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PDF TSM100-33 Data sheet ( Hoja de datos )

Número de pieza TSM100-33
Descripción Surface Mount Devices
Fabricantes SPSEMI　
Logotipo SPSEMI Logotipo



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No Preview Available ! TSM100-33 Hoja de datos, Descripción, Manual

PPTC/TSM Series
Features
Surface Mount Devices
Lead free deivce
Size 5045mm/2018 mils
Surface Mount packaging for automated assembly
Agency recognition:
Applications
Almost anywhere there is a low voltage
power supply, up to DC60V and a load
to be protested, including:
Computer mother board, Modem.
Telecommunication equipments
A
B ZZZ
Dimensions (mm)
1.5 ±0.1
1.5 ±0.1
DC
3.4 ±0.1
Model
TSM030
TSM050
TSM100
TSM100/33
TSM150
TSM200
min
4.44
4.44
4.44
4.44
4.44
4.44
Product dimensions (mm)
AB
max min max min
4.72 4.22 4.93 0.60
4.72 4.22 4.93 0.60
4.72 4.22 4.93 0.45
4.72 4.22 4.93 0.45
4.72 4.22 4.93 0.45
4.72 4.22 4.93 0.45
C
max
1.10
1.10
0.80
0.80
0.80
0.80
D
min
0.30
0.30
0.30
0.30
0.30
0.30
Environmental Specifications
Test
Conditions
Passive aging
Humidity aging
Thermal shock
85℃,1000hrs
85℃,85%℃R.H.,168hrs
85℃,to-40℃,13times
Resistance to solvent
MIL-STD-202,Method 215
Vibration
MIL-STD-202,Method 201
Ambient operating confitions:-40℃ to 85℃
Maximum surface of the device in the tripped state is 125℃
Resistance change
±5% typical
±5% typical
±33% typical
No change
No change
Terminal pad materials
Terminal pad solderability
Termination pad characteristics
Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper
Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
REV.2014.05.01
01 | www.spsemi.cn

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