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PDF BTS5482SF Data sheet ( Hoja de datos )

Número de pieza BTS5482SF
Descripción SPI Power Controller
Fabricantes Infineon Technologies 
Logotipo Infineon Technologies Logotipo



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No Preview Available ! BTS5482SF Hoja de datos, Descripción, Manual

SPOC - BTS5482SF
SPI Power Controller
For Advanced Front Light Control
Data Sheet
Rev. 1.0, 2013-06-05
Automotive Power

1 page




BTS5482SF pdf
SPOC - BTS5482SF
Overview
Configuration and status diagnosis are done via SPI. The SPI is daisy chain capable. The device provides a
current sense signal per channel that is multiplexed to the diagnosis pin IS. It can be enabled and disabled via SPI
commands. An over load and over temperature flag is provided in the SPI diagnosis word. A multiplexed switch
bypass monitor provides short-circuit to VS diagnosis. In OFF-state a current source can be switched to the output
of one selected channel in order to detect an open load.
The device provides an external driver capability for two external devices. For each external driver there are two
control outputs available: one output for controlling the input and one output for diagnosis enable input. The current
sense output of the external smart power drivers can be connected to the IS pin.
The SPOC - BTS5482SF provides a fail-safe feature via limp home input pin.
The power transistors are built by N-channel vertical power MOSFETs with charge pumps.
Protective Functions
• Reverse battery protection with external components
• ReversaveTM - Reverse battery protection by self turn-on of channels 0, 1, 2 and 3
• Short circuit protection
• Over load protection
• Thermal shutdown with latch and dynamic temperature protection
• Over current tripping
• Over voltage protection
• Loss of ground protection
• Electrostatic discharge protection (ESD)
Diagnostic Functions
• Multiplexed proportional load current sense signal (IS)
• Enable function for current sense signal configurable via SPI
• High accuracy of current sense signal at wide load current range
• Current sense ratio (kILIS) configurable for LEDs or bulbs for channel 2 and 3
• Very fast diagnosis in LED mode
• Feedback on over temperature and over load via SPI
• Multiplexed switch bypass monitor provides short circuit to VS detection
• Integrated, in two steps programmable current source for open load in OFF-state detection
Application Specific Functions
• Fail-safe activation via LHI pin
• Control of two additional loads with external smart power switches
Applications
• High-side power switch for 12 V grounded loads in automotive applications
• Especially designed for standard exterior lighting like high beam, low beam, indicator, parking light and
equivalent LED modules.
• Load type configuration via SPI (bulbs or LEDs) for optimized load control
• Replaces electromechanical relays, fuses and discrete circuits
Data Sheet
5 Rev. 1.0, 2013-06-05

5 Page





BTS5482SF arduino
SPOC - BTS5482SF
Electrical Characteristics
Absolute Maximum Ratings (cont’d)1)
Tj = -40 to +150 °C; all voltages with respect to ground
(unless otherwise specified)
Pos. Parameter
Symbol Limit Values Unit Conditions
min. max.
4.1.20 Voltage at serial output pin
4.1.21 Current through serial output pin
Limp Home Pin
VSO -0.3 VDD + 0.3 V –
ISO -2.0 2.0 mA t 2 min.
4.1.22 Voltage at limp home input pin
4.1.23 Current through limp home input pin
VLHI -0.3 5.5
V–
ILHI
-0.75 0.75
mA –
-2.0 2.0
t 2 min.
External Driver Pins
4.1.24 Voltage at external driver output
VEDO
4.1.25 Current through external driver output
IEDO
4.1.26 Voltage at external driver diagnosis enable
VEDD
4.1.27 Current through external driver diagnosis enable IEDD
Temperatures
-0.3
-1.0
-0.3
-1.0
VDD + 0.3 V
1.0 mA
VDD + 0.3 V
1.0 mA
t 2 min.
t 2 min.
4.1.28 Junction temperature
Tj -40 150 °C –
4.1.29 Dynamic temperature increase while switching Tj
60 K –
4.1.30 Storage temperature
Tstg -55 150 °C –
ESD Susceptibility
4.1.31 ESD susceptibility HBM
VESD
OUT pins vs. VS
other pins incl. OUT vs. GND
-4
-2
4
2
kV HBM 8)
1) Not subject to production test, specified by design.
2) Device is mounted on an FR4 2s2p board according to Jedec JESD51-2,-5,-7 at natural convection; The product
(chip+package) was simulated on a 76.4 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 µm Cu, 2 x 35 µm Cu).
Where applicable, a thermal via array under the package contacted the first inner copper layer.
3) In accordance to AEC Q100-012 and AEC Q101-006.
4) RI is the internal resistance of the load dump pulse generator.
5) No protection mechanism available. Inverse current needs to be limited by external circuitry to prevent overheating.
6) Over current protection is an integrated protection function.
7) Pulse shape represents inductive switch off: ID(t) = ID(0) × (1 - t / tpulse); 0 < t < tpulse
8) ESD resistivity, HBM according to ANSI/ESDA/JEDEC JS-001-2010
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Data Sheet
11 Rev. 1.0, 2013-06-05

11 Page







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