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PDF MPXC12DT1 Data sheet ( Hoja de datos )
| Número de pieza | MPXC12DT1 | |
| Descripción | 10 kPa Uncompensated Silicon Pressure Sensor | |
| Fabricantes | Freescale Semiconductor | |
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Freescale Semiconductor
Pressure
MPXC12DT1
Rev 0, 11/2010
10 kPa Uncompensated Silicon
Pressure Sensor
MPXC12DT1
Freescale Semiconductor has developed a low cost, high volume, miniature
pressure sensor package which is ideal as a sub-module component or a
disposable unit. The unique concept of the Chip Pak allows great flexibility in
system design while allowing an economic solution for the designer.This
standard, low cost, uncompensated sensor permits manufacturers to design
and add their own external temperature compensating and signal conditioning
networks. Compensation techniques are simplified because of Freescale’s
single element strain gauge design.
Features
• Low Cost
• Ratiometric to Supply Voltage
• Polysulfone Case Material (ISO 10993)
• Provided in Easy-to-Use Tape and Reel
• Patented Silicon Shear Stress Strain Gauge Design
Pressure Sensor
55 mV Full Scale Span (Typical)
0 to 10 kPa
Application Examples
• Respiratory Diagnostics
Device Name
MPXC12DTI
Package Options
Tape and Reel
ORDERING INFORMATION
Case No.
Gauge
Pressure Type
Differential
423A
•
Absolute
Device Marking
Date Code, Lot ID
CHIP PAK PACKAGE
MPXC12DT1
CASE 423A
NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device).
Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices
during all processes.
© Freescale Semiconductor, Inc., 2010. All rights reserved.
1 page  
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Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.,
Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their
respective owners.
© Freescale Semiconductor, Inc. 2010. All rights reserved.
MPXC12DT1
Rev. 0
11/2010
5 Page | ||
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