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PDF CPC1777 Data sheet ( Hoja de datos )
| Número de pieza | CPC1777 | |
| Descripción | DC Power Relay | |
| Fabricantes | Clare | |
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Hay una vista previa y un enlace de descarga de CPC1777 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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CPC1777
i4-PAC™ DC Power Relay
Parameter
Blocking Voltage
Load Current, TA=25ºC
With 5°C/W Heat Sink
No Heat Sink
On-resistance
RθJC
Rating
600
4.6
1.5
0.5
0.35
Units
VP
ADC
Ω
ºC/W
Features
• 100% Solid State
• Compact i4-PAC Power Package
• Low Thermal Resistance (0.35°C/W)
• 4.6ADC Load Current with 5°C/W Heat Sink
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• 2500Vrms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (gas, oil, electric and water)
• Transportation Equipment
• Aerospace/Defense
Pin Configuration
Description
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new
family of High Power Solid State Relays. As part of
this new family, the CPC1777 single pole normally
open (1-Form-A) DC Solid State Relay employs
optically coupled MOSFET technology to provide
2500Vrms of input to output isolation.
The output is constructed with an efficient MOSFET
switch and photovoltaic die that uses Clare’s patented
OptoMOS architecture while the input GaAlAs
infrared LED provides the optically coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique i4-PAC package pioneered by IXYS
allows solid state relays to achieve the highest load
current and power ratings. This package features
an IXYS unique process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500Vrms isolation but also
very low thermal resistance (0.35°C/W).
Approvals
• UL recognized component: File # E69938
• Certified to UL 508
Ordering Information
Part Number Description
CPC1777J
i4-PAC (25 per tube)
Switching Characteristics of
Normally Open (Form A) Devices
12
+-
34
-+
RoHS
2002/95/EC
e3
DS-CPC1777-R02
CONTROL
ILOAD
+90%
10%+
TON TOFF
www.clare.com
1
1 page  
CPC1777
PERFORMANCE DATA*
CPC1777
Typical Turn-Off vs. LED Forward Current
(IL=1ADC)
0.17
0.16
0.15
0.14
0.13
0.12
0.11
0.10
0.09
0.08
0 5 10 15 20 25 30 35 40 45 50
LED Forward Current (mA)
CPC1777
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=10mA)
2.5
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
-1.05 -0.70 -0.35 0 0.35 0.70 1.05
Load Voltage (V)
CPC1777
Typical On-Resistance vs. Temperature
(IL=max rated)
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-40 -20
0
20 40 60
80 100
Temperature (ºC)
CPC1777
Typical IF for Switch Operation vs. Temperature
(IL=1ADC)
20
18
16
14
12
10
8
6
4
2
0
-40 -20
0
20 40 60
80 100
Temperature (ºC)
CPC1777
Energy Rating Curve
(Free Air, No Heat Sink)
24
20
16
12
8
4
0
10µs 100µs 1ms 10ms 100ms 1s
Time
10s 100s
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R02 www.clare.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CPC1777.PDF ] | |
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