Rotated 90° clockwise)
M = Date Code
PIN CONFIGURATION
AND SCHEMATIC
12
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
See Application Note AND8308/D for further description of
survivability specs.
© Semiconductor Components Industries, LLC, 2015
February, 2015 − Rev. 1
1
Publication Order Number:
ESD8011/D

1 page




ESD8011 pdf
ESD8011
Latch−Up Considerations
ON Semiconductor’s 8000 series of ESD protection
devices utilize a snap−back, SCR type structure. By using
this technology, the potential for a latch−up condition was
taken into account by performing load line analyses of
common high speed serial interfaces. Example load lines for
latch−up free applications and applications with the
potential for latch−up are shown below with a generic IV
characteristic of a snapback, SCR type structured device
overlaid on each. In the latch−up free load line case, the IV
characteristic of the snapback protection device intersects
the load−line in one unique point (VOP, IOP). This is the only
I
stable operating point of the circuit and the system is
therefore latch−up free. In the non−latch up free load line
case, the IV characteristic of the snapback protection device
intersects the load−line in two points (VOPA, IOPA) and
(VOPB, IOPB). Therefore in this case, the potential for
latch−up exists if the system settles at (VOPB, IOPB) after a
transient. Because of this, ESD8011 should not be used for
HDMI applications − ESD8104 or ESD8040 have been
designed to be acceptable for HDMI applications without
latch−up. Please refer to Application Note AND9116/D for
a more in−depth explanation of latch−up considerations
using ESD8000 series devices.
I
ISSMAX
IOP
VOP
VDD
V
ESD8011 Latch−up free:
USB 2.0 LS/FS, USB 2.0 HS, USB 3.0 SS,
DisplayPort
ISSMAX
IIOOPPAB
VOPB
VOPA VDD
ESD8011 Potential Latch−up:
HDMI 1.4/1.3a TMDS
V
Figure 4. Example Load Lines for Latch−up Free Applications and Applications with the Potential for Latch−up
Table 1. SUMMARY OF SCR REQUIREMENTS FOR LATCH−UP FREE APPLICATIONS
VBR (min)
IH (min)
VH (min)
ON Semiconductor ESD8000 Series
Application
(V) (mA) (V)
Recommended PN
HDMI 1.4/1.3a TMDS
3.465
54.78
1.0
ESD8104, ESD8040
USB 2.0 LS/FS
3.301
1.76
1.0
ESD8004, ESD8011
USB 2.0 HS
0.482
N/A
1.0
ESD8004, ESD8011
USB 3.0 SS
2.800
N/A
1.0
ESD8004, ESD8006, ESD8011
DisplayPort
3.600
25.00
1.0
ESD8004, ESD8006, ESD8011
www.onsemi.com
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