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MP23AB02B
MEMS audio sensor
high-performance analog bottom-port microphone
Datasheet - production data
RHLGA metal cap 3-lead
3.35 x 2.5 x 0.98 mm
Features
Single supply voltage operation
Low power consumption
Omnidirectional sensitivity
High signal-to-noise ratio
High bandwidth
Package compliant with reflow soldering
Description
The MP23AB02B is a compact, low-power
microphone built with a low-profile sensing
element.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process to
produce audio sensors.
The MP23AB02B has an acoustic overload point
of 125 dBSPL with a 64 dB signal-to-noise ratio.
The MP23AB02B is available in a package
compliant with reflow soldering and is guaranteed
to operate over an extended temperature range
from -40 °C to +85 °C.
Order code
MP23AB02B
MP23AB02BTR
Table 1. Device summary
Temperature range (C)
Package
-40 to +85
(3.35 x 2.5 x 0.98) mm
-40 to +85
(3.35 x 2.5 x 0.98) mm
Packing
Tray
Tape and reel
September 2014
This is information on a product in full production.
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MP23AB02B
4 Application recommendations
Application recommendations
Figure 3. MP23AB02B electrical connections and external component values
Vdd
C2 C3
Typical values:
C1 > 1µF
C2 ~ 1000pF
C3 = 1µF
Pin.2
MP23AB02B
C1
(Vout )
Pin.1
Pin.3
(Ground)
Vref
R1
R2
-
+
R
Vref
Ext. gain = (R1+R2) / R1
GAMS1103141450SG
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MP23AB02B
7 Revision history
Revision history
.
Date
21-Mar-2014
16-Jun-2014
22-Sep-2014
Table 8. Document revision history
Revision
Changes
1 Initial release.
2 Updated Figure 5 on page 9.
3 Updated acoustic overload point in Description.
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