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PDF AS8506C Data sheet ( Hoja de datos )
| Número de pieza | AS8506C | |
| Descripción | Battery Cell Monitor and Balancer IC | |
| Fabricantes | ams | |
| Logotipo |  |
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General Description
AS8506C
Battery Cell Monitor and Balancer IC
The AS8506C is a battery management IC dedicated to support
cell voltage measurement, monitoring, cell balancing and
temperature measurement functions in Li-Ion battery stacks for
industrial/consumer/PV battery applications.
Ambient temperature range is from -40°C to +85°C.
It features cell voltage diagnosis with externally adjustable
upper and lower cell voltage limits, fast cell voltage capture on
request through 12-bit SAR ADC, passive cell balancing by
simultaneous comparison of actual cell voltages with a
reference cell voltage and temperature measurement on two
external NTC sensors through 12-bit ADC.
Cells that are above reference will sequentially be discharged
through integrated switches and one external resistor.
There is also an active balancing option AS8506C A through
factory setting to sequentially charge cells which are below
reference from an external DC-DC Flyback converter and an
integrated low side driver.
The device can be used flexibly for battery stacks up to 7 cells
with a minimum stack voltage of 6V and a maximum stack
voltage of 32V.
It can be chained to support battery packs of virtually any
number of cells in synchronized mode through chained clock
and trigger signal.
The status of the battery stack is communicated to outside
world through OR’d voltage_ok signal and balance ready signal.
Ordering Information and Content Guide appear at end of
datasheet.
ams Datasheet
[v1-02] 2014-Nov-06
Page 1
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1 page  
AS8506C − Pin Assignment
Figure 4:
Pin Description
Pin Number
1
2
3
4
5
6
7
8
9
10
11
12
Pin Name
TSECH
TSECL
VCELL7
VCELL6
VCELL5
VCELL4
VCELL3
VCELL2
VCELL1
C-GND
NC
VREF_IN
13 GND
14 TRIG_IN
15 CLK_IN
16 CVT_NOK_OUT
17 BD_OUT
18 FD_OUT
Pin Type
Description
Flyback converter transformer secondary high side
Flyback converter transformer secondary low side
Battery cell 7 high level pin
Analog input /
output
Battery cell 6 high level pin
Battery cell 5 high level pin
Battery cell 4 high level pin
Battery cell 3 high level pin
Battery cell 2 high level pin
Battery cell 1 high level pin
Power supply
input
Battery cell 1 low level pin
Not connected
Analog input / Cell voltage reference value (cell target voltage of
output
battery)
Power supply
input
Ground to the IC
Digital input
This pin triggers the cell balancing in the device.
Short pulse is for receiving status and continuous
‘High’ for cell balancing. It also acts as a data line
during 3-wire communication.
Clock input pin in the Slave device. This pin also acts
as a clock during 3-wire communication. Scan clock
in scan mode.
This pin alerts when the cell voltage or the
device/cell temperature is not within limits. During
3-wire communication, the CRC error is indicated on
this pin. The internal device cell voltage or
temperature status is ORed with CVT_NOK_IN on
this pin.
Digital output
The ‘device internal balance done’ and ‘balance done
from above device’ are ANDed on this pin. This pin in
Master device indicates the complete system
balance done. During address allocation process,
this pin will be ‘High’ if BD_IN is ‘High’.
Flyback converter gate/opto coupler drive (pad is
push-pull type) can drive up to 12mA.
ams Datasheet
[v1-02] 2014-Nov-06
Page 5
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5 Page 
AS8506C − Electrical Characteristics
Electrical Characteristics
Figure 7:
Device Level Specifications
Device Level Specifications
-40°C < Tj < 115°C.
Symbol
Parameter
Min Typ Max Unit
Note
Vcell_in
Cell Input voltage
measurement
1.8
4.5 V
ADC/DAC
ADC/DAC Reference
0 hour, specification
±7
±15
mV
does not include solder
stress / board stress
effects
DAC_error
Error of the DAC
0.1% error because of
2 mV the DAC/Guaranteed by
design
Com_off
Error because of the
comparator resolution
1
mV Guaranteed by design
Sign_path_accuracy Signal path accuracy
Typical value is from the
lab evaluation data.
Maximum value is from
±5
±15
mV
the test data. 0 hour
accuracy, specification
does not include solder
stress / board stress
effects.
TINITIALIZATION
Initialization time
After Initialization, the
50
ms
system will go to sleep
mode and waits for
wake signal.
T WAKE-UP
Wake up time from the
Wake signal to system
wait mode
After wake signal,
device enters into wait
mode and stays for two
75 ms seconds for TRIG_IN
signal, if no TRIG_IN
event occurs, device
goes to sleep mode.
Tmeas
Cell voltage and
Temperature
measurement time
16 ms At10KHz clock time
Tspi3_read5k
Tspi3_read20k
Tspi3_read40k
SPI3 read time for
single channel
measurement
13.6 At 5KHz clock time
3.4 ms At 20KHz clock time
1.7 At 40KHz clock time
ams Datasheet
[v1-02] 2014-Nov-06
Page 11
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| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet AS8506C.PDF ] | |
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