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PDF HBC123JS6R Data sheet ( Hoja de datos )
| Número de pieza | HBC123JS6R | |
| Descripción | Dual NPN Digital Transistors | |
| Fabricantes | CYStech Electronics | |
| Logotipo |  |
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CYStech Electronics Corp.
Dual NPN Digital Transistors
HBC123JS6R
Spec. No. : C360S6R
Issued Date : 2009.04.30
Revised Date : 2011.02.22
Page No. : 1/5
Features
• Built-in bias resistors enable the configuration of an inverter circuit without connecting external input
resistors (see equivalent circuit).
• The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing of the
input. They also have the advantage of almost completely eliminating parasitic effects.
• Only the on/off conditions need to be set for operation, making device design easy.
• Two DTC123J chips in a SOT-363 package.
• Mounting by SOT-323 automatic mounting machines is possible.
• Mounting cost and area can be cut in half.
• Transistor elements are independent, eliminating interference.
• Complements the HBA123JS6R.
• Pb-free package.
Equivalent Circuit
HBC123JS6R
RBE2
RB2
TR1
RB1
RBE1
TR2
RB1=2.2kΩ , RB2=2.2 kΩ
RBE1=47kΩ , RBE2=47 kΩ
Outline
SOT-363R
HBC123JS6R
CYStek Product Specification
http://www.Datasheet4U.com
1 page  
CYStech Electronics Corp.
SOT-363 Dimension
Spec. No. : C360S6R
Issued Date : 2009.04.30
Revised Date : 2011.02.22
Page No. : 5/5
Marking:
7M
Device
Code
Date Code:
Year + Month
Year : 6→2006,
7→2007,…, etc
Month : 1→Jan
2→Feb, …, 9→
Sep, A→Oct, B
→Nov, C→Dec
6-Lead SOT-363R Plastic
Surface Mounted Package
CYStek Package Code: S6R
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
Pin 6. Collector1 (C1)
DIM
Millimeters
Min. Max.
Inches
Min. Max.
DIM
Millimeters
Min. Max.
Inches
Min. Max.
A 0.900 1.100 0.035 0.043 E1 2.150 2.450 0.085 0.096
A1 0.000 0.100 0.000 0.004
e
0.650 TYP
0.026 TYP
A2 0.900 1.000 0.035 0.039 e1 1.200 1.400 0.047 0.055
b 0.150 0.350 0.006 0.014 L
0.525 REF
0.021 REF
c 0.080 0.150 0.003 0.006 L1 0.260 0.460 0.010 0.018
D 2.000 2.200 0.079 0.087
θ
0°
8°
0°
8°
E 1.150 1.350 0.045 0.053
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Pure tin plated.
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBC123JS6R
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet HBC123JS6R.PDF ] | |
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