|
|
PDF GP2400ESM12 Data sheet ( Hoja de datos )
| Número de pieza | GP2400ESM12 | |
| Descripción | Powerline N-Channel Single Switch IGBT Module Preliminary Information | |
| Fabricantes | Dynex Semiconductor | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de GP2400ESM12 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
|
No Preview Available !
GP2400ESM12
GP2400ESM12
Powerline N-Channel Single Switch IGBT Module
Preliminary Information
DS5360-1.1 May 2000
The GP2400ESM12 is a single switch 1200V, robust n
channel enhancement mode insulated gate bipolar
transistor (IGBT) module. Designed for low power loss, the
module is suitable for a variety of high voltage applications
in motor drives and power conversion. The high
impedance gate simplifies gate drive considerations
enabling operation directly from low power control
circuitry.
VCES
VCE(sat)
IC
IC(PK)
KEY PARAMETERS
1200V
(typ) 2.7V
(max)
2400A
(max)
4800A
Fast switching times allow high frequency operation
making the device suitable for the latest drive designs
employing pwm and high frequency switching. The IGBT
has a wide reverse bias safe operating area (RBSOA) for
ultimate reliability in demanding applications.
These modules incorporate electrically isolated base
plates and low inductance construction enabling circuit
designers to optimise circuit layouts and utilise grounded
heat sinks for safety.
The powerline range of high power modules includes
dual and single switch configurations with a range of
current and voltage capabilities to match customer system
demands.
This device is optimised for traction drives and other
applications requiring high thermal cycling capability.
Outline type code: E
FEATURES
s n - Channel Enhancement Mode
s Non Punch Through Silicon
s High Gate Input Impedance
s Optimised For High Power High Frequency Operation
s Isolated MMC Base with AlN
s 1200V Rating
s 2400A Per Module
APPLICATIONS
s High Power Switching
s Motor Control
s Inverters
s Traction Drives
(See package details for further information)
Fig. 1 Electrical connections - (not to scale)
Aux C
External connection
C1 C2
C3
G
Aux E
E1 E2
External connection
E3
Fig.2 Single switch circuit diagram
ORDERING INFORMATION
Order As: GP2400ESM12
Note: When ordering, please use the whole part number.
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
1/12
1 page  
SWITCHING DEFINITIONS
t4 + 5µs
∫Eon = Vce.Icdt
t1
td(on) = t2 - t1
tr = t3 - t2
+15V
10%
0V
-15V
90%
10%
t1 t2
t3
t4
Fig.3 Definition of turn-on switching times
GP2400ESM12
Vge
IC
Vce
t7 + 5µs
∫Eoff = Vce.Icdt
t5
td(off) = t6 - t5
tf = t7 - t6
+15V
90%
0V
-15V
90%
10%
Vge
IC
Vce
t5 t6 t7
Fig.4 Definition of turn-off switching times
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
5/12
5 Page 
ASSOCIATED PUBLICATIONS
Title
Electrostatic handling precautions
An introduction to IGBTs
IGBT ratings and characteristics
Heatsink requirements for IGBT modules
Calculating the junction temperature of power semiconductors
Gate drive considerations to maximise IGBT efficiency
Parallel operation of IGBTs – punch through vs non-punch through characteristics
Guidance notes for formulating technical enquiries
Principle of rating parallel connected IGBT modules
Short circuit withstand capability in IGBTs
Driving high power IGBTs with concept gate drivers
Application Note
Number
AN4502
AN4503
AN4504
AN4505
AN4506
AN4507
AN4508
AN4869
AN5000
AN5167
AN5190
GP2400ESM12
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than a basic semiconductor
switch, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
11/12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet GP2400ESM12.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| GP2400ESM12 | Powerline N-Channel Single Switch IGBT Module Preliminary Information | Dynex Semiconductor |
| GP2400ESM18 | Hi-Reliability Single Switch IGBT Module | Dynex Semiconductor |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |