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PDF MPXV5100 Data sheet ( Hoja de datos )
| Número de pieza | MPXV5100 | |
| Descripción | Integrated Silicon Pressure Sensor | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Pressure
Freescale Semiconductor
MPX5100
Rev 13, 05/2010
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly
those employing a microcontroller or microprocessor with A/D inputs. This patented,
single element transducer combines advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Patented Silicon Shear Stress Strain Gauge
• Available in Absolute, Differential and Gauge Configuration
• Durable Epoxy Unibody Element
• Easy-to-Use Chip Carrier Option
MPX5100
MPXV5100
Series
0 to 100 kPa (0 to 14.5 psi)
15 to 115 kPa (2.2 to 16.7 psi)
0.2 to 4.7 V Output
Typical Applications
• Patient Monitoring
• Process Control
• Pump/Motor Control
• Pressure Switching
Device Name
Case
No.
Unibody Package (MPX5100 Series)
None
MPX5100A
MPX5100AP
867
867B
•
MPX5100D
MPX5100DP
867
867C
•
MPX5100GP
867B
Small Outline Package (MPXV5100 Series)
MPXV5100GC6U
MPXV5100GC7U
MPXV5100DP
MPXV5100GP
482A
482C
1351
1369
ORDERING INFORMATION
# of Ports
Single
Dual
Gauge
Pressure Type
Differential Absolute
•
••
•
••
••
•
•
•
•
•
•
•
•
Device
Marking
MPX5100A
MPX5100AP
MPX5100D
MPX5100DP
MPX5100GP
MPXV5100G
MPXV5100G
MPXV5100DP
MPXV5100GP
© Freescale Semiconductor, Inc., 2005-2010. All rights reserved.
1 page  
On-chip Temperature Compensation and Calibration
Pressure
Figure 3 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0° to 85°C using the decoupling circuit shown in Figure 5. The
output will saturate outside of the specified pressure range.
Figure 4 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm.
The MPX5100 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
5
4
±Vo(uPt r=esVsSu*r(e0.E0r0r9o*rP*+T0e.m04p)erature
PVES
=
=
5.0
2.5
V
±
0.25
Vdc
Factor
*
0.009
*
VS)
TM = 1
TEMP = 0 to 85°C
3
MAX
2 TYP
1
MIN
0
Pressure (kPa)
(Typ)
Offset
Figure 3. Output vs. Pressure Differential
Fluorosilicone
Gel Die Coat
Wire Bond
Die
Stainless Steel
Metal Cover
Epoxy Plastic
Case
Fluorosilicone Gel
Die Coat
Die
Wire Bond
Stainless Steel
Metal Cover
Epoxy Plastic
Case
Lead Frame
Differential/Gauge Element
Die Bond
Lead Frame
Absolute Element
Die Bond
Figure 4. Cross Sectional Diagrams (not to scale)
Figure 5 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
1.0 μF
0.01 μF
+5.0 V
VOUT
Vs
IPS
GND
OUTPUT
470 pF
Figure 5. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
Sensors
Freescale Semiconductor
MPX5100
5
5 Page 
PACKAGE DIMENSIONS
Pressure
Sensors
Freescale Semiconductor
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
PAGE 1 OF 2
MPX5100
11
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet MPXV5100.PDF ] | |
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