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PDF AMMC-6333 Data sheet ( Hoja de datos )
| Número de pieza | AMMC-6333 | |
| Descripción | 18 - 33 GHz 0.2 W Driver Amplifier | |
| Fabricantes | AVAGO | |
| Logotipo |  |
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AMMC-6333
18 – 33 GHz 0.2 W Driver Amplifier
Data Sheet
Chip Size: 2500 x 1300 Pm (100 x 51 mils)
Chip Size Tolerance: ± 10 Pm (±0.4 mils)
Chip Thickness: 100 ± 10 Pm (4 ± 0.4 mils)
Pad Dimensions: 100 x 100 Pm (4 x 4 ± 0.4 mils)
Description
The AMMC-6333 is a broadband 0.2 W MMIC driver
amplifier designed for use in transmitters operating in
various frequency bands from 18 GHz to 33 GHz. This
small, easy to use device provides over 23 dBm of output
power (P-1dB) and more than 20 dB of gain at 25 GHz. It
was optimized for linear operation with an output power
at the third order intercept point (OIP3) of 30dBm. The
AMMC-6333 features a temperature compensated RF
power detection circuit that enables power detection sen-
sitivity of 0.3 V/W at 25GHz. It is fabricated using Avago
Technologies unique 0.25Pm E-mode PHEMT technol-
ogy which eliminates the need for negative gate biasing
voltage.
Features
x Frequency range: 18 to 33 GHz
x Small signal gain: 20 dB
x P-1dB : 23dBm
x Return Loss (In/Out): -10 dB
Applications
x Microwave Radio systems
x Satellite VSAT, Up/Down Link
x LMDS & Pt-Pt mmW Long Haul
x Broadband Wireless Access (including 802.16 and
802.20 WiMax)
x WLL and MMDS loops
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model (Class A) = 90 V
ESD Human Body Model (Class 1A) = 300 V
Refer to Avago Application Note A004R:
Electrostatic Discharge, Damage and Control.
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Typical Performance
(TA = 25°C, Vd =5 V, IdQ = 230 mA, Zin = Zout = 50 :)
(Data obtained from a test fixture with 3.5 mm connectors. Effects of the test fixture – losses and mismatch – have not
been removed from the data)
40 0 0
35 S21[dB]
S11[dB]
30
S12[dB]
-20
-5
S22[dB]
25
20 -40 -10
15
10 -60 -15
5
0 -80
10 15 20 25 30 35 40
Frequency [GHz]
-20
10 15 20 25 30 35 40
Frequency [GHz]
Figure 1. Gain and Reverse Isolation vs Frequency
Figure 2. Return Loss vs Frequency
30
25
20
15
10
5
16
18 20
P-1
PAE
22 24 26 28 30 32 34
Frequency [GHz]
Figure 3. P-1dB and PAE vs Frequency
20
10
0
-10
-20
-30
-40
-50
-60
-70
15
SCL=20[dBm]
SCL=10dBm]
SCL=5[dBm]
17 19 21 23 25 27 29 31 33 35
Frequency [GHz]
Figure 4. Typical IMD3 vs Frequency (SCL = Single Carrier level)
10
8
6
4
2
0
16 18 20 22 24 26 28 30 32 34
Frequency [GHz]
Figure 5. Typical Noise Figure vs Frequency
30
Pout(dBm)
25 PAE[%]
Ids[mA]
20
500
400
15
10 300
5
0 -25 -20 -15 -10 -5
Pin [dBm]
0
5 200
Figure 6. Output Power, PAE, and Drain Current vs Input Power at 30GHz
5
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Assembly Techniques
The chip should be attached directly to the ground plane
using electrically conductive epoxy (Note 1). For conduc-
tive epoxy, the amount should be just enough to provide
a thin fillet around the bottom perimeter of the die. The
ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment. Caution
should be taken to not exceed the Absolute Maximum
Rating for assembly temperature and time.
Thermo-sonic wedge bonding is the preferred method
for wire attachment to the bond pads. The RF connections
should be kept as short as possible to minimize induc-
tance. Double-bonding with 0.7mil gold wire is recom-
mended. The recommended wire bonding stage temper-
ature is 150±2°C.
The chip is 100μm thick and should be handled with care.
This chip has exposed air bridges on the top surface.
Handle at the edges or with a custom collet, (do not pick
up die with vacuum on die center).
This MMIC is static sensitive and ESD handling precau-
tions should be taken.
0 120
540 935
GND VG
VD
1300
2400 2500
DET_O
1300
RF_IN
650
0
GND VD
0 120
945
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
Figure 19. Die dimensions
Ordering Information:
AMMC-6333-W10 = 10 devices per tray
AMMC-6333-W50 = 50 devices per tray
650
RF_OUT
DET_R
2400 2500
0
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1446EN - November 12, 2009
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